Abstract

Glass welding by ultrashort laser pulses allows joining without the need of an absorber or a preheating and postheating process. However, cracks generated during the welding process substantially impair the joining strength of the welding seams. In this paper a sample preparation method is described that prevents the formation of cracks. The measured joining strength of samples prepared by this method is substantially higher than previously reported values.

© 2011 Optical Society of America

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References

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  1. H. Maruo, I. Miyamoto, and Y. Arata, “CO2 laser welding of ceramics,” in Proceedings of the 1st International Laser Processing Conference (Laser Institute of America, 1981).
  2. I. Alexeev, K. Cvecek, I. Miyamoto, and M. Schmidt, “Ultrafast laser processing of transparent media—glass welding,” Proc. LEF 2010, Laser in der Elektronikproduktion & Feinwerktechnik (Laser in Electronic Production and Precision Mechanics), M.Geiger, M.Schmidt, and C.Kägeler, eds. (Meisenbach Bamberg, 2010), pp. 125–137.
  3. E. Sharon and J. Fineberg, “The dynamics of fast fracture,” Adv. Eng. Mater. 1, 119–122 (1999).
    [CrossRef]
  4. T. Tamaki, W. Watanabe, and K. Itoh, “Laser micro-welding of transparent materials by a localized heat accumulation effect using a femtosecond fiber laser at 1558 nm,” Opt. Express 14, 10460–10468 (2006).
    [CrossRef] [PubMed]
  5. G. Haselhorst, Corporate Machinery and Production Technology, Process and Technology Development, Schott AG (manufacturer of D263 glass), Hattenbergstrasse 10, 55122 Mainz, Germany (personal communication, 2010).
  6. V. Greco, F. Marchesini, and G. Molesini, “Optical contact and van der Waals interactions: the role of the surface topography in determining the bonding strength of thick glass plates,” J. Opt. A: Pure Appl. Opt. 3, 85–88 (2001).
    [CrossRef]
  7. http://labaccessories.mellesgriot.com/pdfs/Cleaning_Methods.pdf.
  8. Z. Tang, T. Shi, G. Liao, and S. Liu, “Modeling the formation of spontaneous wafer direct bonding under low temperature,” Microelectron. Eng. 85, 1754–1757 (2008).
    [CrossRef]

2008

Z. Tang, T. Shi, G. Liao, and S. Liu, “Modeling the formation of spontaneous wafer direct bonding under low temperature,” Microelectron. Eng. 85, 1754–1757 (2008).
[CrossRef]

2006

2001

V. Greco, F. Marchesini, and G. Molesini, “Optical contact and van der Waals interactions: the role of the surface topography in determining the bonding strength of thick glass plates,” J. Opt. A: Pure Appl. Opt. 3, 85–88 (2001).
[CrossRef]

1999

E. Sharon and J. Fineberg, “The dynamics of fast fracture,” Adv. Eng. Mater. 1, 119–122 (1999).
[CrossRef]

Alexeev, I.

I. Alexeev, K. Cvecek, I. Miyamoto, and M. Schmidt, “Ultrafast laser processing of transparent media—glass welding,” Proc. LEF 2010, Laser in der Elektronikproduktion & Feinwerktechnik (Laser in Electronic Production and Precision Mechanics), M.Geiger, M.Schmidt, and C.Kägeler, eds. (Meisenbach Bamberg, 2010), pp. 125–137.

Arata, Y.

H. Maruo, I. Miyamoto, and Y. Arata, “CO2 laser welding of ceramics,” in Proceedings of the 1st International Laser Processing Conference (Laser Institute of America, 1981).

Cvecek, K.

I. Alexeev, K. Cvecek, I. Miyamoto, and M. Schmidt, “Ultrafast laser processing of transparent media—glass welding,” Proc. LEF 2010, Laser in der Elektronikproduktion & Feinwerktechnik (Laser in Electronic Production and Precision Mechanics), M.Geiger, M.Schmidt, and C.Kägeler, eds. (Meisenbach Bamberg, 2010), pp. 125–137.

Fineberg, J.

E. Sharon and J. Fineberg, “The dynamics of fast fracture,” Adv. Eng. Mater. 1, 119–122 (1999).
[CrossRef]

Greco, V.

V. Greco, F. Marchesini, and G. Molesini, “Optical contact and van der Waals interactions: the role of the surface topography in determining the bonding strength of thick glass plates,” J. Opt. A: Pure Appl. Opt. 3, 85–88 (2001).
[CrossRef]

Haselhorst, G.

G. Haselhorst, Corporate Machinery and Production Technology, Process and Technology Development, Schott AG (manufacturer of D263 glass), Hattenbergstrasse 10, 55122 Mainz, Germany (personal communication, 2010).

Itoh, K.

Liao, G.

Z. Tang, T. Shi, G. Liao, and S. Liu, “Modeling the formation of spontaneous wafer direct bonding under low temperature,” Microelectron. Eng. 85, 1754–1757 (2008).
[CrossRef]

Liu, S.

