Abstract

We develop a light-emitting diode (LED) metal package consisting of a reflector integrated with a heat spreader as one body. The structure functions obtained from the thermal transient measurement reveals that the integrated structure of the metal package leads to improved thermal performance. We make significant efforts to clarify the interaction between the extracted light from the LED chip and the inside surface of the metal package. The radiant flux from the LED chip is calculated from the definition of thermal resistance and is implemented as an input parameter to predict the optical power and ray tracing. The simulated optical output power in the far-field mode is 145.3$~$mW, which is in good agreement with the value measured by an integrating sphere. It is shown that a large portion of the emitted light (37.12 mW) is lost by the interaction with the package surface before it reaches the far-field receiver. It is demonstrated that the angle of the first reflector cup is one of the critical design parameters in the metal package structure that we investigate. When the first reflector angle is optimized from 80$^{\circ}$ to 55$^{\circ}$ (with the second reflector angle of 50$^{\circ}$), the optical power increases from its original value of 145.3–170.15 mW with an improved optical extraction efficiency from 75.63% to 88.57%. The ray tracing and illuminance raster charts also confirm that the improved optical performance of the metal package mainly stems from the optimization of the reflector angles.

© 2013 IEEE

PDF Article

References

  • View by:
  • |
  • |

  1. R. D. Dupuis, M. R. Krames, "History, development, and applications of high-brightness visible light-emitting diodes," J. Lightw. Technol. 26, 1154-1171 (2008).
  2. H. Cao, L. Gu, S. K. Mohanty, J. C. Chiao, "An integrated uLED optrode for optogenetic stimulation and electrical recording," IEEE Trans. Biomed. Eng. 60, 225-229 (2013).
  3. M. Arik, C. Becker, S. Weaver, J. Petroski, "Thermal management of LEDs: Package to system," Proc. SPIE 5187, 64-75 (2004).
  4. N. Narendran, T. Gu, "Life of LED-based white light sources," J. Display Technol. 1, 167-171 (2005).
  5. M. Arik, J. Petroski, S. Weaver, "Thermal challenges in the future generation solid-state lighting applications: Light emitting diodes," Proc. IEEE Intersoc. Conf. Thermal Phenomena (2002) pp. 113-120.
  6. G. Rong-feng, T. Da-Lei, W. Xing, Z. Wen-Qing, "Thermal, mechanical and optical analysis of SiC-based LED," Proc. 10th Conf. Electron. Packag. Technol. (2008) pp. 939-944.
  7. W. H. Chi, T. L. Chou, C. N. Han, K. N. Chiang, "Analysis of thermal performance of high power light emitting diodes package," Proc. 10th Conf. Electron. Packag. Technol. (2008) pp. 533-538.
  8. M. Ma, Z. Liu, Y. Li, "Thermal performance of high power LED package based on LTCC," Proc. 12th Int. Conf. Electron. Packag. Technol. High Density Packag (2011) pp. 441-4444.
  9. B. N. Pantha, R. Dahal, J. Li, J. Y. Lin, H. X. Jiang, "Thermoelectric properties of InxGa1-xN alloys," Appl. Phys. Lett. 92, (2008) Art. ID 042112.
  10. J. Zhang, S. Kutlu, G. Liu, N. Tansu, "High-temperature characteristics of Seebeck coefficients for AlInN alloys grown by metalorganic vapor phase epitaxy," J. Appl. Phys. 110, (2011) Art. ID 043710.
  11. L. Kim, M. W. Shin, "Thermal resistance measurement of LED package with multichips," IEEE Trans. Compon. Packag. Technol. 30, 632-636 (2007).
  12. J. Hu, L. Yang, M. W. Shin, "Thermal and mechanical analysis of high-power LEDs with ceramic packages," IEEE Trans. Device Mater. Rel. 8, 297-303 (2008).
  13. J. Hu, L. Yang, M. W. Shin, "Mechanism and thermal effect of delamination in light-emitting diode packages," Microelectron. J. 38, 157-163 (2007).
  14. J. K. Park, H. D. Shin, Y. S. Park, S. Y. Park, K. P. Hong, B. M. Kim, "A suggestion for high power LED package based on LTCC," Proc. Electron. Compon. Technol. Conf. (2006) pp. 1070-1075.
  15. C. J. Su, C. H. Lai, C. T. Lin, C. C. Chang, Y. H. Su, M. H. Tseng, Semiconductor Package With Metal Pads U.S. Patent 6 437 429 (2002).
  16. V. Székely, T. V. Bien, "Fine structure of heat flow path in semiconductor devices: A measurement and identification method," Solid-State Electron. 31, 1363-1368 (1988).
  17. M. Rencz, "New possibilities in the thermal evaluation, offered by transient testing," Microelectron. J. 34, 171-177 (2003).
  18. P. Hanselaer, A. Keppens, S. Forment, W. R. Ryckaert, G. Deconinck, "A new integrating sphere design for spectral radiant flux determination of light-emitting diodes," Meas. Sci. Technol. 20, 1-9 (2009).

2013 (1)

H. Cao, L. Gu, S. K. Mohanty, J. C. Chiao, "An integrated uLED optrode for optogenetic stimulation and electrical recording," IEEE Trans. Biomed. Eng. 60, 225-229 (2013).

2011 (1)

J. Zhang, S. Kutlu, G. Liu, N. Tansu, "High-temperature characteristics of Seebeck coefficients for AlInN alloys grown by metalorganic vapor phase epitaxy," J. Appl. Phys. 110, (2011) Art. ID 043710.

2009 (1)

P. Hanselaer, A. Keppens, S. Forment, W. R. Ryckaert, G. Deconinck, "A new integrating sphere design for spectral radiant flux determination of light-emitting diodes," Meas. Sci. Technol. 20, 1-9 (2009).

