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B. Song, L. Megalini, S. Dwivedi, S. Ristic, and J. Klamkin, “High-thermal performance 3D hybrid silicon lasers,” IEEE Photon. Technol. Lett., vol. 29, no. 14, pp. 1143–1146, 2017.
B. Corbett, R. Loi, W. Zhou, D. Liu, and Z. Ma, “Transfer print techniques for heterogeneous integration of photonic components,” Prog. Quantum Electron., vol. 52, pp. 1–17, 2017.
D. Thomsonet al., “Roadmap on silicon photonics,” J. Opt., vol. 18, 2016, Paper no. 073003.
Z. H. Quan, J. Justice, M. B. Mooney, M. A. Gubbins, P. J. Parbrook, and B. Corbett, “Thermal modelling of transfer-bonded thin-film gallium arsenide laser diode,” IET Optoelectron., vol. 10, pp. 51–56, 2016.
R. Loiet al., “Transfer printing of AlGaInAs/InP etched facet lasers to Si substrates,” IEEE Photon. J., vol. 8, no. 6, 2016, Paper no. 1504810.
J. Yoon, S. M. Lee, D. Kang, M. A. Meitl, C. A. Bower, and J. Rogers, “Heterogeneously integrated optoelectronic devices enabled by microtransfer printing,” Adv. Opt. Mater., vol. 3, no. 10, pp. 1313–1335, 2015.
S. Cheung, Y. Kawakita, K. Shang, and S. J. B. Yoo, “Theory and design optimization of energy-efficient hydrophobic wafer-bonded III-V/Si hybrid semiconductor optical amplifiers,” J. Lightw. Technol., vol. 31, no. 24, pp. 4057–4066, 2013.
A. Carlson, A. M. Bowen, Y. Huang, R. G. Nuzzo, and J. A. Rogers, “Transfer printing techniques for materials assembly and micro/nanodevice fabrication,” Adv. Mater., vol. 24, pp. 5284–5318, 2012.
J. Justice, C. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer-scale integration of group III-V lasers on silicon using transfer printing of epitaxial layers,” Nature Photon., vol. 6, no. 9, pp. 610–614, 2012.
H. Yanget al., “Transfer printing stacked nanomembrane lasers on silicon,” Nature Photon., vol. 6, pp. 617–622, 2012.
M. Lamponiet al., “Low-threshold heterogeneously integrated InP/SOI laser with a double adiabatic taper coupler,” IEEE Photon. Technol. Lett., vol. 24, no. 1, pp. 76–78, 2012.
M. N. Sysaket al., “Hybrid silicon laser technology: A thermal perspective,” IEEE J. Sel. Topics Quantum Electron., vol. 17, no. 6, pp. 1490–1498, 2011.
D. Liang and J. E. Bowers, “Recent progress in lasers on silicon,” Nature Photon., vol. 4, pp. 511–517, 2010.
G. Roelkenset al., “III-V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photon. Rev., vol. 4, pp. 1–29, 2010.
A. W. Fanget al., “Integrated AlGaInAs-silicon evanescent race track laser and photodetector,” Opt. Express, vol. 5, pp. 2315–2322, 2007.
G. Roelkenset al., “III-V/Si photonics by die-to-wafer bonding,” Mater. Today, vol. 10, nos. 7/8, pp. 36–43, 2007.
S. Adachi, “Lattice thermal conductivity of group-IV and III–V semiconductor alloys,” J. Appl. Phys., vol. 102, no. 6, 2007, Paper no. 063502.
M. A. Meitlet al., “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nature Mater., vol. 5, pp. 33–38, 2006.
J. Piprek, J. K. White, and A. J. SpringThorpe, “What limits the maximum output power of long-wavelength AlGaInAs/InP laser diodes?,” IEEE J. Quantum Electron., vol. 38, no. 9, pp. 1253–1259, 2002.
J. Piprek, J. Patrick, A. Patrick, and J. E. Bowers, “Carrier non-uniformity effects on the internal efficiency of multiquantum-well lasers,” Appl. Phys. Lett., vol. 74, no. 4, pp. 489–49, 1999.
