Abstract

The reliability of microsystem is an important issue and for their quality inspection, it is necessary to know the displacements or deformations due to the applied mechanical, thermal, or electrostatic loads. We show interferometrical techniques like digital holography and speckle interferometry can be used for the measurement of in plane deformations of microsystems with nanometric accuracy and we give a description of the measurement uncertainties.

© 2009 Chinese Optics Letters

PDF Article

References

You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an OSA member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access OSA Member Subscription

Cited By

You do not have subscription access to this journal. Cited by links are available to subscribers only. You may subscribe either as an OSA member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access OSA Member Subscription