Abstract

The thin-film transistor liquid crystal display (TFT-LCD) industry has in recent years demanded ever-larger-area substrate processing capability to keep up with consumer market demands for larger and larger displays. This paper discusses the latest plasma-enhanced chemical-vapor deposition (PECVD) system, the AKT 50K PECVD, which handles up to ${\hbox{2160}}\times {\hbox{2460}}\ {\hbox {mm}}^{2}$ substrates. As substrate size increases, lowering the processing temperature is getting even more important to improve production reliability and cost performance. The most commonly used process temperature for the so-called active layers of amorphous silicon (a-Si) TFTs is approximately 350 $^{\circ} {\hbox {C}}$. In this paper, a newly developed single-chamber low-temperature PECVD active-layers process is discussed. In particular, our low-temperature process maintains film performance at the same level as high-temperature active layers while also maintaining system productivity and throughput.

© 2007 IEEE

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References

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  1. Q. Shang, R. Robertson, K. Law, "PECVD tool productivity enhancement with remote plasma source," Proc. Display Manuf. Technol. Conf. (1998) pp. 65-66.
  2. M. A. Lieberman, J. P. Booth, P. Chabert, J. M. Rax, M. M. Turner, "Standing wave and skin effects in large-area, high-frequency capacitive discharges," Plasma Sources Sci. Technol. 11, 283-293 (2002).
  3. T. Takehara, S. Sun, I. D. Kang, "The latest PECVD technology for large-size TFT-LCD," Proc. IDW (2004) pp. 603-606.
  4. T. Takehara, "The latest PECVD technology for large-size Processing," Proc. AM-FPD (2006) pp. 95-98.
  5. K. Tanaka, E. Maruyama, T. Shimada, H. Okamoto, Amorphous Silicon (Wiley, 1999).
  6. S. P. Lacour, C. Tsay, S. Wager, "An elastically stretchable TFT circuit," IEEE Electron Device Lett. 25, 792-794 (2004).
  7. V. J. Lumelsky, M. S. Shur, S. Wager, "Sensitive skin," IEEE Sensors J. 1, 41-51 (2001).
  8. H. Gleskova, S. Wagner, "Amorphous silicon thin-film transistors on compliant polymide foilsubstrates," IEEE Electron Device Lett. 20, 473-475 (1999).
  9. Y. Kuo, K. Okajima, M. Takeichi, "Plasma processing in the fabrication of amorphous silicon thin-film-transistor arrays," IBM J. Res. Develop. 43, 73-87 (1999).

2004

S. P. Lacour, C. Tsay, S. Wager, "An elastically stretchable TFT circuit," IEEE Electron Device Lett. 25, 792-794 (2004).

2002

M. A. Lieberman, J. P. Booth, P. Chabert, J. M. Rax, M. M. Turner, "Standing wave and skin effects in large-area, high-frequency capacitive discharges," Plasma Sources Sci. Technol. 11, 283-293 (2002).

2001

V. J. Lumelsky, M. S. Shur, S. Wager, "Sensitive skin," IEEE Sensors J. 1, 41-51 (2001).

1999

H. Gleskova, S. Wagner, "Amorphous silicon thin-film transistors on compliant polymide foilsubstrates," IEEE Electron Device Lett. 20, 473-475 (1999).

Y. Kuo, K. Okajima, M. Takeichi, "Plasma processing in the fabrication of amorphous silicon thin-film-transistor arrays," IBM J. Res. Develop. 43, 73-87 (1999).

IBM J. Res. Develop.

Y. Kuo, K. Okajima, M. Takeichi, "Plasma processing in the fabrication of amorphous silicon thin-film-transistor arrays," IBM J. Res. Develop. 43, 73-87 (1999).

IEEE Electron Device Lett.

H. Gleskova, S. Wagner, "Amorphous silicon thin-film transistors on compliant polymide foilsubstrates," IEEE Electron Device Lett. 20, 473-475 (1999).

IEEE Electron Device Lett.

S. P. Lacour, C. Tsay, S. Wager, "An elastically stretchable TFT circuit," IEEE Electron Device Lett. 25, 792-794 (2004).

IEEE Sensors J.

V. J. Lumelsky, M. S. Shur, S. Wager, "Sensitive skin," IEEE Sensors J. 1, 41-51 (2001).

Plasma Sources Sci. Technol.

M. A. Lieberman, J. P. Booth, P. Chabert, J. M. Rax, M. M. Turner, "Standing wave and skin effects in large-area, high-frequency capacitive discharges," Plasma Sources Sci. Technol. 11, 283-293 (2002).

Other

T. Takehara, S. Sun, I. D. Kang, "The latest PECVD technology for large-size TFT-LCD," Proc. IDW (2004) pp. 603-606.

T. Takehara, "The latest PECVD technology for large-size Processing," Proc. AM-FPD (2006) pp. 95-98.

K. Tanaka, E. Maruyama, T. Shimada, H. Okamoto, Amorphous Silicon (Wiley, 1999).

Q. Shang, R. Robertson, K. Law, "PECVD tool productivity enhancement with remote plasma source," Proc. Display Manuf. Technol. Conf. (1998) pp. 65-66.

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