S. Adachi, “Lattice thermal resistivity of III–V compound alloys,” J. Appl. Phys., vol. 54, no. 4, pp. 1844–1848, 1983.
S. Adachi, “Lattice thermal conductivity of group-IV and III–V semiconductor alloys,” J. Appl. Phys., vol. 102, no. 6, 2007, Paper no. 063502.
S. Adachi, “Lattice thermal resistivity of III–V compound alloys,” J. Appl. Phys., vol. 54, no. 4, pp. 1844–1848, 1983.
A. Carlson, A. M. Bowen, Y. Huang, R. G. Nuzzo, and J. A. Rogers, “Transfer printing techniques for materials assembly and micro/nanodevice fabrication,” Adv. Mater., vol. 24, pp. 5284–5318, 2012.
J. Justice, C. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer-scale integration of group III-V lasers on silicon using transfer printing of epitaxial layers,” Nature Photon., vol. 6, no. 9, pp. 610–614, 2012.
J. Yoon, S. M. Lee, D. Kang, M. A. Meitl, C. A. Bower, and J. Rogers, “Heterogeneously integrated optoelectronic devices enabled by microtransfer printing,” Adv. Opt. Mater., vol. 3, no. 10, pp. 1313–1335, 2015.
D. Liang and J. E. Bowers, “Recent progress in lasers on silicon,” Nature Photon., vol. 4, pp. 511–517, 2010.
J. Piprek, J. Patrick, A. Patrick, and J. E. Bowers, “Carrier non-uniformity effects on the internal efficiency of multiquantum-well lasers,” Appl. Phys. Lett., vol. 74, no. 4, pp. 489–49, 1999.
A. Carlson, A. M. Bowen, Y. Huang, R. G. Nuzzo, and J. A. Rogers, “Transfer printing techniques for materials assembly and micro/nanodevice fabrication,” Adv. Mater., vol. 24, pp. 5284–5318, 2012.
C. Chen, T. Zhang, P. Contu, J. Klamkin, A. K. Coskun, and A. Joshi, “Sharing and placement of on-chip laser sources in silicon-photonic noCs,” in Proc. 8th IEEE/ACM Int. Symp. Netw. Chip, 2014, pp. 88–95.
S. Cheung, Y. Kawakita, K. Shang, and S. J. B. Yoo, “Theory and design optimization of energy-efficient hydrophobic wafer-bonded III-V/Si hybrid semiconductor optical amplifiers,” J. Lightw. Technol., vol. 31, no. 24, pp. 4057–4066, 2013.
C. Chen, T. Zhang, P. Contu, J. Klamkin, A. K. Coskun, and A. Joshi, “Sharing and placement of on-chip laser sources in silicon-photonic noCs,” in Proc. 8th IEEE/ACM Int. Symp. Netw. Chip, 2014, pp. 88–95.
B. Corbett, R. Loi, W. Zhou, D. Liu, and Z. Ma, “Transfer print techniques for heterogeneous integration of photonic components,” Prog. Quantum Electron., vol. 52, pp. 1–17, 2017.
Z. H. Quan, J. Justice, M. B. Mooney, M. A. Gubbins, P. J. Parbrook, and B. Corbett, “Thermal modelling of transfer-bonded thin-film gallium arsenide laser diode,” IET Optoelectron., vol. 10, pp. 51–56, 2016.
J. Justice, C. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer-scale integration of group III-V lasers on silicon using transfer printing of epitaxial layers,” Nature Photon., vol. 6, no. 9, pp. 610–614, 2012.
C. Chen, T. Zhang, P. Contu, J. Klamkin, A. K. Coskun, and A. Joshi, “Sharing and placement of on-chip laser sources in silicon-photonic noCs,” in Proc. 8th IEEE/ACM Int. Symp. Netw. Chip, 2014, pp. 88–95.
B. Song, L. Megalini, S. Dwivedi, S. Ristic, and J. Klamkin, “High-thermal performance 3D hybrid silicon lasers,” IEEE Photon. Technol. Lett., vol. 29, no. 14, pp. 1143–1146, 2017.
A. W. Fanget al., “Integrated AlGaInAs-silicon evanescent race track laser and photodetector,” Opt. Express, vol. 5, pp. 2315–2322, 2007.
D. Gomezet al., “Process capability and elastomer stamp lifetime in micro transfer printing,” in Proc. 2016 IEEE 66th Electron. Compon. Technol. Conf., Las Vegas, NV, USA, 2016, pp. 680–687.
