Abstract

The use of single-side polished (SSP) silicon wafers is becoming more commonplace in the semiconductor industry, due to the cost involved in polishing wafers. The determination of the oxygen concentration in such wafers is subject to various errors as a result of the scattering of radiation from the uneven backsides. Moreover, the prescribed ASTM procedures for such a determination are based on samples with both sides polished. In addition, one is sometimes required to compare oxygen concentrations in SSP and double-side polished (DSP) wafers.

Improved geometry of double-sided polished parallel wafers prepared for direct wafer bonding

Jan Haisma, Frank J. H. M. van der Kruis, Bert A. C. M. Spierings, Jan Jaap Baalbergen, Bart H. Bijsterveld, Ruud Brehm, Jan H. P. M. Faasen, Jan. J. C. Groenen, Peter W. de Haas, Theo B. J. Haddeman, Theo M. Michielsen, and Jaap Vijfvinkel
Appl. Opt. 33(34) 7945-7954 (1994)

Side-polished fibers

Shiao-Min Tseng and Chin-Lin Chen
Appl. Opt. 31(18) 3438-3447 (1992)

Comparison of single-side and double-side pumping of membrane external-cavity surface-emitting lasers

Hermann Kahle, Jussi-Pekka Penttinen, Hoy-My Phung, Patrik Rajala, Antti Tukiainen, Sanna Ranta, and Mircea Guina
Opt. Lett. 44(5) 1146-1149 (2019)

Double-sided polishing photonic crystal fiber biosensor based on surface plasmon resonance for cancer single cell detection

Zhiwen Zhang, Chi Liu, Xin Liu, Yue Feng, Shaofeng Wang, Tao Shen, and Han Wei
J. Opt. Soc. Am. B 39(4) 1050-1058 (2022)

Dry-transfer technique for polymer-free single-walled carbon nanotube saturable absorber on a side polished fiber

Aram A. Mkrtchyan, Yuriy G. Gladush, Diana Galiakhmetova, Vsevolod Yakovlev, Vadim T. Ahtyamov, and Albert G. Nasibulin
Opt. Mater. Express 9(4) 1551-1561 (2019)