Abstract
We review recent progress made on the hybrid silicon platform towards
realizing an integrated wavelength division multiplexing (WDM) transmitter
on silicon. Using ion-implantation-enhanced quantum-well intermixing, four
band gaps are integrated onto a single chip and used to demonstrate a DFB
laser-EAM array. Our latest results on design changes to improve
Mach-Zehnder and EAM performance are also described, and the prospects for
fabricating an integrated terabit-per-second transmitter on silicon are
presented.
© 2011 IEEE
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