Z. H. Quan, J. Justice, M. B. Mooney, M. A. Gubbins, P. J. Parbrook, and B. Corbett, “Thermal modelling of transfer-bonded thin-film gallium arsenide laser diode,” IET Optoelectron., vol. 10, pp. 51–56, 2016.
J. Justice, C. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer-scale integration of group III-V lasers on silicon using transfer printing of epitaxial layers,” Nature Photon., vol. 6, no. 9, pp. 610–614, 2012.
A. Carlson, A. M. Bowen, Y. Huang, R. G. Nuzzo, and J. A. Rogers, “Transfer printing techniques for materials assembly and micro/nanodevice fabrication,” Adv. Mater., vol. 24, pp. 5284–5318, 2012.
C. Chen, T. Zhang, P. Contu, J. Klamkin, A. K. Coskun, and A. Joshi, “Sharing and placement of on-chip laser sources in silicon-photonic noCs,” in Proc. 8th IEEE/ACM Int. Symp. Netw. Chip, 2014, pp. 88–95.
Z. H. Quan, J. Justice, M. B. Mooney, M. A. Gubbins, P. J. Parbrook, and B. Corbett, “Thermal modelling of transfer-bonded thin-film gallium arsenide laser diode,” IET Optoelectron., vol. 10, pp. 51–56, 2016.
J. Justice, C. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer-scale integration of group III-V lasers on silicon using transfer printing of epitaxial layers,” Nature Photon., vol. 6, no. 9, pp. 610–614, 2012.
J. Yoon, S. M. Lee, D. Kang, M. A. Meitl, C. A. Bower, and J. Rogers, “Heterogeneously integrated optoelectronic devices enabled by microtransfer printing,” Adv. Opt. Mater., vol. 3, no. 10, pp. 1313–1335, 2015.
S. Cheung, Y. Kawakita, K. Shang, and S. J. B. Yoo, “Theory and design optimization of energy-efficient hydrophobic wafer-bonded III-V/Si hybrid semiconductor optical amplifiers,” J. Lightw. Technol., vol. 31, no. 24, pp. 4057–4066, 2013.
B. Song, L. Megalini, S. Dwivedi, S. Ristic, and J. Klamkin, “High-thermal performance 3D hybrid silicon lasers,” IEEE Photon. Technol. Lett., vol. 29, no. 14, pp. 1143–1146, 2017.
C. Chen, T. Zhang, P. Contu, J. Klamkin, A. K. Coskun, and A. Joshi, “Sharing and placement of on-chip laser sources in silicon-photonic noCs,” in Proc. 8th IEEE/ACM Int. Symp. Netw. Chip, 2014, pp. 88–95.
M. Lamponiet al., “Low-threshold heterogeneously integrated InP/SOI laser with a double adiabatic taper coupler,” IEEE Photon. Technol. Lett., vol. 24, no. 1, pp. 76–78, 2012.
J. Yoon, S. M. Lee, D. Kang, M. A. Meitl, C. A. Bower, and J. Rogers, “Heterogeneously integrated optoelectronic devices enabled by microtransfer printing,” Adv. Opt. Mater., vol. 3, no. 10, pp. 1313–1335, 2015.
D. Liang and J. E. Bowers, “Recent progress in lasers on silicon,” Nature Photon., vol. 4, pp. 511–517, 2010.
B. Corbett, R. Loi, W. Zhou, D. Liu, and Z. Ma, “Transfer print techniques for heterogeneous integration of photonic components,” Prog. Quantum Electron., vol. 52, pp. 1–17, 2017.
L. Liuet al., “On-chip optical interconnect on silicon by transfer printing,” in Proc. Conf. Lasers Electro-Opt., 2018, Paper no. STh4B.1.
B. Corbett, R. Loi, W. Zhou, D. Liu, and Z. Ma, “Transfer print techniques for heterogeneous integration of photonic components,” Prog. Quantum Electron., vol. 52, pp. 1–17, 2017.
R. Loiet al., “Transfer printing of AlGaInAs/InP etched facet lasers to Si substrates,” IEEE Photon. J., vol. 8, no. 6, 2016, Paper no. 1504810.
