Abstract

LED arrays with pixel numbers of 3×3, 4×4, and 5×5 have been studied in this paper in order to enhance the optical output power and decrease heat dissipation of an AlGaInP-based light emitting diode display device (pixel size of 280×280 μm) fabricated by micro-opto-electro-mechanical systems. Simulation results showed that the thermal resistances of the 3×3, 4×4, 5×5 arrays were 52°C/W, 69.7°C/W, and 84.3°C/W. The junction temperature was calculated by the peak wavelength shift method, which showed that the maximum value appears at the center pixel due to thermal crosstalk from neighboring pixels. The central temperature would be minimized with 40 μm pixel pitch and 150 μm substrate thickness as calculated by thermal modeling using finite element analysis. The modeling can be used to optimize parameters of highly integrated AlGaInP-based LED arrays fabricated by micro-opto-electro-mechanical systems technology.

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  1. S. H. Lee, K. J. Chang, G. T. Hwang, and K. J. LeeSelf-powered flexible inorganic electronic systemNano Energy201414111125
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  14. K. Chen and N. NarendranEstimating the average junction temperature of AlGaInP LED arrays by spectral analysisMicroelectronics Reliability201353701705
  15. R. J. Cheng and K. M. LiewA meshless analysis of three-dimensionaltransient heat conduction problemsEngineeringAnalysis with Boundary Elements201236203210
  16. Y. S. Muzychka, M. M. Yovanovich, and J. R. CulhamThermal spreading resistance in compound and orthotropic systemsJournal of Thermophysics & Heat Transfer2004184551
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  20. M. F. Schubert, J. Xu, J. K. Kim, E. F. Schubert, M. H. Kim, S. Yoon, S. M. Lee, C. Sone, T. Sakong, and Y. ParkPolarization-matched GaInN/AlGaInN multi-quantum-well light-emitting diodes with reduced efficiency droopApplied physics letters200893041102

Other (20)

S. H. Lee, K. J. Chang, G. T. Hwang, and K. J. LeeSelf-powered flexible inorganic electronic systemNano Energy201414111125

J. Day, J. Li, D. Y. C. Lie, C. Bradford, J. Y. Lin, and H. X. JiangIII-Nitride full-scale high-resolution microdisplaysApplied Physics Letters201199031116

X. Li, J. D. Budai, and J. Y. HoweNew yellow Ba0.93 Eu0.07Al2O4 phosphor for warm-white light-emitting diodes through single-emitting-center conversionLight Science & Applications2013250

E. Matioli, S. Brinkley, K. M. Kelchner, Y. L. Hu, S. Nakamura, S. Denbaars, J. Speck, and C. WeisbuchHigh-brightness polarized light-emitting diodesLight Science & Applications20121479482

Z. J. Liu, K. M. Wong, W. K. Chi, C. W. Tang, and K. M. LauMonolithic LED microdisplay on active matrix substrate using flip-chip technologyIEEE Journal of Selected Topics in Quantum Electronics20091512981302

Y. C. Chu, M. H. Wu, C. J. Chung, Y. H. Fang, and Y. K. SuMicro-chip shaping for luminance enhancement of gan micro-light-emitting diodes arrayElectron Device Letters IEEE201435771773

A. L. Chaudet, M. Neil, P. Degenaar, K. Mehran, R. Berlinguer-Palmini, B. Corbet, P. Maaskant, D. Rogerson, P. Lanigan, E. Bamberg, and B. RoskaDevelopment of optics with microled arrays for improved opto-electronic neural stimulationProceedings of SPIE - The International Society for Optical Engineering20138586455464

Q. Shan, Q. Dai, S. Chhajed, J. Cho, and E. F. SchubertAnalysis of thermal properties of GaInN light-emitting diodes and laser diodesJournal of Applied Physics2010108084504

J. Herrnsdorf, J. J. D. Mckendry, S. Zhang, and E. XieActive-matrix GaN micro light-emitting diode display with unprecedented brightnessIEEE Transactions on Electron Devices2015621

M. S. Kim, H. K. Lee, and J. S. YuDevice characteristics and thermal analysis of AlGaInP-based red monolithic light-emitting diode arraysSemiconductor Science & Technology201328348354

H. K. Lee, D. H. Lee, Y. M. Song, Y. T. Lee, and J. S. YuThermal measurements and analysis of AlGaInP/GaInP MQW red LEDs with different chip sizes and substrate thicknessesSolid-State Electronics2011567984

C. Tian, W. Wang, J. Liang, Z. Liang, Y. Qin, and J. LvTheoretical and experimental analysis of AlGaInP micro-LED array with square-circle anodeAip Advances20155771

X. Bao, J. Liang, Z. Liang, W. Wang, C. Tian, Y. Qin, and J. LvDesign and fabrication of AlGaInP-based micro-light-emitting-diode array devicesOptics & Laser Technology2016783441

K. Chen and N. NarendranEstimating the average junction temperature of AlGaInP LED arrays by spectral analysisMicroelectronics Reliability201353701705

R. J. Cheng and K. M. LiewA meshless analysis of three-dimensionaltransient heat conduction problemsEngineeringAnalysis with Boundary Elements201236203210

Y. S. Muzychka, M. M. Yovanovich, and J. R. CulhamThermal spreading resistance in compound and orthotropic systemsJournal of Thermophysics & Heat Transfer2004184551

M. M. Yovanovich, Y. S. Muzychka, and J. R. CulhamSpreading resistance of isoflux rectangles and strips on compound flux channelsJournal of Thermophysics & Heat Transfer199913495500

Nakwaski and W.Thermal conductivity of binary, ternary, and quaternary III-V compoundsJournal of Applied Physics198864159

M. Guden and J. PiprekMaterial parameters of quaternary III–V semiconductors for multilayer mirrors at 1.55 μm wavelengthModelling and Simulation in Materials Science and Engineering19964349357

M. F. Schubert, J. Xu, J. K. Kim, E. F. Schubert, M. H. Kim, S. Yoon, S. M. Lee, C. Sone, T. Sakong, and Y. ParkPolarization-matched GaInN/AlGaInN multi-quantum-well light-emitting diodes with reduced efficiency droopApplied physics letters200893041102

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