Abstract

A vertical-cavity surface-emitting laser based bidirectional free-space optical interconnect has been implemented to interconnect two printed circuit boards. A total of 512 clustered channels with a density of 2844 channels/cm2 are transmitted over a distance of 83 mm. The optical interconnect is a combination of refractive microlenses and diffractive minilens relays.

© 2002 Optical Society of America

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    [CrossRef]
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    [CrossRef] [PubMed]
  26. F. Lacroix, M. Châteauneuf, X. Xue, A. G. Kirk, “Experimental and numerical analyses of misalignment tolerances in free-space interconnects,” Appl. Opt. 39, 704–713 (2000).
    [CrossRef]
  27. wB. Robertson, Y. Liu, G. C. Boisset, M. R. Tagizadeh, D. V. Plant, “In situ interferometric alignment systems for the assembly of microchannel relay systems,” Appl. Opt. 36, 9253–9260 (1997).
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2001 (1)

2000 (6)

T. Maj, A. G. Kirk, D. V. Plant, J. F. Ahadian, C. G. Fonstad, K. L. Lear, K. Tatah, M. S. Robinson, J. A. Trezza, “Interconnection of a two-dimensional array of vertical-cavity surface-emitting lasers to a receiver array by means of a fiber image guide,” Appl. Opt. 39, 683–689 (2000).
[CrossRef]

A. V. Krishnamoorthy, K. W. Goossen, L. M. F. Chirovsky, R. G. Rozier, P. Chandramani, W. S. Hobson, S. P. Hui, J. Lopata, J. A. Walker, L. S. D’Asaro, “16 × 16 VCSEL array flip-chip bonded to CMOS VLSI circuit,” IEEE Photon. Technol. Lett. 12, 1073–1075 (2000).
[CrossRef]

M. W. Haney, M. P. Christianson, F. Milojkovic, G. J. Fokken, M. Vickberg, B. K. Gilbert, J. Rieve, J. Erkman, P. Chandramani, F. Kiamilev, “Description and evaluation of the fast-net smart pixel-based optical interconnection prototype,” Proc. IEEE 88, 819–828 (2000).
[CrossRef]

H. Thienpont, V. Baukens, H. Ottevaere, P. Vynck, P. Tuteleers, G. Verschaffelt, B. Volckaerts, A. Hermanne, M. Hanney, “Plastic microoptical interconnect modules for parallel free-space inter- and intra-MCM data communication,” Proc. IEEE 88, 769–779 (2000).
[CrossRef]

D. M. Chiarulli, S. P. Levitan, P. Derr, R. Hofmann, B. Greiner, M. Robinson, “Demonstration of a multichannel optical interconnection by use of imaging fiber bundles butt coupled to optoelectronic circuits,” Appl. Opt. 39, 698–703 (2000).
[CrossRef]

F. Lacroix, M. Châteauneuf, X. Xue, A. G. Kirk, “Experimental and numerical analyses of misalignment tolerances in free-space interconnects,” Appl. Opt. 39, 704–713 (2000).
[CrossRef]

1999 (5)

B. Bostica, M. Burzio, F. Delpiano, P. Pellegrino, L. Pesando, “Ten-channel optical transmitter module for sub-system interconnection operating at λ = 1.3 µm up to 12.5 Gbit/s,” IEEE Trans. Advanced Packag. 22, 442–450 (1999).
[CrossRef]

M. H. Ayliffe, D. Kabal, F. Lacroix, E. Bernier, P. Khurana, A. G. Kirk, F. A. P. Tooley, D. V. Plant, “Electrical, thermal, and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects,” J. Opt. Soc. A: Pure Appl. Opt. 1, 267–271 (1999).
[CrossRef]

M. Datta, M. Dagenais, “Electroless remetallization of aluminum bond pads on CMOS driver chip for flip-chip attachment to vertical cavity surface emitting lasers (VCSEL’s),” IEEE Transaction on Components Packag. Technol. Part A 22, 299–306 (1999).
[CrossRef]

D. T. Neilson, “Tolerance of optical interconnections to misalignment,” Appl. Opt. 38, 2282–2290 (1999).
[CrossRef]

D. T. Neilson, E. Schenfeld, “Free-space optical relay for the interconnection of multimode fibers,” Appl. Opt. 38, 2291–2296 (1999).
[CrossRef]

1998 (3)

1997 (3)

H. Kosaka, M. Kajita, Y. Li, Y. Sugimoto, “A two-dimensional optical parallel transmission using a vertical-cavity surface-emitting laser array module and an image fiber,” IEEE Photon. Technol. Lett. 9, 253–255 (1997).
[CrossRef]

G. J. Grimes, J. P. C. Markush, Y. M. Wong, P. J. Anthony, B. Holland, E. G. Priest, C. J. Sherman, S. R. Peck, D. J. Muehlner, C. C. Faudskar, J. S. Nyquist, J. S. Helton, C. A Lepthian, G. L. Sonnier, J. V. Gates, W. K. Honea, J. R. Bortolini, “Photonic packaging using laser/receiver arrays and flexible optical circuits,” IEEE Trans. Components Packag. Manuf. Technol. Part B, 20, 409–415 (1997).
[CrossRef]

wB. Robertson, Y. Liu, G. C. Boisset, M. R. Tagizadeh, D. V. Plant, “In situ interferometric alignment systems for the assembly of microchannel relay systems,” Appl. Opt. 36, 9253–9260 (1997).
[CrossRef]

1996 (3)

F. A. P. Tooley, “Challenges in optically interconnecting electronics,” IEEE J. Sel. Top. Quantum Electron. 2, 3–13 (1996).
[CrossRef]

D. R. Rolston, B. Robertson, H. S. Hinton, D. V. Plant, “Analysis of a microchannel interconnect based on the clustering of smart-pixel-device windows,” Appl. Opt. 35, 1220–1233 (1996).
[CrossRef] [PubMed]

D. B. Schwartz, C. K. Y. Chun, B. M. Foley, D. H. Hartman, M. Lebby, H. C. Lee, C. L. Shieh, S. M. Kuo, S. G. Shook, B. Webb, “A low-cost high-performance optical interconnect,” IEEE Trans. Components, Packag. Manuf. Technol. Part B 19, 532–538 (1996).
[CrossRef]

1995 (1)

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
[CrossRef]

1992 (1)

1991 (1)

A. W. Lohmann, “Image formation of dilute arrays for optical information processing,” Opt. Communi. 86, 365–370 (1991).
[CrossRef]

Ahadian, J. F.

