Abstract

A novel fusion bonding method between silicon and glass with Nd:YAG laser is described. This method overcomes the movable mechanical parts damage caused by the electrostatics force in micro-electronic machine-system (MEMS) device during the anodic bonding. The diameter of laser spot is 300 ?m, the power of laser is 100 W, the laser velocity for bonding is 0.05 m/s, the average bonding tension is 6.3 MPa. It could distinctly reduce and eliminate the defects and damage, especially in movable sensitive mechanical parts of MEMS device.

© 2005 Chinese Optics Letters

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