Abstract

An optical waveguide interconnect mesh network scheme for parallel multiprocessor systems based on an electro-optical printed circuit board (EOPCB) with multimode polymer waveguide is proposed. The system consists of 22 processor element chips interconnected in a mesh network configuration. An additional layer with optical waveguide structure is embedded in a conventional printed circuit board to construct the EOPCB. Vertical cavity surface emitting laser (VCSEL)/positive intrinsic-negative (PIN) arrays are applied as the optical transmitters/receivers. Three 112 VCSEL/PIN parallel optical transmitting/receiving modules are used to provide 32 input/output optical channels required by the 22 chip-to-chip optical mesh interconnect system. The data rate in each optical channel is 3.125 Gbps and thus 10 Gbps parallel optical interconnect link for each direction of a chip is obtained. The optical signals from a processor element chip can be transmitted to another chip through optical waveguide interconnect embedded in the board. Thus the optical interconnect mesh network for parallel multiprocessor system can be implemented.

© 2010 Chinese Optics Letters

Metal-slotted hybrid optical waveguides for PCB-compatible optical interconnection

Jin Tae Kim, Jung Jin Ju, and Suntak Park
Opt. Express 20(9) 10438-10445 (2012)

Intra-system optical interconnection module directly integrated on a polymeric optical waveguide

B. S. Rho, S. H. Hwang, J. W. Lim, G. W. Kim, C. H. Cho, and W.-J. Lee
Opt. Express 17(3) 1215-1221 (2009)

Experimental demonstration of the optical multi-mesh hypercube: scaleable interconnection network for multiprocessors and multicomputers

Ahmed Louri, Stephen Furlonge, and Costas Neocleous
Appl. Opt. 35(35) 6909-6919 (1996)

Three-dimensional board-to-board free-space optical interconnects and their application to the prototype multiprocessor system: COSINE-III

Toshikazu Sakano, Takao Matsumoto, and Kazuhiro Noguchi
Appl. Opt. 34(11) 1815-1822 (1995)

400-Gb/s optical transmitter and receiver modules for on-board interconnects using polymer waveguide arrays

Jau-Ji Jou, Tien-Tsorng Shih, and Chun-Lin Chiu
OSA Continuum 1(2) 658-667 (2018)