Aispain, H. A.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
[CrossRef]

Anthony, P. J.

G. J. Grimes, J. P. C. Markush, Y. M. Wong, P. J. Anthony, B. Holland, E. G. Priest, C. J. Sherman, S. R. Peck, D. J. Muehlner, C. C. Faudskar, J. S. Nyquist, J. S. Helton, C. A Lepthian, G. L. Sonnier, J. V. Gates, W. K. Honea, J. R. Bortolini, “Photonic packaging using laser/receiver arrays and flexible optical circuits,” IEEE Trans. Components Packag. Manuf. Technol. Part B, 20, 409–415 (1997).
[CrossRef]

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
[CrossRef]

Ayliffe, M. H.

M. H. Ayliffe, D. Kabal, F. Lacroix, E. Bernier, P. Khurana, A. G. Kirk, F. A. P. Tooley, D. V. Plant, “Electrical, thermal, and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects,” J. Opt. Soc. A: Pure Appl. Opt. 1, 267–271 (1999).
[CrossRef]

F. Lacroix, B. Robertson, M. H. Ayliffe, E. Bernier, F. A. P. Tooley, M. Châteauneuf, D. V. Plant, A. G. Kirk, “Design and implementation of a four-stage clustered free-space opticalinterconnect,” in Optics in Computing 1998, R. H. Chavel, D. A. Miller, H. Thienpont, eds., Proc. SPIE3490, 107–110 (1998).

Bates, R. J. S.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
[CrossRef]

Baukens, V.

H. Thienpont, V. Baukens, H. Ottevaere, P. Vynck, P. Tuteleers, G. Verschaffelt, B. Volckaerts, A. Hermanne, M. Hanney, “Plastic microoptical interconnect modules for parallel free-space inter- and intra-MCM data communication,” Proc. IEEE 88, 769–779 (2000).
[CrossRef]

V. Baukens, “Scalable micro-optical modules for short-distance photonic-VLSI interconnections; Ph.D. dissertation (Vrije Universiteit Brussel, Brussels, Belgium, 2001).

Berger, C.

C. Berger, J. Ekman, X. Wang, P. Marchand, H. Spaanenburg, F. Kiamilev, S. Esener, “Parallel distributed free-space optoelectronic compute engine using flat “plug-on-top”, optics package,” in Optics in Computing 2000, R.A. Lessard, T. V. Galsrian, eds., Proc. SPIE4089, 1037–1045 (2000).
[CrossRef]

Bernier, E.

M. H. Ayliffe, D. Kabal, F. Lacroix, E. Bernier, P. Khurana, A. G. Kirk, F. A. P. Tooley, D. V. Plant, “Electrical, thermal, and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects,” J. Opt. Soc. A: Pure Appl. Opt. 1, 267–271 (1999).
[CrossRef]

F. Lacroix, B. Robertson, M. H. Ayliffe, E. Bernier, F. A. P. Tooley, M. Châteauneuf, D. V. Plant, A. G. Kirk, “Design and implementation of a four-stage clustered free-space opticalinterconnect,” in Optics in Computing 1998, R. H. Chavel, D. A. Miller, H. Thienpont, eds., Proc. SPIE3490, 107–110 (1998).

Boisset, G. C.

Bortolini, J. R.

G. J. Grimes, J. P. C. Markush, Y. M. Wong, P. J. Anthony, B. Holland, E. G. Priest, C. J. Sherman, S. R. Peck, D. J. Muehlner, C. C. Faudskar, J. S. Nyquist, J. S. Helton, C. A Lepthian, G. L. Sonnier, J. V. Gates, W. K. Honea, J. R. Bortolini, “Photonic packaging using laser/receiver arrays and flexible optical circuits,” IEEE Trans. Components Packag. Manuf. Technol. Part B, 20, 409–415 (1997).
[CrossRef]

Bostica, B.

B. Bostica, M. Burzio, F. Delpiano, P. Pellegrino, L. Pesando, “Ten-channel optical transmitter module for sub-system interconnection operating at λ = 1.3 µm up to 12.5 Gbit/s,” IEEE Trans. Advanced Packag. 22, 442–450 (1999).
[CrossRef]

Brandner, J. L.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
[CrossRef]

Buchholz, D. B.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
[CrossRef]

Burzio, M.

B. Bostica, M. Burzio, F. Delpiano, P. Pellegrino, L. Pesando, “Ten-channel optical transmitter module for sub-system interconnection operating at λ = 1.3 µm up to 12.5 Gbit/s,” IEEE Trans. Advanced Packag. 22, 442–450 (1999).
[CrossRef]

Chandramani, P.

M. W. Haney, M. P. Christianson, F. Milojkovic, G. J. Fokken, M. Vickberg, B. K. Gilbert, J. Rieve, J. Erkman, P. Chandramani, F. Kiamilev, “Description and evaluation of the fast-net smart pixel-based optical interconnection prototype,” Proc. IEEE 88, 819–828 (2000).
[CrossRef]

A. V. Krishnamoorthy, K. W. Goossen, L. M. F. Chirovsky, R. G. Rozier, P. Chandramani, W. S. Hobson, S. P. Hui, J. Lopata, J. A. Walker, L. S. D’Asaro, “16 × 16 VCSEL array flip-chip bonded to CMOS VLSI circuit,” IEEE Photon. Technol. Lett. 12, 1073–1075 (2000).
[CrossRef]

Châteauneuf, M.