Z. Tang, T. Shi, G. Liao, and S. Liu, “Modeling the formation of spontaneous wafer direct bonding under low temperature,” Microelectron. Eng. 85, 1754–1757 (2008).
[CrossRef]

Marchesini, F.

V. Greco, F. Marchesini, and G. Molesini, “Optical contact and van der Waals interactions: the role of the surface topography in determining the bonding strength of thick glass plates,” J. Opt. A: Pure Appl. Opt. 3, 85–88 (2001).
[CrossRef]

Maruo, H.

H. Maruo, I. Miyamoto, and Y. Arata, “CO2 laser welding of ceramics,” in Proceedings of the 1st International Laser Processing Conference (Laser Institute of America, 1981).

Miyamoto, I.

H. Maruo, I. Miyamoto, and Y. Arata, “CO2 laser welding of ceramics,” in Proceedings of the 1st International Laser Processing Conference (Laser Institute of America, 1981).

I. Alexeev, K. Cvecek, I. Miyamoto, and M. Schmidt, “Ultrafast laser processing of transparent media—glass welding,” Proc. LEF 2010, Laser in der Elektronikproduktion & Feinwerktechnik (Laser in Electronic Production and Precision Mechanics), M.Geiger, M.Schmidt, and C.Kägeler, eds. (Meisenbach Bamberg, 2010), pp. 125–137.

Molesini, G.

V. Greco, F. Marchesini, and G. Molesini, “Optical contact and van der Waals interactions: the role of the surface topography in determining the bonding strength of thick glass plates,” J. Opt. A: Pure Appl. Opt. 3, 85–88 (2001).
[CrossRef]

Schmidt, M.

I. Alexeev, K. Cvecek, I. Miyamoto, and M. Schmidt, “Ultrafast laser processing of transparent media—glass welding,” Proc. LEF 2010, Laser in der Elektronikproduktion & Feinwerktechnik (Laser in Electronic Production and Precision Mechanics), M.Geiger, M.Schmidt, and C.Kägeler, eds. (Meisenbach Bamberg, 2010), pp. 125–137.

Sharon, E.

E. Sharon and J. Fineberg, “The dynamics of fast fracture,” Adv. Eng. Mater. 1, 119–122 (1999).
[CrossRef]

Shi, T.

Z. Tang, T. Shi, G. Liao, and S. Liu, “Modeling the formation of spontaneous wafer direct bonding under low temperature,” Microelectron. Eng. 85, 1754–1757 (2008).
[CrossRef]

Tamaki, T.

Tang, Z.

Z. Tang, T. Shi, G. Liao, and S. Liu, “Modeling the formation of spontaneous wafer direct bonding under low temperature,” Microelectron. Eng. 85, 1754–1757 (2008).
[CrossRef]

Watanabe, W.

Adv. Eng. Mater.

E. Sharon and J. Fineberg, “The dynamics of fast fracture,” Adv. Eng. Mater. 1, 119–122 (1999).
[CrossRef]

J. Opt. A: Pure Appl. Opt.

V. Greco, F. Marchesini, and G. Molesini, “Optical contact and van der Waals interactions: the role of the surface topography in determining the bonding strength of thick glass plates,” J. Opt. A: Pure Appl. Opt. 3, 85–88 (2001).
[CrossRef]

Microelectron. Eng.

Z. Tang, T. Shi, G. Liao, and S. Liu, “Modeling the formation of spontaneous wafer direct bonding under low temperature,” Microelectron. Eng. 85, 1754–1757 (2008).
[CrossRef]

Opt. Express

Other

G. Haselhorst, Corporate Machinery and Production Technology, Process and Technology Development, Schott AG (manufacturer of D263 glass), Hattenbergstrasse 10, 55122 Mainz, Germany (personal communication, 2010).

H. Maruo, I. Miyamoto, and Y. Arata, “CO2 laser welding of ceramics,” in Proceedings of the 1st International Laser Processing Conference (Laser Institute of America, 1981).

I. Alexeev, K. Cvecek, I. Miyamoto, and M. Schmidt, “Ultrafast laser processing of transparent media—glass welding,” Proc. LEF 2010, Laser in der Elektronikproduktion & Feinwerktechnik (Laser in Electronic Production and Precision Mechanics), M.Geiger, M.Schmidt, and C.Kägeler, eds. (Meisenbach Bamberg, 2010), pp. 125–137.

http://labaccessories.mellesgriot.com/pdfs/Cleaning_Methods.pdf.

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Figures (5)

Fig. 1
Fig. 1

Schematics of the glass welding setup. The inset shows the shear strength measurement.

Fig. 2
Fig. 2

Schematics of the layout of the optical contact area and the welding seam on a sample.

Fig. 3
Fig. 3

Optical microscope image (transmission) of welded samples with gap (top view).

Fig. 4
Fig. 4

Images of peeled off welding seams from samples with gap. (a) Optical microscope, (b) SEM.

Fig. 5
Fig. 5

Experimental shear force measurement results.

Equations (2)

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d = ( 2 · k + 1 ) λ / 4 ,
σ = F W F OC A Welding

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