Abstract

In this paper we present a method for topography measurement of high gradient reflective microstructures that overcomes the limited numerical aperture (NA) of a digital holographic (DH) system working in reflection. We consider a case when a DH system is unable to register the light reflected from the full sample area due to insufficient NA. To overcome this problem, we propose digital holography in a microscope configuration with an afocal imaging system and a modified object arm in the measurement setup. The proposed modification includes application of a spatial light modulator (SLM) based on liquid crystal on silicon (LCoS) technology for multidirectional plane wave illumination. The variable off-axis illumination enables characterization of the sample regions that cannot be imaged by the limited NA of a classical DH system utilizing on-axis illumination. In the proposed method, the final object topography is merged from a set of captured object waves corresponding to various illumination directions using a novel automatic algorithm. The proposed technique is experimentally validated by full-field measurement of a silicon mold with a high gradient of shape.

© 2015 Optical Society of America

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