D. V. Plant, M. B. Venditti, E. Laprise, J. Faucher, K. Razavi, M. Châteauneuf, A. G. Kirk, “A 256 channel bi-directional optical interconnect using VCSELs and photodiodes on CMOS,” J. Lightwave Technol., 19, 1093–1103 (2001).
[CrossRef]

F. Lacroix, M. Châteauneuf, X. Xue, A. G. Kirk, “Experimental and numerical analyses of misalignment tolerances in free-space interconnects,” Appl. Opt. 39, 704–713 (2000).
[CrossRef]

D. V. Plant, J. A. Trezza, M. Venditti, E. Laprise, J. Faucher, K. Razavi, M. Châteauneuf, T. Maj, A. Ghanem, F. Thomas-Dupuis, P. Seghal, A. G. Kirk, W. Luo, “A 256 Channel bidirectional optical interconnect using VCSELs and Photodiode on CMOS,” in Optics in Computing 2000, R. A Lessard, T. V. Galsrian, eds., Proc. SPIE4089, 1046–1054 (2000).
[CrossRef]

F. Lacroix, B. Robertson, M. H. Ayliffe, E. Bernier, F. A. P. Tooley, M. Châteauneuf, D. V. Plant, A. G. Kirk, “Design and implementation of a four-stage clustered free-space opticalinterconnect,” in Optics in Computing 1998, R. H. Chavel, D. A. Miller, H. Thienpont, eds., Proc. SPIE3490, 107–110 (1998).

Chiarulli, D. M.

Chirovsky, L. M. F.

A. V. Krishnamoorthy, K. W. Goossen, L. M. F. Chirovsky, R. G. Rozier, P. Chandramani, W. S. Hobson, S. P. Hui, J. Lopata, J. A. Walker, L. S. D’Asaro, “16 × 16 VCSEL array flip-chip bonded to CMOS VLSI circuit,” IEEE Photon. Technol. Lett. 12, 1073–1075 (2000).
[CrossRef]

Christianson, M. P.

M. W. Haney, M. P. Christianson, F. Milojkovic, G. J. Fokken, M. Vickberg, B. K. Gilbert, J. Rieve, J. Erkman, P. Chandramani, F. Kiamilev, “Description and evaluation of the fast-net smart pixel-based optical interconnection prototype,” Proc. IEEE 88, 819–828 (2000).
[CrossRef]

Chun, C. K. Y.

D. B. Schwartz, C. K. Y. Chun, B. M. Foley, D. H. Hartman, M. Lebby, H. C. Lee, C. L. Shieh, S. M. Kuo, S. G. Shook, B. Webb, “A low-cost high-performance optical interconnect,” IEEE Trans. Components, Packag. Manuf. Technol. Part B 19, 532–538 (1996).
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Craig, R.

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Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
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A. V. Krishnamoorthy, K. W. Goossen, L. M. F. Chirovsky, R. G. Rozier, P. Chandramani, W. S. Hobson, S. P. Hui, J. Lopata, J. A. Walker, L. S. D’Asaro, “16 × 16 VCSEL array flip-chip bonded to CMOS VLSI circuit,” IEEE Photon. Technol. Lett. 12, 1073–1075 (2000).
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M. Datta, M. Dagenais, “Electroless remetallization of aluminum bond pads on CMOS driver chip for flip-chip attachment to vertical cavity surface emitting lasers (VCSEL’s),” IEEE Transaction on Components Packag. Technol. Part A 22, 299–306 (1999).
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Däschner, W.

Datta, M.

M. Datta, M. Dagenais, “Electroless remetallization of aluminum bond pads on CMOS driver chip for flip-chip attachment to vertical cavity surface emitting lasers (VCSEL’s),” IEEE Transaction on Components Packag. Technol. Part A 22, 299–306 (1999).
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Derr, P.

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C. Berger, J. Ekman, X. Wang, P. Marchand, H. Spaanenburg, F. Kiamilev, S. Esener, “Parallel distributed free-space optoelectronic compute engine using flat “plug-on-top”, optics package,” in Optics in Computing 2000, R.A. Lessard, T. V. Galsrian, eds., Proc. SPIE4089, 1037–1045 (2000).
[CrossRef]

Erkman, J.

M. W. Haney, M. P. Christianson, F. Milojkovic, G. J. Fokken, M. Vickberg, B. K. Gilbert, J. Rieve, J. Erkman, P. Chandramani, F. Kiamilev, “Description and evaluation of the fast-net smart pixel-based optical interconnection prototype,” Proc. IEEE 88, 819–828 (2000).
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Esener, S.

C. Berger, J. Ekman, X. Wang, P. Marchand, H. Spaanenburg, F. Kiamilev, S. Esener, “Parallel distributed free-space optoelectronic compute engine using flat “plug-on-top”, optics package,” in Optics in Computing 2000, R.A. Lessard, T. V. Galsrian, eds., Proc. SPIE4089, 1037–1045 (2000).
[CrossRef]

Faucher, J.

D. V. Plant, M. B. Venditti, E. Laprise, J. Faucher, K. Razavi, M. Châteauneuf, A. G. Kirk, “A 256 channel bi-directional optical interconnect using VCSELs and photodiodes on CMOS,” J. Lightwave Technol., 19, 1093–1103 (2001).
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D. V. Plant, J. A. Trezza, M. Venditti, E. Laprise, J. Faucher, K. Razavi, M. Châteauneuf, T. Maj, A. Ghanem, F. Thomas-Dupuis, P. Seghal, A. G. Kirk, W. Luo, “A 256 Channel bidirectional optical interconnect using VCSELs and Photodiode on CMOS,” in Optics in Computing 2000, R. A Lessard, T. V. Galsrian, eds., Proc. SPIE4089, 1046–1054 (2000).
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Faudskar, C. C.

