Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group
  • Journal of Lightwave Technology
  • Vol. 35,
  • Issue 15,
  • pp. 3103-3115
  • (2017)

From Chip to Cloud: Optical Interconnects in Engineered Systems

Not Accessible

Your library or personal account may give you access

Abstract

The high-performance server compute landscape is changing. The traditional model of building general-purpose enterprise compute boxes that end-users can configure with storage and networking to assemble their desired compute environments, has evolved to purpose-built systems optimized for specific applications. This tight integration of hardware and software components together with high-density midboard optical modules and an optical backplane allows for unprecedented levels of switching and compute efficiencies and has fueled the penetration of optical interconnects deep “inside the box,” particularly for switch scale-up. We briefly review earlier 40 G/port switching systems based on active optical cables, and present our newest system: An all-optically-interconnected 100 G/port 8.2 Tb/s InfiniBand packet switch ASIC with 41 ports running 100 Gb/s per port interconnected by 12-channel midboard optical transceivers with 25 Gb/s per channel per direction of optical I/O. Using a blind-mate optical backplane, these components enable systems with up to 50 Tb/s bandwidth in a 2U standard rack mount configuration with industry-leading density, efficiency, and latency. For even tighter co-integration of optical interconnects with switch and processor ASICs, we discuss photonic multichip module and interposer packaging technologies that will further improve system energy efficiencies and overcome impending system I/O bottlenecks.

© 2016 IEEE

PDF Article
More Like This
Large data centers interconnect bottlenecks

Ali Ghiasi
Opt. Express 23(3) 2085-2090 (2015)

Reimagining Datacenter Topologies With Integrated Silicon Photonics

Cyriel Minkenberg, Nathan Farrington, Aaron Zilkie, David Nelson, Caroline P. Lai, Dan Brunina, Jerry Byrd, Bhaskar Chowdhuri, Nick Kucharewski, Karl Muth, Amit Nagra, German Rodriguez, David Rubi, Thomas Schrans, Pradeep Srinivasan, Yeong Wang, Chiang Yeh, and Andrew Rickman
J. Opt. Commun. Netw. 10(7) B126-B139 (2018)

Optical interconnects to electronic chips

David A. B. Miller
Appl. Opt. 49(25) F59-F70 (2010)

Cited By

You do not have subscription access to this journal. Cited by links are available to subscribers only. You may subscribe either as an Optica member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access Optica Member Subscription

Select as filters


Select Topics Cancel
© Copyright 2024 | Optica Publishing Group. All rights reserved, including rights for text and data mining and training of artificial technologies or similar technologies.