Abstract

In this paper, a new architecture for a chip-to-chip optical interconnection system is demonstrated that can be applied in a waveguide-embedded optical printed circuit board (PCB). The experiment used 45°-ended optical connection rods as a medium to guide light paths perpendicularly between vertical-cavity surface-emitting lasers (VCSELs), or photodiodes (PDs) and a waveguide. A polymer film of multimode waveguides with cores of 100 × 65 µm was sandwiched between conventional PCBs. Via holes were made with a diameter of about 140 µm by CO2-laser drilling through the PCB and the waveguide. Optical connection rods were made of a multimode silica fiber ribbon segment with a core diameter of 62.5 and 100 µm. One end of the fiber segment was cut 45° and the other end 90° by a mechanical polishing method. These fiber rods were inserted into the via holes formed in the PCB, adjusting the insertion depth to locate the 45° end of rods near the waveguide cores. From this interconnection system, a total coupling efficiency of about -8 dB was achieved between VCSELs and PDs through connection rods and a 2.5 Gb/s × 12-ch data link demonstrated through waveguides with a channel pitch of 250 µm in the optical PCB.

© 2004 IEEE

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  1. N. McArdle, M. Naruse and M. Ishikawa, "Optoelectronic parallel computing using optically interconnected pipelined processing arrays", IEEE J. Select. Topics Quantum Electron., vol. 5, pp. 250-260, Mar. 1999.
  2. Y. Ishii, S. Koike, Y. Arai and Y. Ando, "SMT-compatible optical-I/O chip packaging for chip-level optical interconnects", in Proc. IEEE Electronic Components Technology Conf., 2001, pp. 870-875.
  3. D. Krabe and W. Scheel, "Optical interconnection by hot embossing for module and PCB technology-The EOCB approach", in Proc. IEEE Electronic Components Technology Conf., 1999, pp. 1164-1166.
  4. R. T. Chen, L. Lin, C. Choi, Y. J. Liu, B. Bihari, L. Wu, S. Tang, R. Wickman, B. Picor, M. K. Hibbs-Brenner, J. Bristow and Y. S. Liu, "Fully embedded board-level guided-wave optoelectronic interconnects", Proc. IEEE, vol. 88, pp. 780-793, June 2000.
  5. S. Lehmacher, A. Neyer and F. Mederer, "Polymer optical waveguides integrated in printed circuit boards", in Proc. 27th Eur. Conf. Optical Communication (ECOC'01) , vol. 3, 2001, pp. 302-303.
  6. H. Schroder, J. Bauer, F. Ebling and W. Scheel, "Polymer optical interconnects for PCB polymers and adhesives in microelectronics and photonics, 2001", in Proc. 1st Int. IEEE Conf., Oct. 2001, pp. 337-343.
  7. M. Kicherer, F. Mederer, R. Jager, H. Unold, K. J. Ebeling, S. Lehmacher, A. Neyer and E. Griese, "Data transmission at 3 Gbit/s over intraboard polymer waveguides with GaAs VCSELs", in Proc. 26th Eur. Conf. Optical Communication (ECOC'01), vol. 3, 2000, pp. 289-290.
  8. E. Griese, "A high-performance hybrid electrical-optical interconnection technology for high-speed electronic systems", IEEE Trans. Adv. Packag., vol. 24, pp. 373-383, Aug. 2001 .
  9. B. S. Rho, J. Y. Eo, S. K. Kang, H.-H. Park, Y. W. Kim, Y. S. Joe and D. J. Yang, "New architecture of optical interconnection using 45° -ended connection rods in waveguide-embedded printed circuit boards", in Proc. SPIE , vol. 4997, 2003, pp. 71-78.
  10. H. S. Cho, K. M. Chu, S. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim and H.-H. Park, "Compact packaging of optical and electronic components for on-board optical interconnects", IEEE Trans. Adv. Packag., to be published.
  11. E. M. Strzelecka, D. A. Louderback, K. Bertilsson, B. J. Thibeault, M. Mondry and L. A. Coldren, "Free-space optical link realized with microlensed component", in Proc. Electronic Components Technology Conf., 1997, pp. 376-381.

Other

N. McArdle, M. Naruse and M. Ishikawa, "Optoelectronic parallel computing using optically interconnected pipelined processing arrays", IEEE J. Select. Topics Quantum Electron., vol. 5, pp. 250-260, Mar. 1999.

Y. Ishii, S. Koike, Y. Arai and Y. Ando, "SMT-compatible optical-I/O chip packaging for chip-level optical interconnects", in Proc. IEEE Electronic Components Technology Conf., 2001, pp. 870-875.

D. Krabe and W. Scheel, "Optical interconnection by hot embossing for module and PCB technology-The EOCB approach", in Proc. IEEE Electronic Components Technology Conf., 1999, pp. 1164-1166.

R. T. Chen, L. Lin, C. Choi, Y. J. Liu, B. Bihari, L. Wu, S. Tang, R. Wickman, B. Picor, M. K. Hibbs-Brenner, J. Bristow and Y. S. Liu, "Fully embedded board-level guided-wave optoelectronic interconnects", Proc. IEEE, vol. 88, pp. 780-793, June 2000.

S. Lehmacher, A. Neyer and F. Mederer, "Polymer optical waveguides integrated in printed circuit boards", in Proc. 27th Eur. Conf. Optical Communication (ECOC'01) , vol. 3, 2001, pp. 302-303.

H. Schroder, J. Bauer, F. Ebling and W. Scheel, "Polymer optical interconnects for PCB polymers and adhesives in microelectronics and photonics, 2001", in Proc. 1st Int. IEEE Conf., Oct. 2001, pp. 337-343.

M. Kicherer, F. Mederer, R. Jager, H. Unold, K. J. Ebeling, S. Lehmacher, A. Neyer and E. Griese, "Data transmission at 3 Gbit/s over intraboard polymer waveguides with GaAs VCSELs", in Proc. 26th Eur. Conf. Optical Communication (ECOC'01), vol. 3, 2000, pp. 289-290.

E. Griese, "A high-performance hybrid electrical-optical interconnection technology for high-speed electronic systems", IEEE Trans. Adv. Packag., vol. 24, pp. 373-383, Aug. 2001 .

B. S. Rho, J. Y. Eo, S. K. Kang, H.-H. Park, Y. W. Kim, Y. S. Joe and D. J. Yang, "New architecture of optical interconnection using 45° -ended connection rods in waveguide-embedded printed circuit boards", in Proc. SPIE , vol. 4997, 2003, pp. 71-78.

H. S. Cho, K. M. Chu, S. Kang, S. H. Hwang, B. S. Rho, W. H. Kim, J.-S. Kim, J.-J. Kim and H.-H. Park, "Compact packaging of optical and electronic components for on-board optical interconnects", IEEE Trans. Adv. Packag., to be published.

E. M. Strzelecka, D. A. Louderback, K. Bertilsson, B. J. Thibeault, M. Mondry and L. A. Coldren, "Free-space optical link realized with microlensed component", in Proc. Electronic Components Technology Conf., 1997, pp. 376-381.

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