G. J. Grimes, J. P. C. Markush, Y. M. Wong, P. J. Anthony, B. Holland, E. G. Priest, C. J. Sherman, S. R. Peck, D. J. Muehlner, C. C. Faudskar, J. S. Nyquist, J. S. Helton, C. A Lepthian, G. L. Sonnier, J. V. Gates, W. K. Honea, J. R. Bortolini, “Photonic packaging using laser/receiver arrays and flexible optical circuits,” IEEE Trans. Components Packag. Manuf. Technol. Part B, 20, 409–415 (1997).
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Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
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Fishteyn, M.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
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Focht, M. W.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
[CrossRef]

Fokken, G. J.

M. W. Haney, M. P. Christianson, F. Milojkovic, G. J. Fokken, M. Vickberg, B. K. Gilbert, J. Rieve, J. Erkman, P. Chandramani, F. Kiamilev, “Description and evaluation of the fast-net smart pixel-based optical interconnection prototype,” Proc. IEEE 88, 819–828 (2000).
[CrossRef]

Foley, B. M.

D. B. Schwartz, C. K. Y. Chun, B. M. Foley, D. H. Hartman, M. Lebby, H. C. Lee, C. L. Shieh, S. M. Kuo, S. G. Shook, B. Webb, “A low-cost high-performance optical interconnect,” IEEE Trans. Components, Packag. Manuf. Technol. Part B 19, 532–538 (1996).
[CrossRef]

Fonstad, C. G.

Gates, J. V.

G. J. Grimes, J. P. C. Markush, Y. M. Wong, P. J. Anthony, B. Holland, E. G. Priest, C. J. Sherman, S. R. Peck, D. J. Muehlner, C. C. Faudskar, J. S. Nyquist, J. S. Helton, C. A Lepthian, G. L. Sonnier, J. V. Gates, W. K. Honea, J. R. Bortolini, “Photonic packaging using laser/receiver arrays and flexible optical circuits,” IEEE Trans. Components Packag. Manuf. Technol. Part B, 20, 409–415 (1997).
[CrossRef]

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
[CrossRef]

Ghanem, A.

D. V. Plant, J. A. Trezza, M. Venditti, E. Laprise, J. Faucher, K. Razavi, M. Châteauneuf, T. Maj, A. Ghanem, F. Thomas-Dupuis, P. Seghal, A. G. Kirk, W. Luo, “A 256 Channel bidirectional optical interconnect using VCSELs and Photodiode on CMOS,” in Optics in Computing 2000, R. A Lessard, T. V. Galsrian, eds., Proc. SPIE4089, 1046–1054 (2000).
[CrossRef]

Gilbert, B. K.

M. W. Haney, M. P. Christianson, F. Milojkovic, G. J. Fokken, M. Vickberg, B. K. Gilbert, J. Rieve, J. Erkman, P. Chandramani, F. Kiamilev, “Description and evaluation of the fast-net smart pixel-based optical interconnection prototype,” Proc. IEEE 88, 819–828 (2000).
[CrossRef]

Glogovski, K. G.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
[CrossRef]

Goossen, K. W.

A. V. Krishnamoorthy, K. W. Goossen, L. M. F. Chirovsky, R. G. Rozier, P. Chandramani, W. S. Hobson, S. P. Hui, J. Lopata, J. A. Walker, L. S. D’Asaro, “16 × 16 VCSEL array flip-chip bonded to CMOS VLSI circuit,” IEEE Photon. Technol. Lett. 12, 1073–1075 (2000).
[CrossRef]

Gowda, S. M.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
[CrossRef]

Greiner, B.

Grimes, G. J.

G. J. Grimes, J. P. C. Markush, Y. M. Wong, P. J. Anthony, B. Holland, E. G. Priest, C. J. Sherman, S. R. Peck, D. J. Muehlner, C. C. Faudskar, J. S. Nyquist, J. S. Helton, C. A Lepthian, G. L. Sonnier, J. V. Gates, W. K. Honea, J. R. Bortolini, “Photonic packaging using laser/receiver arrays and flexible optical circuits,” IEEE Trans. Components Packag. Manuf. Technol. Part B, 20, 409–415 (1997).
[CrossRef]

Guth, G. D.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
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Haney, M. W.

M. W. Haney, M. P. Christianson, F. Milojkovic, G. J. Fokken, M. Vickberg, B. K. Gilbert, J. Rieve, J. Erkman, P. Chandramani, F. Kiamilev, “Description and evaluation of the fast-net smart pixel-based optical interconnection prototype,” Proc. IEEE 88, 819–828 (2000).
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Hanney, M.

H. Thienpont, V. Baukens, H. Ottevaere, P. Vynck, P. Tuteleers, G. Verschaffelt, B. Volckaerts, A. Hermanne, M. Hanney, “Plastic microoptical interconnect modules for parallel free-space inter- and intra-MCM data communication,” Proc. IEEE 88, 769–779 (2000).
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Hartman, D. H.

D. B. Schwartz, C. K. Y. Chun, B. M. Foley, D. H. Hartman, M. Lebby, H. C. Lee, C. L. Shieh, S. M. Kuo, S. G. Shook, B. Webb, “A low-cost high-performance optical interconnect,” IEEE Trans. Components, Packag. Manuf. Technol. Part B 19, 532–538 (1996).
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Helton, J. S.

G. J. Grimes, J. P. C. Markush, Y. M. Wong, P. J. Anthony, B. Holland, E. G. Priest, C. J. Sherman, S. R. Peck, D. J. Muehlner, C. C. Faudskar, J. S. Nyquist, J. S. Helton, C. A Lepthian, G. L. Sonnier, J. V. Gates, W. K. Honea, J. R. Bortolini, “Photonic packaging using laser/receiver arrays and flexible optical circuits,” IEEE Trans. Components Packag. Manuf. Technol. Part B, 20, 409–415 (1997).
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Hermanne, A.

