Abstract

The applied laser energy absorbed in a local area in laser thermal stress cleaving of brittle materials using a controlled fracture technique produces tensile thermal stress that causes the material to separate along the moving direction of the laser beam. The material separation is similar to crack extension, but the fracture growth is controllable. Using heat transfer theory, we establish a three-dimensional (3D) mathematical thermoelastic calculational model containing a pre-existing crack for a two-point pulsed Nd:YAG laser cleaving silicon wafer. The temperature field and thermal stress field in the silicon wafer are obtained by using the finite element method (FEM). The distribution of the tensile stress and changes in stress intensity factor around the crack tip are analyzed during the pulse duration. Meanwhile, the mechanism of crack propagation is investigated by analyzing the development of the thermal stress field during the cleaving process.

© 2010 Chinese Optics Letters

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2009

S. Nisar, M. A. Sheikh, L. Li, and S. Safdar, Opt. Laser Technol. 41, 318 (2009).

B. S. Yilbas, A. F. M. Arif, C. Karatas, and K. Raza, J. Mater. Process. Technol. 209, 77 (2009).

2008

J. Jiao and X.Wang, Opt. Laser Technol. 40, 297 (2008).

L. Ji, Y. Yan, Y. Bao, and Y. Jiang, Chinese J. Lasers (in Chinese) 35, 1686 (2008).

Y. Yan, L. Ji, Y. Bao, and Y. Jiang, Chinese J. Lasers (in Chinese) 35, 1401 (2008).

2007

N. Ma, X. Wang, H. Ding, Y. Qian, S. Fu, and M. Hu, Chinese J. Lasers (in Chinese) 34, 1441 (2007).

2006

K. Yamada, T. Ueda, A. Hosokawa, Y. Yamane, and K. Sekiya, Proc. SPIE 6107, 61070H (2006).

2003

C.-H. Tsai and H.-W. Chen, J. Mater. Process. Technol. 136, 166 (2003).

C.-H. Tsai and C.-S. Liou, J. Manuf. Sci. Eng. 125, 519(2003).

D. Triantafyllidis, J. R. Bernstein, L. Li, and F. H. Stott, J. Laser Appl. 15, 49 (2003).

2002

S. Wu and Z. Ji, J. Mater. Process. Technol. 121, 269(2002).

T. Ueda, K. Yamada, K. Oiso, and A. Hosokawa, CIRP Annals-Manufacturing Technol. 51, 149 (2002).

2001

Z. H. Shen, S. Y. Zhang, J. Lu, and X. W. Ni, Opt. Laser Technol. 33, 533 (2001).

1996

J. Crank and P. Nicolson, Adv. Compute. Math. 6, 207(1996).

Arif, A. F. M.

B. S. Yilbas, A. F. M. Arif, C. Karatas, and K. Raza, J. Mater. Process. Technol. 209, 77 (2009).

Bao, Y.

L. Ji, Y. Yan, Y. Bao, and Y. Jiang, Chinese J. Lasers (in Chinese) 35, 1686 (2008).

Y. Yan, L. Ji, Y. Bao, and Y. Jiang, Chinese J. Lasers (in Chinese) 35, 1401 (2008).

Bernstein, J. R.

D. Triantafyllidis, J. R. Bernstein, L. Li, and F. H. Stott, J. Laser Appl. 15, 49 (2003).

Chen, H.-W.

C.-H. Tsai and H.-W. Chen, J. Mater. Process. Technol. 136, 166 (2003).

Crank, J.

J. Crank and P. Nicolson, Adv. Compute. Math. 6, 207(1996).

Ding, H.

N. Ma, X. Wang, H. Ding, Y. Qian, S. Fu, and M. Hu, Chinese J. Lasers (in Chinese) 34, 1441 (2007).

Fu, S.

N. Ma, X. Wang, H. Ding, Y. Qian, S. Fu, and M. Hu, Chinese J. Lasers (in Chinese) 34, 1441 (2007).

Hosokawa, A.

K. Yamada, T. Ueda, A. Hosokawa, Y. Yamane, and K. Sekiya, Proc. SPIE 6107, 61070H (2006).

T. Ueda, K. Yamada, K. Oiso, and A. Hosokawa, CIRP Annals-Manufacturing Technol. 51, 149 (2002).

Hu, M.

