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Feature issue of Biomedical Optics Express

Superresolution Microscopy on the 25th Anniversary of STED Microscopy and the 20th Anniversary of SIM

Submission Opens:1 September 2019

Submission Deadline: 1 December 2019

Biomedical Optics Express welcomes submissions to a feature issue on "Superresolution Microscopy on the 25th Anniversary of STED Microscopy and the 20th Anniversary of SIM."

This year marks the 25th anniversary of the first paper on stimulated emission depletion (STED) microscopy and the 20th anniversary of the first conference presentation on superresolution structured illumination microscopy (SIM). This feature issue is intended to highlight the rapid growth that has taken place in the past 10 years in research into techniques that increase the resolution of light microscopy beyond the diffraction limit and the increased use of these techniques in biomedical applications.

Topics of interest include the following:

  • Novel superresolution microscopy techniques
  • Novel approaches to STED, RESOLFT, SIM, Nonlinear SIM, Single Molecule Localization Microscopy, and Image Scanning Microscopy
  • Expansion Microscopy and sample preparation techniques that lead to resolution beyond the diffraction limit
  • Novel approaches to analyzing superresolution images
  • Novel reconstruction techniques for SIM and SMLM
  • Deconvolution techniques for superresolution imaging

All submissions need to present original, previously unpublished work and will be subject to the normal standards and peer review processes of the journal. The standard Biomedical Optics Express Article Processing Charges will apply to all published articles.

Please prepare manuscripts according to the author instructions for submission to Biomedical Optics Express and submit through OSA's electronic submission system, specifying from the drop-down menu that the manuscript is for the feature issue on Superresolution Microscopy.

Feature Editors

Peter Kner, University of Georgia, USA (Lead Editor)

Suliana Manley, Swiss Federal Institute of Technology Lausanne, Switzerland

Yoav Shechtman, Technion Israel Institute of Technology, Israel

Sjoerd Stallinga, Delft University of Technology, The Netherlands