R. Loiet al., “Micro-transfer printing for advanced scalable hybrid photonic integration,” in Proc. Eur. Conf. Integr. Opt., 2018, Paper no. Th.1.A.5 15.
B. Corbett, R. Loi, W. Zhou, D. Liu, and Z. Ma, “Transfer print techniques for heterogeneous integration of photonic components,” Prog. Quantum Electron., vol. 52, pp. 1–17, 2017.
B. Song, L. Megalini, S. Dwivedi, S. Ristic, and J. Klamkin, “High-thermal performance 3D hybrid silicon lasers,” IEEE Photon. Technol. Lett., vol. 29, no. 14, pp. 1143–1146, 2017.
J. Justice, C. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer-scale integration of group III-V lasers on silicon using transfer printing of epitaxial layers,” Nature Photon., vol. 6, no. 9, pp. 610–614, 2012.
J. Yoon, S. M. Lee, D. Kang, M. A. Meitl, C. A. Bower, and J. Rogers, “Heterogeneously integrated optoelectronic devices enabled by microtransfer printing,” Adv. Opt. Mater., vol. 3, no. 10, pp. 1313–1335, 2015.
M. A. Meitlet al., “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nature Mater., vol. 5, pp. 33–38, 2006.
Z. H. Quan, J. Justice, M. B. Mooney, M. A. Gubbins, P. J. Parbrook, and B. Corbett, “Thermal modelling of transfer-bonded thin-film gallium arsenide laser diode,” IET Optoelectron., vol. 10, pp. 51–56, 2016.
J. Justice, C. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer-scale integration of group III-V lasers on silicon using transfer printing of epitaxial layers,” Nature Photon., vol. 6, no. 9, pp. 610–614, 2012.
A. Carlson, A. M. Bowen, Y. Huang, R. G. Nuzzo, and J. A. Rogers, “Transfer printing techniques for materials assembly and micro/nanodevice fabrication,” Adv. Mater., vol. 24, pp. 5284–5318, 2012.
Z. H. Quan, J. Justice, M. B. Mooney, M. A. Gubbins, P. J. Parbrook, and B. Corbett, “Thermal modelling of transfer-bonded thin-film gallium arsenide laser diode,” IET Optoelectron., vol. 10, pp. 51–56, 2016.
J. Piprek, J. Patrick, A. Patrick, and J. E. Bowers, “Carrier non-uniformity effects on the internal efficiency of multiquantum-well lasers,” Appl. Phys. Lett., vol. 74, no. 4, pp. 489–49, 1999.
J. Piprek, J. Patrick, A. Patrick, and J. E. Bowers, “Carrier non-uniformity effects on the internal efficiency of multiquantum-well lasers,” Appl. Phys. Lett., vol. 74, no. 4, pp. 489–49, 1999.
J. Piprek, J. K. White, and A. J. SpringThorpe, “What limits the maximum output power of long-wavelength AlGaInAs/InP laser diodes?,” IEEE J. Quantum Electron., vol. 38, no. 9, pp. 1253–1259, 2002.
J. Piprek, J. Patrick, A. Patrick, and J. E. Bowers, “Carrier non-uniformity effects on the internal efficiency of multiquantum-well lasers,” Appl. Phys. Lett., vol. 74, no. 4, pp. 489–49, 1999.
Z. H. Quan, J. Justice, M. B. Mooney, M. A. Gubbins, P. J. Parbrook, and B. Corbett, “Thermal modelling of transfer-bonded thin-film gallium arsenide laser diode,” IET Optoelectron., vol. 10, pp. 51–56, 2016.
B. Song, L. Megalini, S. Dwivedi, S. Ristic, and J. Klamkin, “High-thermal performance 3D hybrid silicon lasers,” IEEE Photon. Technol. Lett., vol. 29, no. 14, pp. 1143–1146, 2017.
G. Roelkenset al., “III-V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photon. Rev., vol. 4, pp. 1–29, 2010.
G. Roelkenset al., “III-V/Si photonics by die-to-wafer bonding,” Mater. Today, vol. 10, nos. 7/8, pp. 36–43, 2007.
J. Yoon, S. M. Lee, D. Kang, M. A. Meitl, C. A. Bower, and J. Rogers, “Heterogeneously integrated optoelectronic devices enabled by microtransfer printing,” Adv. Opt. Mater., vol. 3, no. 10, pp. 1313–1335, 2015.