N. Ma, X. Wang, H. Ding, Y. Qian, S. Fu, and M. Hu, Chinese J. Lasers (in Chinese) 34, 1441 (2007).

Ji, L.

L. Ji, Y. Yan, Y. Bao, and Y. Jiang, Chinese J. Lasers (in Chinese) 35, 1686 (2008).

Y. Yan, L. Ji, Y. Bao, and Y. Jiang, Chinese J. Lasers (in Chinese) 35, 1401 (2008).

Ji, Z.

S. Wu and Z. Ji, J. Mater. Process. Technol. 121, 269(2002).

Jiang, Y.

L. Ji, Y. Yan, Y. Bao, and Y. Jiang, Chinese J. Lasers (in Chinese) 35, 1686 (2008).

Y. Yan, L. Ji, Y. Bao, and Y. Jiang, Chinese J. Lasers (in Chinese) 35, 1401 (2008).

Jiao, J.

J. Jiao and X.Wang, Opt. Laser Technol. 40, 297 (2008).

Karatas, C.

B. S. Yilbas, A. F. M. Arif, C. Karatas, and K. Raza, J. Mater. Process. Technol. 209, 77 (2009).

Li, L.

S. Nisar, M. A. Sheikh, L. Li, and S. Safdar, Opt. Laser Technol. 41, 318 (2009).

D. Triantafyllidis, J. R. Bernstein, L. Li, and F. H. Stott, J. Laser Appl. 15, 49 (2003).

Liou, C.-S.

C.-H. Tsai and C.-S. Liou, J. Manuf. Sci. Eng. 125, 519(2003).

Lu, J.

Z. H. Shen, S. Y. Zhang, J. Lu, and X. W. Ni, Opt. Laser Technol. 33, 533 (2001).

Ma, N.

N. Ma, X. Wang, H. Ding, Y. Qian, S. Fu, and M. Hu, Chinese J. Lasers (in Chinese) 34, 1441 (2007).

Ni, X. W.

Z. H. Shen, S. Y. Zhang, J. Lu, and X. W. Ni, Opt. Laser Technol. 33, 533 (2001).

Nicolson, P.

J. Crank and P. Nicolson, Adv. Compute. Math. 6, 207(1996).

Nisar, S.

S. Nisar, M. A. Sheikh, L. Li, and S. Safdar, Opt. Laser Technol. 41, 318 (2009).

Oiso, K.

T. Ueda, K. Yamada, K. Oiso, and A. Hosokawa, CIRP Annals-Manufacturing Technol. 51, 149 (2002).

Qian, Y.

N. Ma, X. Wang, H. Ding, Y. Qian, S. Fu, and M. Hu, Chinese J. Lasers (in Chinese) 34, 1441 (2007).

Raza, K.

B. S. Yilbas, A. F. M. Arif, C. Karatas, and K. Raza, J. Mater. Process. Technol. 209, 77 (2009).

Safdar, S.

S. Nisar, M. A. Sheikh, L. Li, and S. Safdar, Opt. Laser Technol. 41, 318 (2009).

Sekiya, K.

K. Yamada, T. Ueda, A. Hosokawa, Y. Yamane, and K. Sekiya, Proc. SPIE 6107, 61070H (2006).

Sheikh, M. A.

S. Nisar, M. A. Sheikh, L. Li, and S. Safdar, Opt. Laser Technol. 41, 318 (2009).

Shen, Z. H.

Z. H. Shen, S. Y. Zhang, J. Lu, and X. W. Ni, Opt. Laser Technol. 33, 533 (2001).

Stott, F. H.

D. Triantafyllidis, J. R. Bernstein, L. Li, and F. H. Stott, J. Laser Appl. 15, 49 (2003).

Triantafyllidis, D.

D. Triantafyllidis, J. R. Bernstein, L. Li, and F. H. Stott, J. Laser Appl. 15, 49 (2003).

Tsai, C.-H.

C.-H. Tsai and C.-S. Liou, J. Manuf. Sci. Eng. 125, 519(2003).

C.-H. Tsai and H.-W. Chen, J. Mater. Process. Technol. 136, 166 (2003).