H. Thienpont, V. Baukens, H. Ottevaere, P. Vynck, P. Tuteleers, G. Verschaffelt, B. Volckaerts, A. Hermanne, M. Hanney, “Plastic microoptical interconnect modules for parallel free-space inter- and intra-MCM data communication,” Proc. IEEE 88, 769–779 (2000).
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Hinton, H. S.

Hobson, W. S.

A. V. Krishnamoorthy, K. W. Goossen, L. M. F. Chirovsky, R. G. Rozier, P. Chandramani, W. S. Hobson, S. P. Hui, J. Lopata, J. A. Walker, L. S. D’Asaro, “16 × 16 VCSEL array flip-chip bonded to CMOS VLSI circuit,” IEEE Photon. Technol. Lett. 12, 1073–1075 (2000).
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Hofmann, R.

Holland, B.

G. J. Grimes, J. P. C. Markush, Y. M. Wong, P. J. Anthony, B. Holland, E. G. Priest, C. J. Sherman, S. R. Peck, D. J. Muehlner, C. C. Faudskar, J. S. Nyquist, J. S. Helton, C. A Lepthian, G. L. Sonnier, J. V. Gates, W. K. Honea, J. R. Bortolini, “Photonic packaging using laser/receiver arrays and flexible optical circuits,” IEEE Trans. Components Packag. Manuf. Technol. Part B, 20, 409–415 (1997).
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Honea, W. K.

G. J. Grimes, J. P. C. Markush, Y. M. Wong, P. J. Anthony, B. Holland, E. G. Priest, C. J. Sherman, S. R. Peck, D. J. Muehlner, C. C. Faudskar, J. S. Nyquist, J. S. Helton, C. A Lepthian, G. L. Sonnier, J. V. Gates, W. K. Honea, J. R. Bortolini, “Photonic packaging using laser/receiver arrays and flexible optical circuits,” IEEE Trans. Components Packag. Manuf. Technol. Part B, 20, 409–415 (1997).
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Hui, S. P.

A. V. Krishnamoorthy, K. W. Goossen, L. M. F. Chirovsky, R. G. Rozier, P. Chandramani, W. S. Hobson, S. P. Hui, J. Lopata, J. A. Walker, L. S. D’Asaro, “16 × 16 VCSEL array flip-chip bonded to CMOS VLSI circuit,” IEEE Photon. Technol. Lett. 12, 1073–1075 (2000).
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Ireland, T. J.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
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Jahns, J.

Kabal, D.

M. H. Ayliffe, D. Kabal, F. Lacroix, E. Bernier, P. Khurana, A. G. Kirk, F. A. P. Tooley, D. V. Plant, “Electrical, thermal, and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects,” J. Opt. Soc. A: Pure Appl. Opt. 1, 267–271 (1999).
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Kajita, M.

H. Kosaka, M. Kajita, Y. Li, Y. Sugimoto, “A two-dimensional optical parallel transmission using a vertical-cavity surface-emitting laser array module and an image fiber,” IEEE Photon. Technol. Lett. 9, 253–255 (1997).
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Khurana, P.

M. H. Ayliffe, D. Kabal, F. Lacroix, E. Bernier, P. Khurana, A. G. Kirk, F. A. P. Tooley, D. V. Plant, “Electrical, thermal, and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects,” J. Opt. Soc. A: Pure Appl. Opt. 1, 267–271 (1999).
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Kiamilev, F.

M. W. Haney, M. P. Christianson, F. Milojkovic, G. J. Fokken, M. Vickberg, B. K. Gilbert, J. Rieve, J. Erkman, P. Chandramani, F. Kiamilev, “Description and evaluation of the fast-net smart pixel-based optical interconnection prototype,” Proc. IEEE 88, 819–828 (2000).
[CrossRef]

C. Berger, J. Ekman, X. Wang, P. Marchand, H. Spaanenburg, F. Kiamilev, S. Esener, “Parallel distributed free-space optoelectronic compute engine using flat “plug-on-top”, optics package,” in Optics in Computing 2000, R.A. Lessard, T. V. Galsrian, eds., Proc. SPIE4089, 1037–1045 (2000).
[CrossRef]

Kirk, A. G.

D. V. Plant, M. B. Venditti, E. Laprise, J. Faucher, K. Razavi, M. Châteauneuf, A. G. Kirk, “A 256 channel bi-directional optical interconnect using VCSELs and photodiodes on CMOS,” J. Lightwave Technol., 19, 1093–1103 (2001).
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T. Maj, A. G. Kirk, D. V. Plant, J. F. Ahadian, C. G. Fonstad, K. L. Lear, K. Tatah, M. S. Robinson, J. A. Trezza, “Interconnection of a two-dimensional array of vertical-cavity surface-emitting lasers to a receiver array by means of a fiber image guide,” Appl. Opt. 39, 683–689 (2000).
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F. Lacroix, M. Châteauneuf, X. Xue, A. G. Kirk, “Experimental and numerical analyses of misalignment tolerances in free-space interconnects,” Appl. Opt. 39, 704–713 (2000).
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M. H. Ayliffe, D. Kabal, F. Lacroix, E. Bernier, P. Khurana, A. G. Kirk, F. A. P. Tooley, D. V. Plant, “Electrical, thermal, and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects,” J. Opt. Soc. A: Pure Appl. Opt. 1, 267–271 (1999).
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D. V. Plant, J. A. Trezza, M. Venditti, E. Laprise, J. Faucher, K. Razavi, M. Châteauneuf, T. Maj, A. Ghanem, F. Thomas-Dupuis, P. Seghal, A. G. Kirk, W. Luo, “A 256 Channel bidirectional optical interconnect using VCSELs and Photodiode on CMOS,” in Optics in Computing 2000, R. A Lessard, T. V. Galsrian, eds., Proc. SPIE4089, 1046–1054 (2000).
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F. Lacroix, B. Robertson, M. H. Ayliffe, E. Bernier, F. A. P. Tooley, M. Châteauneuf, D. V. Plant, A. G. Kirk, “Design and implementation of a four-stage clustered free-space opticalinterconnect,” in Optics in Computing 1998, R. H. Chavel, D. A. Miller, H. Thienpont, eds., Proc. SPIE3490, 107–110 (1998).

