20 September 2007, Volume 46, Issue 27, pp. 6662-6848
24 articles
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Bonding and plasticity: four examples of a 3D overall configuration of lab-on-chip type wafers. Material: borosilicate glass; dimensions: height of (a), (b), and (c) is 100 mm, and of (d) is 90 mm; diameter is 35 mm. For details, see paper by Haisma et al., pp. 6793-6803.
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