Ueda, T.

K. Yamada, T. Ueda, A. Hosokawa, Y. Yamane, and K. Sekiya, Proc. SPIE 6107, 61070H (2006).

T. Ueda, K. Yamada, K. Oiso, and A. Hosokawa, CIRP Annals-Manufacturing Technol. 51, 149 (2002).

Wang, X.

N. Ma, X. Wang, H. Ding, Y. Qian, S. Fu, and M. Hu, Chinese J. Lasers (in Chinese) 34, 1441 (2007).

Wu, S.

S. Wu and Z. Ji, J. Mater. Process. Technol. 121, 269(2002).

Yamada, K.

K. Yamada, T. Ueda, A. Hosokawa, Y. Yamane, and K. Sekiya, Proc. SPIE 6107, 61070H (2006).

T. Ueda, K. Yamada, K. Oiso, and A. Hosokawa, CIRP Annals-Manufacturing Technol. 51, 149 (2002).

Yamane, Y.

K. Yamada, T. Ueda, A. Hosokawa, Y. Yamane, and K. Sekiya, Proc. SPIE 6107, 61070H (2006).

Yan, Y.

L. Ji, Y. Yan, Y. Bao, and Y. Jiang, Chinese J. Lasers (in Chinese) 35, 1686 (2008).

Y. Yan, L. Ji, Y. Bao, and Y. Jiang, Chinese J. Lasers (in Chinese) 35, 1401 (2008).

Yilbas, B. S.

B. S. Yilbas, A. F. M. Arif, C. Karatas, and K. Raza, J. Mater. Process. Technol. 209, 77 (2009).

Zhang, S. Y.

Z. H. Shen, S. Y. Zhang, J. Lu, and X. W. Ni, Opt. Laser Technol. 33, 533 (2001).

Adv. Compute. Math.

J. Crank and P. Nicolson, Adv. Compute. Math. 6, 207(1996).

Chinese J. Lasers (in Chinese)

Y. Yan, L. Ji, Y. Bao, and Y. Jiang, Chinese J. Lasers (in Chinese) 35, 1401 (2008).

N. Ma, X. Wang, H. Ding, Y. Qian, S. Fu, and M. Hu, Chinese J. Lasers (in Chinese) 34, 1441 (2007).

L. Ji, Y. Yan, Y. Bao, and Y. Jiang, Chinese J. Lasers (in Chinese) 35, 1686 (2008).

CIRP Annals-Manufacturing Technol.

T. Ueda, K. Yamada, K. Oiso, and A. Hosokawa, CIRP Annals-Manufacturing Technol. 51, 149 (2002).

J. Laser Appl.

D. Triantafyllidis, J. R. Bernstein, L. Li, and F. H. Stott, J. Laser Appl. 15, 49 (2003).

J. Manuf. Sci. Eng.

C.-H. Tsai and C.-S. Liou, J. Manuf. Sci. Eng. 125, 519(2003).

J. Mater. Process. Technol.

S. Wu and Z. Ji, J. Mater. Process. Technol. 121, 269(2002).

B. S. Yilbas, A. F. M. Arif, C. Karatas, and K. Raza, J. Mater. Process. Technol. 209, 77 (2009).

C.-H. Tsai and H.-W. Chen, J. Mater. Process. Technol. 136, 166 (2003).

Opt. Laser Technol.

Z. H. Shen, S. Y. Zhang, J. Lu, and X. W. Ni, Opt. Laser Technol. 33, 533 (2001).

J. Jiao and X.Wang, Opt. Laser Technol. 40, 297 (2008).

S. Nisar, M. A. Sheikh, L. Li, and S. Safdar, Opt. Laser Technol. 41, 318 (2009).

Proc. SPIE

K. Yamada, T. Ueda, A. Hosokawa, Y. Yamane, and K. Sekiya, Proc. SPIE 6107, 61070H (2006).

Other

Z. Liu, Numerical Simulation of Heat Treatment Process (in Chinese) (Science Press, Beijing, 1996).

J. Zhao, Fracture Mechanics and Fracture Physics (in Chinese) (Huazhong University of Science and Technology Press, Wuhan, 2003).

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