Kosaka, H.

H. Kosaka, M. Kajita, Y. Li, Y. Sugimoto, “A two-dimensional optical parallel transmission using a vertical-cavity surface-emitting laser array module and an image fiber,” IEEE Photon. Technol. Lett. 9, 253–255 (1997).
[CrossRef]

Krishnamoorthy, A. V.

A. V. Krishnamoorthy, K. W. Goossen, L. M. F. Chirovsky, R. G. Rozier, P. Chandramani, W. S. Hobson, S. P. Hui, J. Lopata, J. A. Walker, L. S. D’Asaro, “16 × 16 VCSEL array flip-chip bonded to CMOS VLSI circuit,” IEEE Photon. Technol. Lett. 12, 1073–1075 (2000).
[CrossRef]

Kuchta, D. M.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
[CrossRef]

Kuo, S. M.

D. B. Schwartz, C. K. Y. Chun, B. M. Foley, D. H. Hartman, M. Lebby, H. C. Lee, C. L. Shieh, S. M. Kuo, S. G. Shook, B. Webb, “A low-cost high-performance optical interconnect,” IEEE Trans. Components, Packag. Manuf. Technol. Part B 19, 532–538 (1996).
[CrossRef]

Kwark, Y. H.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
[CrossRef]

Lacroix, F.

F. Lacroix, M. Châteauneuf, X. Xue, A. G. Kirk, “Experimental and numerical analyses of misalignment tolerances in free-space interconnects,” Appl. Opt. 39, 704–713 (2000).
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M. H. Ayliffe, D. Kabal, F. Lacroix, E. Bernier, P. Khurana, A. G. Kirk, F. A. P. Tooley, D. V. Plant, “Electrical, thermal, and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects,” J. Opt. Soc. A: Pure Appl. Opt. 1, 267–271 (1999).
[CrossRef]

F. Lacroix, B. Robertson, M. H. Ayliffe, E. Bernier, F. A. P. Tooley, M. Châteauneuf, D. V. Plant, A. G. Kirk, “Design and implementation of a four-stage clustered free-space opticalinterconnect,” in Optics in Computing 1998, R. H. Chavel, D. A. Miller, H. Thienpont, eds., Proc. SPIE3490, 107–110 (1998).

Laprise, E.

D. V. Plant, M. B. Venditti, E. Laprise, J. Faucher, K. Razavi, M. Châteauneuf, A. G. Kirk, “A 256 channel bi-directional optical interconnect using VCSELs and photodiodes on CMOS,” J. Lightwave Technol., 19, 1093–1103 (2001).
[CrossRef]

D. V. Plant, J. A. Trezza, M. Venditti, E. Laprise, J. Faucher, K. Razavi, M. Châteauneuf, T. Maj, A. Ghanem, F. Thomas-Dupuis, P. Seghal, A. G. Kirk, W. Luo, “A 256 Channel bidirectional optical interconnect using VCSELs and Photodiode on CMOS,” in Optics in Computing 2000, R. A Lessard, T. V. Galsrian, eds., Proc. SPIE4089, 1046–1054 (2000).
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Lear, K. L.

Lebby, M.

D. B. Schwartz, C. K. Y. Chun, B. M. Foley, D. H. Hartman, M. Lebby, H. C. Lee, C. L. Shieh, S. M. Kuo, S. G. Shook, B. Webb, “A low-cost high-performance optical interconnect,” IEEE Trans. Components, Packag. Manuf. Technol. Part B 19, 532–538 (1996).
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Lee, H. C.

D. B. Schwartz, C. K. Y. Chun, B. M. Foley, D. H. Hartman, M. Lebby, H. C. Lee, C. L. Shieh, S. M. Kuo, S. G. Shook, B. Webb, “A low-cost high-performance optical interconnect,” IEEE Trans. Components, Packag. Manuf. Technol. Part B 19, 532–538 (1996).
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Leibenguth, R. E.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
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Lepthian, C. A

G. J. Grimes, J. P. C. Markush, Y. M. Wong, P. J. Anthony, B. Holland, E. G. Priest, C. J. Sherman, S. R. Peck, D. J. Muehlner, C. C. Faudskar, J. S. Nyquist, J. S. Helton, C. A Lepthian, G. L. Sonnier, J. V. Gates, W. K. Honea, J. R. Bortolini, “Photonic packaging using laser/receiver arrays and flexible optical circuits,” IEEE Trans. Components Packag. Manuf. Technol. Part B, 20, 409–415 (1997).
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Levitan, S. P.

Lewis, D. H.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
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Lewis, D. K.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
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Li, B.

Li, Y.

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Liu, Y.

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Lopata, J.

A. V. Krishnamoorthy, K. W. Goossen, L. M. F. Chirovsky, R. G. Rozier, P. Chandramani, W. S. Hobson, S. P. Hui, J. Lopata, J. A. Walker, L. S. D’Asaro, “16 × 16 VCSEL array flip-chip bonded to CMOS VLSI circuit,” IEEE Photon. Technol. Lett. 12, 1073–1075 (2000).
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Luo, W.

D. V. Plant, J. A. Trezza, M. Venditti, E. Laprise, J. Faucher, K. Razavi, M. Châteauneuf, T. Maj, A. Ghanem, F. Thomas-Dupuis, P. Seghal, A. G. Kirk, W. Luo, “A 256 Channel bidirectional optical interconnect using VCSELs and Photodiode on CMOS,” in Optics in Computing 2000, R. A Lessard, T. V. Galsrian, eds., Proc. SPIE4089, 1046–1054 (2000).
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Maj, T.