A. Carlson, A. M. Bowen, Y. Huang, R. G. Nuzzo, and J. A. Rogers, “Transfer printing techniques for materials assembly and micro/nanodevice fabrication,” Adv. Mater., vol. 24, pp. 5284–5318, 2012.
S. Cheung, Y. Kawakita, K. Shang, and S. J. B. Yoo, “Theory and design optimization of energy-efficient hydrophobic wafer-bonded III-V/Si hybrid semiconductor optical amplifiers,” J. Lightw. Technol., vol. 31, no. 24, pp. 4057–4066, 2013.
B. Song, L. Megalini, S. Dwivedi, S. Ristic, and J. Klamkin, “High-thermal performance 3D hybrid silicon lasers,” IEEE Photon. Technol. Lett., vol. 29, no. 14, pp. 1143–1146, 2017.
J. Piprek, J. K. White, and A. J. SpringThorpe, “What limits the maximum output power of long-wavelength AlGaInAs/InP laser diodes?,” IEEE J. Quantum Electron., vol. 38, no. 9, pp. 1253–1259, 2002.
M. N. Sysaket al., “Hybrid silicon laser technology: A thermal perspective,” IEEE J. Sel. Topics Quantum Electron., vol. 17, no. 6, pp. 1490–1498, 2011.
D. Thomsonet al., “Roadmap on silicon photonics,” J. Opt., vol. 18, 2016, Paper no. 073003.
J. Piprek, J. K. White, and A. J. SpringThorpe, “What limits the maximum output power of long-wavelength AlGaInAs/InP laser diodes?,” IEEE J. Quantum Electron., vol. 38, no. 9, pp. 1253–1259, 2002.
H. Yanget al., “Transfer printing stacked nanomembrane lasers on silicon,” Nature Photon., vol. 6, pp. 617–622, 2012.
S. Cheung, Y. Kawakita, K. Shang, and S. J. B. Yoo, “Theory and design optimization of energy-efficient hydrophobic wafer-bonded III-V/Si hybrid semiconductor optical amplifiers,” J. Lightw. Technol., vol. 31, no. 24, pp. 4057–4066, 2013.
J. Yoon, S. M. Lee, D. Kang, M. A. Meitl, C. A. Bower, and J. Rogers, “Heterogeneously integrated optoelectronic devices enabled by microtransfer printing,” Adv. Opt. Mater., vol. 3, no. 10, pp. 1313–1335, 2015.
C. Chen, T. Zhang, P. Contu, J. Klamkin, A. K. Coskun, and A. Joshi, “Sharing and placement of on-chip laser sources in silicon-photonic noCs,” in Proc. 8th IEEE/ACM Int. Symp. Netw. Chip, 2014, pp. 88–95.
B. Corbett, R. Loi, W. Zhou, D. Liu, and Z. Ma, “Transfer print techniques for heterogeneous integration of photonic components,” Prog. Quantum Electron., vol. 52, pp. 1–17, 2017.
A. Carlson, A. M. Bowen, Y. Huang, R. G. Nuzzo, and J. A. Rogers, “Transfer printing techniques for materials assembly and micro/nanodevice fabrication,” Adv. Mater., vol. 24, pp. 5284–5318, 2012.
J. Yoon, S. M. Lee, D. Kang, M. A. Meitl, C. A. Bower, and J. Rogers, “Heterogeneously integrated optoelectronic devices enabled by microtransfer printing,” Adv. Opt. Mater., vol. 3, no. 10, pp. 1313–1335, 2015.
J. Piprek, J. Patrick, A. Patrick, and J. E. Bowers, “Carrier non-uniformity effects on the internal efficiency of multiquantum-well lasers,” Appl. Phys. Lett., vol. 74, no. 4, pp. 489–49, 1999.
J. Piprek, J. K. White, and A. J. SpringThorpe, “What limits the maximum output power of long-wavelength AlGaInAs/InP laser diodes?,” IEEE J. Quantum Electron., vol. 38, no. 9, pp. 1253–1259, 2002.
M. N. Sysaket al., “Hybrid silicon laser technology: A thermal perspective,” IEEE J. Sel. Topics Quantum Electron., vol. 17, no. 6, pp. 1490–1498, 2011.
