Abstract

A novel fusion bonding method between silicon and glass with Nd:YAG laser is described. This method overcomes the movable mechanical parts damage caused by the electrostatics force in micro-electronic machine-system (MEMS) device during the anodic bonding. The diameter of laser spot is 300 ?m, the power of laser is 100 W, the laser velocity for bonding is 0.05 m/s, the average bonding tension is 6.3 MPa. It could distinctly reduce and eliminate the defects and damage, especially in movable sensitive mechanical parts of MEMS device.

© 2005 Chinese Optics Letters

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  1. T. Rogers and J. Kowal, Sensors and Actuators A 46, 113 (1995).
  2. E. T. Enikov and J. G. Boyd, International J. Engineering Science 38, 135 (2000).
  3. X. Chauffleur, G. Blasquez, and P. Pons, Sensors and Actuators A 46, 121 (1995).
  4. G. Blasquez and P. Favaro, Sensors and Actuators A 101, 156 (2002).
  5. J.-T. Huang and H.-A. Yang, Sensors and Actuators A 102, 1 (2002).
  6. U. M. Mescheder, M. Alavi, and K. Hiltmann, Sensors and Actuators A 97, 422 (2002).

2002 (3)

G. Blasquez and P. Favaro, Sensors and Actuators A 101, 156 (2002).

J.-T. Huang and H.-A. Yang, Sensors and Actuators A 102, 1 (2002).

U. M. Mescheder, M. Alavi, and K. Hiltmann, Sensors and Actuators A 97, 422 (2002).

2000 (1)

E. T. Enikov and J. G. Boyd, International J. Engineering Science 38, 135 (2000).

1995 (2)

X. Chauffleur, G. Blasquez, and P. Pons, Sensors and Actuators A 46, 121 (1995).

T. Rogers and J. Kowal, Sensors and Actuators A 46, 113 (1995).

Alavi, M.

U. M. Mescheder, M. Alavi, and K. Hiltmann, Sensors and Actuators A 97, 422 (2002).

Blasquez, G.

G. Blasquez and P. Favaro, Sensors and Actuators A 101, 156 (2002).

X. Chauffleur, G. Blasquez, and P. Pons, Sensors and Actuators A 46, 121 (1995).

Boyd, J. G.

E. T. Enikov and J. G. Boyd, International J. Engineering Science 38, 135 (2000).

Chauffleur, X.

X. Chauffleur, G. Blasquez, and P. Pons, Sensors and Actuators A 46, 121 (1995).

Enikov, E. T.

E. T. Enikov and J. G. Boyd, International J. Engineering Science 38, 135 (2000).

Favaro, P.

G. Blasquez and P. Favaro, Sensors and Actuators A 101, 156 (2002).

Hiltmann, K.

U. M. Mescheder, M. Alavi, and K. Hiltmann, Sensors and Actuators A 97, 422 (2002).

Huang, J.-T.

J.-T. Huang and H.-A. Yang, Sensors and Actuators A 102, 1 (2002).

Kowal, J.

T. Rogers and J. Kowal, Sensors and Actuators A 46, 113 (1995).

Mescheder, U. M.

U. M. Mescheder, M. Alavi, and K. Hiltmann, Sensors and Actuators A 97, 422 (2002).

Pons, P.

X. Chauffleur, G. Blasquez, and P. Pons, Sensors and Actuators A 46, 121 (1995).

Rogers, T.

T. Rogers and J. Kowal, Sensors and Actuators A 46, 113 (1995).

Yang, H.-A.

J.-T. Huang and H.-A. Yang, Sensors and Actuators A 102, 1 (2002).

International J. Engineering Science (1)

E. T. Enikov and J. G. Boyd, International J. Engineering Science 38, 135 (2000).

Sensors and Actuators A (5)

X. Chauffleur, G. Blasquez, and P. Pons, Sensors and Actuators A 46, 121 (1995).

G. Blasquez and P. Favaro, Sensors and Actuators A 101, 156 (2002).

J.-T. Huang and H.-A. Yang, Sensors and Actuators A 102, 1 (2002).

U. M. Mescheder, M. Alavi, and K. Hiltmann, Sensors and Actuators A 97, 422 (2002).

T. Rogers and J. Kowal, Sensors and Actuators A 46, 113 (1995).

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