T. Maj, A. G. Kirk, D. V. Plant, J. F. Ahadian, C. G. Fonstad, K. L. Lear, K. Tatah, M. S. Robinson, J. A. Trezza, “Interconnection of a two-dimensional array of vertical-cavity surface-emitting lasers to a receiver array by means of a fiber image guide,” Appl. Opt. 39, 683–689 (2000).
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D. V. Plant, J. A. Trezza, M. Venditti, E. Laprise, J. Faucher, K. Razavi, M. Châteauneuf, T. Maj, A. Ghanem, F. Thomas-Dupuis, P. Seghal, A. G. Kirk, W. Luo, “A 256 Channel bidirectional optical interconnect using VCSELs and Photodiode on CMOS,” in Optics in Computing 2000, R. A Lessard, T. V. Galsrian, eds., Proc. SPIE4089, 1046–1054 (2000).
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Marchand, P.

C. Berger, J. Ekman, X. Wang, P. Marchand, H. Spaanenburg, F. Kiamilev, S. Esener, “Parallel distributed free-space optoelectronic compute engine using flat “plug-on-top”, optics package,” in Optics in Computing 2000, R.A. Lessard, T. V. Galsrian, eds., Proc. SPIE4089, 1037–1045 (2000).
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Markush, J. P. C.

G. J. Grimes, J. P. C. Markush, Y. M. Wong, P. J. Anthony, B. Holland, E. G. Priest, C. J. Sherman, S. R. Peck, D. J. Muehlner, C. C. Faudskar, J. S. Nyquist, J. S. Helton, C. A Lepthian, G. L. Sonnier, J. V. Gates, W. K. Honea, J. R. Bortolini, “Photonic packaging using laser/receiver arrays and flexible optical circuits,” IEEE Trans. Components Packag. Manuf. Technol. Part B, 20, 409–415 (1997).
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Milojkovic, F.

M. W. Haney, M. P. Christianson, F. Milojkovic, G. J. Fokken, M. Vickberg, B. K. Gilbert, J. Rieve, J. Erkman, P. Chandramani, F. Kiamilev, “Description and evaluation of the fast-net smart pixel-based optical interconnection prototype,” Proc. IEEE 88, 819–828 (2000).
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Morgan, R. A.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
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Muehlner, D. J.

G. J. Grimes, J. P. C. Markush, Y. M. Wong, P. J. Anthony, B. Holland, E. G. Priest, C. J. Sherman, S. R. Peck, D. J. Muehlner, C. C. Faudskar, J. S. Nyquist, J. S. Helton, C. A Lepthian, G. L. Sonnier, J. V. Gates, W. K. Honea, J. R. Bortolini, “Photonic packaging using laser/receiver arrays and flexible optical circuits,” IEEE Trans. Components Packag. Manuf. Technol. Part B, 20, 409–415 (1997).
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Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
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Mullally, T.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
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Nagarajan, R.

Nati, S. F.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
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Neilson, D. T.

Nyquist, J. S.

G. J. Grimes, J. P. C. Markush, Y. M. Wong, P. J. Anthony, B. Holland, E. G. Priest, C. J. Sherman, S. R. Peck, D. J. Muehlner, C. C. Faudskar, J. S. Nyquist, J. S. Helton, C. A Lepthian, G. L. Sonnier, J. V. Gates, W. K. Honea, J. R. Bortolini, “Photonic packaging using laser/receiver arrays and flexible optical circuits,” IEEE Trans. Components Packag. Manuf. Technol. Part B, 20, 409–415 (1997).
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Ottevaere, H.

H. Thienpont, V. Baukens, H. Ottevaere, P. Vynck, P. Tuteleers, G. Verschaffelt, B. Volckaerts, A. Hermanne, M. Hanney, “Plastic microoptical interconnect modules for parallel free-space inter- and intra-MCM data communication,” Proc. IEEE 88, 769–779 (2000).
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Parzygnat, W. J.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
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Peck, S. R.

G. J. Grimes, J. P. C. Markush, Y. M. Wong, P. J. Anthony, B. Holland, E. G. Priest, C. J. Sherman, S. R. Peck, D. J. Muehlner, C. C. Faudskar, J. S. Nyquist, J. S. Helton, C. A Lepthian, G. L. Sonnier, J. V. Gates, W. K. Honea, J. R. Bortolini, “Photonic packaging using laser/receiver arrays and flexible optical circuits,” IEEE Trans. Components Packag. Manuf. Technol. Part B, 20, 409–415 (1997).
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Pellegrino, P.

B. Bostica, M. Burzio, F. Delpiano, P. Pellegrino, L. Pesando, “Ten-channel optical transmitter module for sub-system interconnection operating at λ = 1.3 µm up to 12.5 Gbit/s,” IEEE Trans. Advanced Packag. 22, 442–450 (1999).
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Pesando, L.

B. Bostica, M. Burzio, F. Delpiano, P. Pellegrino, L. Pesando, “Ten-channel optical transmitter module for sub-system interconnection operating at λ = 1.3 µm up to 12.5 Gbit/s,” IEEE Trans. Advanced Packag. 22, 442–450 (1999).
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Plant, D. V.

D. V. Plant, M. B. Venditti, E. Laprise, J. Faucher, K. Razavi, M. Châteauneuf, A. G. Kirk, “A 256 channel bi-directional optical interconnect using VCSELs and photodiodes on CMOS,” J. Lightwave Technol., 19, 1093–1103 (2001).
[CrossRef]

T. Maj, A. G. Kirk, D. V. Plant, J. F. Ahadian, C. G. Fonstad, K. L. Lear, K. Tatah, M. S. Robinson, J. A. Trezza, “Interconnection of a two-dimensional array of vertical-cavity surface-emitting lasers to a receiver array by means of a fiber image guide,” Appl. Opt. 39, 683–689 (2000).
[CrossRef]

