Abstract
This study elucidates the effects of columnar angles and deposition angles on the thermal expansion coefficients and intrinsic stress behaviors of films with columnar microstructures. The behaviors associated with temperature-dependent stresses in the films are measured using a phase-shifting Twyman–Green interferometer with a heating stage and the application of a phase reduction algorithm. The thermal expansion coefficients of films at various columnar angles were larger than those of glass substrates. The intrinsic stress in the films with columnar microstructures was compressive, while the thermal stress was tensile. The thermal expansion coefficients of films with columnar microstructures and their intrinsic stress evidently depended on the deposition angle and the columnar angle.
© 2010 Optical Society of America
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