2008 (3)

B. N. Pantha, R. Dahal, J. Li, J. Y. Lin, H. X. Jiang, "Thermoelectric properties of InxGa1-xN alloys," Appl. Phys. Lett. 92, (2008) Art. ID 042112.

J. Hu, L. Yang, M. W. Shin, "Thermal and mechanical analysis of high-power LEDs with ceramic packages," IEEE Trans. Device Mater. Rel. 8, 297-303 (2008).

R. D. Dupuis, M. R. Krames, "History, development, and applications of high-brightness visible light-emitting diodes," J. Lightw. Technol. 26, 1154-1171 (2008).

2007 (2)

J. Hu, L. Yang, M. W. Shin, "Mechanism and thermal effect of delamination in light-emitting diode packages," Microelectron. J. 38, 157-163 (2007).

L. Kim, M. W. Shin, "Thermal resistance measurement of LED package with multichips," IEEE Trans. Compon. Packag. Technol. 30, 632-636 (2007).

2005 (1)

2004 (1)

M. Arik, C. Becker, S. Weaver, J. Petroski, "Thermal management of LEDs: Package to system," Proc. SPIE 5187, 64-75 (2004).

2003 (1)

M. Rencz, "New possibilities in the thermal evaluation, offered by transient testing," Microelectron. J. 34, 171-177 (2003).

1988 (1)

V. Székely, T. V. Bien, "Fine structure of heat flow path in semiconductor devices: A measurement and identification method," Solid-State Electron. 31, 1363-1368 (1988).

Appl. Phys. Lett. (1)

B. N. Pantha, R. Dahal, J. Li, J. Y. Lin, H. X. Jiang, "Thermoelectric properties of InxGa1-xN alloys," Appl. Phys. Lett. 92, (2008) Art. ID 042112.

IEEE Trans. Compon. Packag. Technol. (1)

L. Kim, M. W. Shin, "Thermal resistance measurement of LED package with multichips," IEEE Trans. Compon. Packag. Technol. 30, 632-636 (2007).

IEEE Trans. Biomed. Eng. (1)

H. Cao, L. Gu, S. K. Mohanty, J. C. Chiao, "An integrated uLED optrode for optogenetic stimulation and electrical recording," IEEE Trans. Biomed. Eng. 60, 225-229 (2013).

IEEE Trans. Device Mater. Rel. (1)

J. Hu, L. Yang, M. W. Shin, "Thermal and mechanical analysis of high-power LEDs with ceramic packages," IEEE Trans. Device Mater. Rel. 8, 297-303 (2008).

J. Lightw. Technol. (1)

R. D. Dupuis, M. R. Krames, "History, development, and applications of high-brightness visible light-emitting diodes," J. Lightw. Technol. 26, 1154-1171 (2008).

J. Appl. Phys. (1)

J. Zhang, S. Kutlu, G. Liu, N. Tansu, "High-temperature characteristics of Seebeck coefficients for AlInN alloys grown by metalorganic vapor phase epitaxy," J. Appl. Phys. 110, (2011) Art. ID 043710.

J. Display Technol. (1)

Meas. Sci. Technol. (1)

P. Hanselaer, A. Keppens, S. Forment, W. R. Ryckaert, G. Deconinck, "A new integrating sphere design for spectral radiant flux determination of light-emitting diodes," Meas. Sci. Technol. 20, 1-9 (2009).

Microelectron. J. (2)

M. Rencz, "New possibilities in the thermal evaluation, offered by transient testing," Microelectron. J. 34, 171-177 (2003).

J. Hu, L. Yang, M. W. Shin, "Mechanism and thermal effect of delamination in light-emitting diode packages," Microelectron. J. 38, 157-163 (2007).

Proc. SPIE (1)

M. Arik, C. Becker, S. Weaver, J. Petroski, "Thermal management of LEDs: Package to system," Proc. SPIE 5187, 64-75 (2004).

Solid-State Electron. (1)

V. Székely, T. V. Bien, "Fine structure of heat flow path in semiconductor devices: A measurement and identification method," Solid-State Electron. 31, 1363-1368 (1988).

Other (6)

J. K. Park, H. D. Shin, Y. S. Park, S. Y. Park, K. P. Hong, B. M. Kim, "A suggestion for high power LED package based on LTCC," Proc. Electron. Compon. Technol. Conf. (2006) pp. 1070-1075.

C. J. Su, C. H. Lai, C. T. Lin, C. C. Chang, Y. H. Su, M. H. Tseng, Semiconductor Package With Metal Pads U.S. Patent 6 437 429 (2002).

M. Arik, J. Petroski, S. Weaver, "Thermal challenges in the future generation solid-state lighting applications: Light emitting diodes," Proc. IEEE Intersoc. Conf. Thermal Phenomena (2002) pp. 113-120.

G. Rong-feng, T. Da-Lei, W. Xing, Z. Wen-Qing, "Thermal, mechanical and optical analysis of SiC-based LED," Proc. 10th Conf. Electron. Packag. Technol. (2008) pp. 939-944.

W. H. Chi, T. L. Chou, C. N. Han, K. N. Chiang, "Analysis of thermal performance of high power light emitting diodes package," Proc. 10th Conf. Electron. Packag. Technol. (2008) pp. 533-538.

M. Ma, Z. Liu, Y. Li, "Thermal performance of high power LED package based on LTCC," Proc. 12th Int. Conf. Electron. Packag. Technol. High Density Packag (2011) pp. 441-4444.

Cited By

OSA participates in CrossRef's Cited-By Linking service. Citing articles from OSA journals and other participating publishers are listed here.