Abstract

With the increasing use of high-power laser diode bars (LDBs) and stacked LDBs, the issue of thermal control has become critical, as temperature is related to device efficiency and lifetime, as well as to beam quality. To improve the thermal resistance of an LDB set, we propose and analyze a bypass heat sink with a top canopy structure for an LDB set, instead of adopting a thick submount. The thermal bypassing in the top-canopy structure is efficient, as it avoids the cross-sectional thermal saturation that may exist in a thick submount. The efficient thickness range of the submount in a typical LDB set is guided by the thermal resistance as a function of thickness, and the simulated bypassing efficiency of a canopy is higher than a simple analytical prediction, especially for thinner canopies.

PDF Article

References

  • View by:
  • |

  1. Y Izawa, N. Miyanaga, J. Kawanaka, and K. YamakawaHigh power lasers and their new applicationsJ. Opt. Soc. Korea200812178185
  2. B. Liu, X. Tong, C. Jiang, D. R. Brown, and L. RobertsonDevelopment of stable, narrow spectral line-width, fiber delivered laser source for spin exchange optical pumpingAppl. Opt.20105454205424
  3. Y. Y. X. Chen, X. Liu, Y. Mei, and G. Q. LuDie bonding of high power 808 nm laser diodes with nanosilver pasteJ. Electron. Packag.2012134041003-1041003-7
  4. Y. Qiao, S. Feng, C. Xiong, and H. ZhuWorking thermal stresses in AlGaAs/GaAs high-power laser diode bars using infrared thermographyIEEE T. D. M. R201414413417
  5. T. G. Desai, M. Flannery, N. V. Velson, and P. griffinNanoscale coating for microchannel cooler protection in high powered laser diodesProc. IEEE Modeling & Management SymposiumSan Jose, CA, USA2015336342
  6. M. Leers and K. BouckeCooling Approaches for High Power Diode Laser BarsProc. IEEE Electronic Components and Technology ConferenceLake Bluena Vista, FL, USA2007Oct.10111016
  7. A. Koziwska, P. Lapka, M. Seredynski, M. Teodorczyk, and E. Dabrowsk-TumanskaExperimental study and numerical modeling of micro-channel cooler with micro-pipes for high-power diode laser arraysAppl. Therm. Eng.201591279287
  8. B. G. Ji, S. G. Lee, S. G. Park, and B. H. OSimple thermal diverging model of the thin epitaxial layer of inp laser diodesJ. Koran. Phys. Soc.20156711751178

Other (8)

Y Izawa, N. Miyanaga, J. Kawanaka, and K. YamakawaHigh power lasers and their new applicationsJ. Opt. Soc. Korea200812178185

B. Liu, X. Tong, C. Jiang, D. R. Brown, and L. RobertsonDevelopment of stable, narrow spectral line-width, fiber delivered laser source for spin exchange optical pumpingAppl. Opt.20105454205424

Y. Y. X. Chen, X. Liu, Y. Mei, and G. Q. LuDie bonding of high power 808 nm laser diodes with nanosilver pasteJ. Electron. Packag.2012134041003-1041003-7

Y. Qiao, S. Feng, C. Xiong, and H. ZhuWorking thermal stresses in AlGaAs/GaAs high-power laser diode bars using infrared thermographyIEEE T. D. M. R201414413417

T. G. Desai, M. Flannery, N. V. Velson, and P. griffinNanoscale coating for microchannel cooler protection in high powered laser diodesProc. IEEE Modeling & Management SymposiumSan Jose, CA, USA2015336342

M. Leers and K. BouckeCooling Approaches for High Power Diode Laser BarsProc. IEEE Electronic Components and Technology ConferenceLake Bluena Vista, FL, USA2007Oct.10111016

A. Koziwska, P. Lapka, M. Seredynski, M. Teodorczyk, and E. Dabrowsk-TumanskaExperimental study and numerical modeling of micro-channel cooler with micro-pipes for high-power diode laser arraysAppl. Therm. Eng.201591279287

B. G. Ji, S. G. Lee, S. G. Park, and B. H. OSimple thermal diverging model of the thin epitaxial layer of inp laser diodesJ. Koran. Phys. Soc.20156711751178

Cited By

OSA participates in Crossref's Cited-By Linking service. Citing articles from OSA journals and other participating publishers are listed here.