Abstract

Intimate integration of photonics with electronics is regarded as the key to further improvement in bandwidth, speed and energy efficiency of information transport systems. Here, a method based on wafer-scale polymer bonding is reviewed which is compatible with foundry-sourced high-performance InP photonics and BiCMOS electronics. We address challenges with respect to circuit architecture, co-simulation framework and interconnect technology and introduce our approach that can lead to broadband high-density interconnects between photonics and electronics. Recent proof-of-concept work utilizing DC-coupled driver connections to modulators, which significantly reduces the interconnect complexity, is summarized. Furthermore, co-simulation concepts based on equivalent circuit models are discussed with emphasis on the importance of impedance matching between driver and modulator. Finally, realizations of broadband interconnects and functional photonic building blocks after wafer bonding are highlighted to demonstrate the potential of this wafer-scale co-integration method.

Hybrid integration of silicon photonics circuits and InP lasers by photonic wire bonding

Muhammad Rodlin Billah, Matthias Blaicher, Tobias Hoose, Philipp-Immanuel Dietrich, Pablo Marin-Palomo, Nicole Lindenmann, Aleksandar Nesic, Andreas Hofmann, Ute Troppenz, Martin Moehrle, Sebastian Randel, Wolfgang Freude, and Christian Koos
Optica 5(7) 876-883 (2018)

16-channel photonic–electric co-designed silicon transmitter with ultra-low power consumption

Jingbo Shi, Ming Jin, Tao Yang, Haowen Shu, Fenghe Yang, Han Liu, Yuansheng Tao, Jiangrui Deng, Ruixuan Chen, Changhao Han, Nan Qi, and Xingjun Wang
Photon. Res. 11(2) 143-149 (2023)

Flip-chip integrated silicon Mach-Zehnder modulator with a 28nm fully depleted silicon-on-insulator CMOS driver

Zheng Yong, Stefan Shopov, Jared C. Mikkelsen, Robert Mallard, Jason C.C. Mak, Sorin P. Voinigescu, and Joyce K. S. Poon
Opt. Express 25(6) 6112-6121 (2017)

Toward photonic–electronic convergence based on heterogeneous platform of merging lithium niobate into silicon

Jing Wang, Haoru Yang, Nina Xiong, Muyan Zhang, Na Qian, Sicheng Yi, Shaofu Xu, and Weiwen Zou
J. Opt. Soc. Am. B 40(6) 1573-1590 (2023)

Silicon electronic–photonic integrated 25  Gb/s ring modulator transmitter with a built-in temperature controller

Minkyu Kim, Min-Hyeong Kim, Youngkwan Jo, Hyun-Kyu Kim, Stefan Lischke, Christian Mai, Lars Zimmermann, and Woo-Young Choi
Photon. Res. 9(4) 507-513 (2021)