Abstract
A practicable experimental method for measuring scattering on rough surfaces
is reported. The scattered patterns are captured on a screen composed of two pieces
of ground glass and then imaged using a charge-coupled device. The scattered
intensity profiles are extracted by converting the patterns in real space into the
wave vector space. Isotropic and anisotropic samples of the rough backsides of
silicon wafer are investigated respectively, and their intensity profiles are
measured. The profiles of the anisotropic sample are obtained by reading the pixels
on the specific orientation curves. The parameters of the samples are extracted
using angle-resolved light-scattering schemes and theories. The results well agree
with measurements obtained using an atomic force microscope.
© 2012 Chinese Optics Letters
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