Abstract

We present and numerically analyze two schemes for efficient, large-bandwidth, and fabrication-tolerant optical coupling of bonded III-V membrane active components to an underlying nanophotonic waveguide circuit in silicon-on-insulator (SOI). Coupling of active membrane components to passive waveguides enables the integration of ultracompact passive waveguide circuits and active optoelectronic devices.

© 2005 IEEE

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  1. P. Dumon, W. Bogaerts, V. Wiaux, J. Wouters, S. Beckx, J. Van Campenhout, D. Taillaert, B. Luyssaert, P. Bienstman, D. Van Thourhout and R. Baets, "Low-loss SOI photonic wires and ring resonators fabricated with deep UV lithography", IEEE Photon. Technol. Lett., vol. 16, no. 5, pp. 1328-1330, May 2004.
  2. K. K. Lee, D. R. Lim and L. C. Kimerling, "Fabrication of ultralow-loss Si/SiO2 waveguides by roughness reduction", Opt. Lett., vol. 26, no. 23, pp. 1888-1890, Dec. 2001.
  3. W. Bogaerts, V. Wiaux, D. Taillaert, S. Beckx, B. Luyssaert, P. Bienstman and R. Baets, "Fabrication of photonic crystals in silicon-on-insulator using 248-nm deep UV lithography", IEEE J. Sel. Topics Quantum Electron., vol. 8, no. 4, pp. 928-934, Jul.-Aug. 2002.

  4. H. C. Lin, W. H. Wang, K. C. Hsieh and K. Y. Cheng, "Metallic wafer bonding for the fabrication of long-wavelength vertical-cavity surface-emitting lasers", J. Appl. Phys., vol. 92, no. 7, pp. 4132-4134, May 2002.
  5. C. Monat, C. Seassal, X. Letartre, P. Viktorovitch, P. Regreny, M. Gendry, P. Rojo-Romeo, G. Hollinger, E. Jalaguier, S. Pocas and B. Aspar, "InP 2D photonic crystal microlasers on silicon wafer: Room temperature operation at 1.55 um", Electron. Lett., vol. 37, no. 12, pp. 764-765, Jun. 2001.
  6. D. Taillaert, H. Chong, P. Borel, L. Frandsen, R. De La Rue and R. Baets, "A compact two-dimensional grating coupler used as a polarization splitter", IEEE Photon. Technol. Lett., vol. 15, no. 9, pp. 1249-1251, Sep. 2003.
  7. H. C. Lin, K. L. Chang, G. W. Pickrell, K. C. Hsieh and K. Y. Cheng, "Low temperature wafer bonding by spin on glass", J. Vac. Sci. Technol. B, vol. 20, no. 2, pp. 752-754, Mar./Apr. 2002.
  8. F. Niklaus, P. Enoksson, E. Kälvesten and G. Stemme, "Low-temperature full wafer adhesive bonding", J. Micromech. Microeng., vol. 11, no. 2, pp. 100-107, Mar. 2001.
  9. P. Abraham, "Study of temperature effects on loss mechanisms in 1.55 um laser diodes with InGaP electron stopper layer", Semicond. Sci. Technol., vol. 14, no. 5, pp. 419-424, 1999.

  10. H.-F. Kuo, S.-Y. Cho, J. Hall and N. M. Jokerst, "InP/InGaAsP MQW thin film edge emitting lasers for embedded waveguide chip to chip optical interconnections", in Proc. Lasers and Electro-Optics Society (LEOS) Conf., vol. 1, Tucson, AZ, 2003, pp. 63-64.
  11. T. Shoji, T. Tsuchizawa, T. Watanabe, K. Yamada and H. Morita, "Spot-size converter for low-loss coupling between 0.3 um square Si wire waveguides and single mode fibers", in Proc. 15th Annu. Meeting IEEE Lasers and Electro-Optics Society, vol. 1, Glasgow, U.K., 2002, pp. 289-290.

Other (13)

P. Dumon, W. Bogaerts, V. Wiaux, J. Wouters, S. Beckx, J. Van Campenhout, D. Taillaert, B. Luyssaert, P. Bienstman, D. Van Thourhout and R. Baets, "Low-loss SOI photonic wires and ring resonators fabricated with deep UV lithography", IEEE Photon. Technol. Lett., vol. 16, no. 5, pp. 1328-1330, May 2004.

K. K. Lee, D. R. Lim and L. C. Kimerling, "Fabrication of ultralow-loss Si/SiO2 waveguides by roughness reduction", Opt. Lett., vol. 26, no. 23, pp. 1888-1890, Dec. 2001.

W. Bogaerts, V. Wiaux, D. Taillaert, S. Beckx, B. Luyssaert, P. Bienstman and R. Baets, "Fabrication of photonic crystals in silicon-on-insulator using 248-nm deep UV lithography", IEEE J. Sel. Topics Quantum Electron., vol. 8, no. 4, pp. 928-934, Jul.-Aug. 2002.


H. C. Lin, W. H. Wang, K. C. Hsieh and K. Y. Cheng, "Metallic wafer bonding for the fabrication of long-wavelength vertical-cavity surface-emitting lasers", J. Appl. Phys., vol. 92, no. 7, pp. 4132-4134, May 2002.

C. Monat, C. Seassal, X. Letartre, P. Viktorovitch, P. Regreny, M. Gendry, P. Rojo-Romeo, G. Hollinger, E. Jalaguier, S. Pocas and B. Aspar, "InP 2D photonic crystal microlasers on silicon wafer: Room temperature operation at 1.55 um", Electron. Lett., vol. 37, no. 12, pp. 764-765, Jun. 2001.

D. Taillaert, H. Chong, P. Borel, L. Frandsen, R. De La Rue and R. Baets, "A compact two-dimensional grating coupler used as a polarization splitter", IEEE Photon. Technol. Lett., vol. 15, no. 9, pp. 1249-1251, Sep. 2003.

H. C. Lin, K. L. Chang, G. W. Pickrell, K. C. Hsieh and K. Y. Cheng, "Low temperature wafer bonding by spin on glass", J. Vac. Sci. Technol. B, vol. 20, no. 2, pp. 752-754, Mar./Apr. 2002.

F. Niklaus, P. Enoksson, E. Kälvesten and G. Stemme, "Low-temperature full wafer adhesive bonding", J. Micromech. Microeng., vol. 11, no. 2, pp. 100-107, Mar. 2001.

P. Abraham, "Study of temperature effects on loss mechanisms in 1.55 um laser diodes with InGaP electron stopper layer", Semicond. Sci. Technol., vol. 14, no. 5, pp. 419-424, 1999.


H.-F. Kuo, S.-Y. Cho, J. Hall and N. M. Jokerst, "InP/InGaAsP MQW thin film edge emitting lasers for embedded waveguide chip to chip optical interconnections", in Proc. Lasers and Electro-Optics Society (LEOS) Conf., vol. 1, Tucson, AZ, 2003, pp. 63-64.

T. Shoji, T. Tsuchizawa, T. Watanabe, K. Yamada and H. Morita, "Spot-size converter for low-loss coupling between 0.3 um square Si wire waveguides and single mode fibers", in Proc. 15th Annu. Meeting IEEE Lasers and Electro-Optics Society, vol. 1, Glasgow, U.K., 2002, pp. 289-290.

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