R. Loiet al., “Transfer printing of AlGaInAs/InP etched facet lasers to Si substrates,” IEEE Photon. J., vol. 8, no. 6, 2016, Paper no. 1504810.
M. Lamponiet al., “Low-threshold heterogeneously integrated InP/SOI laser with a double adiabatic taper coupler,” IEEE Photon. Technol. Lett., vol. 24, no. 1, pp. 76–78, 2012.
B. Song, L. Megalini, S. Dwivedi, S. Ristic, and J. Klamkin, “High-thermal performance 3D hybrid silicon lasers,” IEEE Photon. Technol. Lett., vol. 29, no. 14, pp. 1143–1146, 2017.
Z. H. Quan, J. Justice, M. B. Mooney, M. A. Gubbins, P. J. Parbrook, and B. Corbett, “Thermal modelling of transfer-bonded thin-film gallium arsenide laser diode,” IET Optoelectron., vol. 10, pp. 51–56, 2016.
S. Adachi, “Lattice thermal resistivity of III–V compound alloys,” J. Appl. Phys., vol. 54, no. 4, pp. 1844–1848, 1983.
S. Adachi, “Lattice thermal conductivity of group-IV and III–V semiconductor alloys,” J. Appl. Phys., vol. 102, no. 6, 2007, Paper no. 063502.
S. Cheung, Y. Kawakita, K. Shang, and S. J. B. Yoo, “Theory and design optimization of energy-efficient hydrophobic wafer-bonded III-V/Si hybrid semiconductor optical amplifiers,” J. Lightw. Technol., vol. 31, no. 24, pp. 4057–4066, 2013.
D. Thomsonet al., “Roadmap on silicon photonics,” J. Opt., vol. 18, 2016, Paper no. 073003.
G. Roelkenset al., “III-V/silicon photonics for on-chip and intra-chip optical interconnects,” Laser Photon. Rev., vol. 4, pp. 1–29, 2010.
G. Roelkenset al., “III-V/Si photonics by die-to-wafer bonding,” Mater. Today, vol. 10, nos. 7/8, pp. 36–43, 2007.
M. A. Meitlet al., “Transfer printing by kinetic control of adhesion to an elastomeric stamp,” Nature Mater., vol. 5, pp. 33–38, 2006.
D. Liang and J. E. Bowers, “Recent progress in lasers on silicon,” Nature Photon., vol. 4, pp. 511–517, 2010.
J. Justice, C. Bower, M. Meitl, M. B. Mooney, M. A. Gubbins, and B. Corbett, “Wafer-scale integration of group III-V lasers on silicon using transfer printing of epitaxial layers,” Nature Photon., vol. 6, no. 9, pp. 610–614, 2012.
H. Yanget al., “Transfer printing stacked nanomembrane lasers on silicon,” Nature Photon., vol. 6, pp. 617–622, 2012.
A. W. Fanget al., “Integrated AlGaInAs-silicon evanescent race track laser and photodetector,” Opt. Express, vol. 5, pp. 2315–2322, 2007.
B. Corbett, R. Loi, W. Zhou, D. Liu, and Z. Ma, “Transfer print techniques for heterogeneous integration of photonic components,” Prog. Quantum Electron., vol. 52, pp. 1–17, 2017.
C. Chen, T. Zhang, P. Contu, J. Klamkin, A. K. Coskun, and A. Joshi, “Sharing and placement of on-chip laser sources in silicon-photonic noCs,” in Proc. 8th IEEE/ACM Int. Symp. Netw. Chip, 2014, pp. 88–95.
L. Liuet al., “On-chip optical interconnect on silicon by transfer printing,” in Proc. Conf. Lasers Electro-Opt., 2018, Paper no. STh4B.1.
D. Gomezet al., “Process capability and elastomer stamp lifetime in micro transfer printing,” in Proc. 2016 IEEE 66th Electron. Compon. Technol. Conf., Las Vegas, NV, USA, 2016, pp. 680–687.
COMSOL V4.0 Heat Transfer Theory, COMSOL, Burlington, MA, USA, 2010.
R. Loiet al., “Micro-transfer printing for advanced scalable hybrid photonic integration,” in Proc. Eur. Conf. Integr. Opt., 2018, Paper no. Th.1.A.5 15.
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