Abstract

The conventional technology could not fulfill the rapidly growing need for fine conductive lines for its inherent limits. Therefore, in this study laser micro-fine cladding and flexibly direct writing technique is used to obtain conductive lines with high precision and reliability. In the case of different substrates and parameters, film thickness will be different. Film thickness directly influences the reliability and stability of conductive lines with exception of quality and running speed. Therefore, we focus on developing the optimal parameters for the different substrates to achieve expected film thickness and make conductive lines have good performance and quality.

© 2005 Chinese Optics Letters

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  1. Z. H. Wang, Semiconductor Information (in Chinese) 37, 21 (2000).
  2. D. B Chrisey, Science 289, 879 (2000).
  3. K. Venkantakrishnan, B. Tan, and P. Stanley, Opt. Eng. 41, 1441 (2002).
  4. R. Modi, H. D. Wu, and R. C. Y. Auyeung, J. Materials Research 16, 3214 (2001).
  5. H. Yabe, A. Takahashi, and T. Sumiyoshi, Appl. Phys. Lett. 71, 2758 (1997).
  6. S. Xue, W. Ousi-Benomar, and R. A. Lessard, Opt. Eng. 33, 2442 (1994).
  7. D. Dimos, B. H. King, and P. Yang, in Proceedings of 1999 International Symposium on Advanced Packaging Materials 186 (1999).
  8. J. W. Liu and X. Y. Zeng, Laser Journal (in Chinese) 22, 15 (2001).
  9. H. L. Li, X. Y. Zeng, and X. Y. Li, Chin. J. Lasers (in Chinese) (to be published).
  10. X. Y. Li, H. L. Li, J. W. Liu, X. J. Qi, and X. Y. Zeng, Appl. Surface Science 233, 51 (2004).
  11. Q. Zhang and S. F. Jiang, Architectural Door-Window and Metal Building Materials (in Chinese) (10) 24 (2001).

2004 (1)

X. Y. Li, H. L. Li, J. W. Liu, X. J. Qi, and X. Y. Zeng, Appl. Surface Science 233, 51 (2004).

2002 (1)

K. Venkantakrishnan, B. Tan, and P. Stanley, Opt. Eng. 41, 1441 (2002).

2001 (2)

R. Modi, H. D. Wu, and R. C. Y. Auyeung, J. Materials Research 16, 3214 (2001).

J. W. Liu and X. Y. Zeng, Laser Journal (in Chinese) 22, 15 (2001).

2000 (2)

Z. H. Wang, Semiconductor Information (in Chinese) 37, 21 (2000).

D. B Chrisey, Science 289, 879 (2000).

1997 (1)

H. Yabe, A. Takahashi, and T. Sumiyoshi, Appl. Phys. Lett. 71, 2758 (1997).

1994 (1)

S. Xue, W. Ousi-Benomar, and R. A. Lessard, Opt. Eng. 33, 2442 (1994).

Auyeung, R. C. Y.

R. Modi, H. D. Wu, and R. C. Y. Auyeung, J. Materials Research 16, 3214 (2001).

Chrisey, D. B

D. B Chrisey, Science 289, 879 (2000).

Lessard, R. A.

S. Xue, W. Ousi-Benomar, and R. A. Lessard, Opt. Eng. 33, 2442 (1994).

Li, H. L.

X. Y. Li, H. L. Li, J. W. Liu, X. J. Qi, and X. Y. Zeng, Appl. Surface Science 233, 51 (2004).

Li, X. Y.

X. Y. Li, H. L. Li, J. W. Liu, X. J. Qi, and X. Y. Zeng, Appl. Surface Science 233, 51 (2004).

Liu, J. W.

X. Y. Li, H. L. Li, J. W. Liu, X. J. Qi, and X. Y. Zeng, Appl. Surface Science 233, 51 (2004).

J. W. Liu and X. Y. Zeng, Laser Journal (in Chinese) 22, 15 (2001).

Modi, R.

R. Modi, H. D. Wu, and R. C. Y. Auyeung, J. Materials Research 16, 3214 (2001).

Ousi-Benomar, W.

S. Xue, W. Ousi-Benomar, and R. A. Lessard, Opt. Eng. 33, 2442 (1994).

Qi, X. J.

X. Y. Li, H. L. Li, J. W. Liu, X. J. Qi, and X. Y. Zeng, Appl. Surface Science 233, 51 (2004).

Stanley, P.

K. Venkantakrishnan, B. Tan, and P. Stanley, Opt. Eng. 41, 1441 (2002).

Sumiyoshi, T.

H. Yabe, A. Takahashi, and T. Sumiyoshi, Appl. Phys. Lett. 71, 2758 (1997).

Takahashi, A.

H. Yabe, A. Takahashi, and T. Sumiyoshi, Appl. Phys. Lett. 71, 2758 (1997).

Tan, B.

K. Venkantakrishnan, B. Tan, and P. Stanley, Opt. Eng. 41, 1441 (2002).

Venkantakrishnan, K.

K. Venkantakrishnan, B. Tan, and P. Stanley, Opt. Eng. 41, 1441 (2002).

Wang, Z. H.

Z. H. Wang, Semiconductor Information (in Chinese) 37, 21 (2000).

Wu, H. D.

R. Modi, H. D. Wu, and R. C. Y. Auyeung, J. Materials Research 16, 3214 (2001).

Xue, S.

S. Xue, W. Ousi-Benomar, and R. A. Lessard, Opt. Eng. 33, 2442 (1994).

Yabe, H.

H. Yabe, A. Takahashi, and T. Sumiyoshi, Appl. Phys. Lett. 71, 2758 (1997).

Zeng, X. Y.

X. Y. Li, H. L. Li, J. W. Liu, X. J. Qi, and X. Y. Zeng, Appl. Surface Science 233, 51 (2004).

J. W. Liu and X. Y. Zeng, Laser Journal (in Chinese) 22, 15 (2001).

Appl. Phys. Lett. (1)

H. Yabe, A. Takahashi, and T. Sumiyoshi, Appl. Phys. Lett. 71, 2758 (1997).

Appl. Surface Science (1)

X. Y. Li, H. L. Li, J. W. Liu, X. J. Qi, and X. Y. Zeng, Appl. Surface Science 233, 51 (2004).

J. Materials Research (1)

R. Modi, H. D. Wu, and R. C. Y. Auyeung, J. Materials Research 16, 3214 (2001).

Laser Journal (in Chinese) (1)

J. W. Liu and X. Y. Zeng, Laser Journal (in Chinese) 22, 15 (2001).

Opt. Eng. (2)

S. Xue, W. Ousi-Benomar, and R. A. Lessard, Opt. Eng. 33, 2442 (1994).

K. Venkantakrishnan, B. Tan, and P. Stanley, Opt. Eng. 41, 1441 (2002).

Science (1)

D. B Chrisey, Science 289, 879 (2000).

Semiconductor Information (in Chinese) (1)

Z. H. Wang, Semiconductor Information (in Chinese) 37, 21 (2000).

Other (3)

D. Dimos, B. H. King, and P. Yang, in Proceedings of 1999 International Symposium on Advanced Packaging Materials 186 (1999).

H. L. Li, X. Y. Zeng, and X. Y. Li, Chin. J. Lasers (in Chinese) (to be published).

Q. Zhang and S. F. Jiang, Architectural Door-Window and Metal Building Materials (in Chinese) (10) 24 (2001).

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