M. H. Ayliffe, D. Kabal, F. Lacroix, E. Bernier, P. Khurana, A. G. Kirk, F. A. P. Tooley, D. V. Plant, “Electrical, thermal, and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects,” J. Opt. Soc. A: Pure Appl. Opt. 1, 267–271 (1999).
[CrossRef]

wB. Robertson, Y. Liu, G. C. Boisset, M. R. Tagizadeh, D. V. Plant, “In situ interferometric alignment systems for the assembly of microchannel relay systems,” Appl. Opt. 36, 9253–9260 (1997).
[CrossRef]

D. R. Rolston, B. Robertson, H. S. Hinton, D. V. Plant, “Analysis of a microchannel interconnect based on the clustering of smart-pixel-device windows,” Appl. Opt. 35, 1220–1233 (1996).
[CrossRef] [PubMed]

F. Lacroix, B. Robertson, M. H. Ayliffe, E. Bernier, F. A. P. Tooley, M. Châteauneuf, D. V. Plant, A. G. Kirk, “Design and implementation of a four-stage clustered free-space opticalinterconnect,” in Optics in Computing 1998, R. H. Chavel, D. A. Miller, H. Thienpont, eds., Proc. SPIE3490, 107–110 (1998).

D. V. Plant, J. A. Trezza, M. Venditti, E. Laprise, J. Faucher, K. Razavi, M. Châteauneuf, T. Maj, A. Ghanem, F. Thomas-Dupuis, P. Seghal, A. G. Kirk, W. Luo, “A 256 Channel bidirectional optical interconnect using VCSELs and Photodiode on CMOS,” in Optics in Computing 2000, R. A Lessard, T. V. Galsrian, eds., Proc. SPIE4089, 1046–1054 (2000).
[CrossRef]

Priest, E. G.

G. J. Grimes, J. P. C. Markush, Y. M. Wong, P. J. Anthony, B. Holland, E. G. Priest, C. J. Sherman, S. R. Peck, D. J. Muehlner, C. C. Faudskar, J. S. Nyquist, J. S. Helton, C. A Lepthian, G. L. Sonnier, J. V. Gates, W. K. Honea, J. R. Bortolini, “Photonic packaging using laser/receiver arrays and flexible optical circuits,” IEEE Trans. Components Packag. Manuf. Technol. Part B, 20, 409–415 (1997).
[CrossRef]

Razavi, K.

D. V. Plant, M. B. Venditti, E. Laprise, J. Faucher, K. Razavi, M. Châteauneuf, A. G. Kirk, “A 256 channel bi-directional optical interconnect using VCSELs and photodiodes on CMOS,” J. Lightwave Technol., 19, 1093–1103 (2001).
[CrossRef]

D. V. Plant, J. A. Trezza, M. Venditti, E. Laprise, J. Faucher, K. Razavi, M. Châteauneuf, T. Maj, A. Ghanem, F. Thomas-Dupuis, P. Seghal, A. G. Kirk, W. Luo, “A 256 Channel bidirectional optical interconnect using VCSELs and Photodiode on CMOS,” in Optics in Computing 2000, R. A Lessard, T. V. Galsrian, eds., Proc. SPIE4089, 1046–1054 (2000).
[CrossRef]

Rieve, J.

M. W. Haney, M. P. Christianson, F. Milojkovic, G. J. Fokken, M. Vickberg, B. K. Gilbert, J. Rieve, J. Erkman, P. Chandramani, F. Kiamilev, “Description and evaluation of the fast-net smart pixel-based optical interconnection prototype,” Proc. IEEE 88, 819–828 (2000).
[CrossRef]

Robertson, B.

B. Robertson, “Design of an optical interconnect for photonic backplane applications,” Appl. Opt. 37, 2974–2984 (1998).
[CrossRef]

D. R. Rolston, B. Robertson, H. S. Hinton, D. V. Plant, “Analysis of a microchannel interconnect based on the clustering of smart-pixel-device windows,” Appl. Opt. 35, 1220–1233 (1996).
[CrossRef] [PubMed]

F. Lacroix, B. Robertson, M. H. Ayliffe, E. Bernier, F. A. P. Tooley, M. Châteauneuf, D. V. Plant, A. G. Kirk, “Design and implementation of a four-stage clustered free-space opticalinterconnect,” in Optics in Computing 1998, R. H. Chavel, D. A. Miller, H. Thienpont, eds., Proc. SPIE3490, 107–110 (1998).

Robertson, wB.

Robinson, M.

Robinson, M. S.

Rogers, D. L.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
[CrossRef]

Rolston, D. R.

Rozier, R. G.

A. V. Krishnamoorthy, K. W. Goossen, L. M. F. Chirovsky, R. G. Rozier, P. Chandramani, W. S. Hobson, S. P. Hui, J. Lopata, J. A. Walker, L. S. D’Asaro, “16 × 16 VCSEL array flip-chip bonded to CMOS VLSI circuit,” IEEE Photon. Technol. Lett. 12, 1073–1075 (2000).
[CrossRef]

Schenfeld, E.

Schwartz, D. B.

D. B. Schwartz, C. K. Y. Chun, B. M. Foley, D. H. Hartman, M. Lebby, H. C. Lee, C. L. Shieh, S. M. Kuo, S. G. Shook, B. Webb, “A low-cost high-performance optical interconnect,” IEEE Trans. Components, Packag. Manuf. Technol. Part B 19, 532–538 (1996).
[CrossRef]

Seghal, P.

D. V. Plant, J. A. Trezza, M. Venditti, E. Laprise, J. Faucher, K. Razavi, M. Châteauneuf, T. Maj, A. Ghanem, F. Thomas-Dupuis, P. Seghal, A. G. Kirk, W. Luo, “A 256 Channel bidirectional optical interconnect using VCSELs and Photodiode on CMOS,” in Optics in Computing 2000, R. A Lessard, T. V. Galsrian, eds., Proc. SPIE4089, 1046–1054 (2000).
[CrossRef]

Sha, W.

Sherman, C. J.

G. J. Grimes, J. P. C. Markush, Y. M. Wong, P. J. Anthony, B. Holland, E. G. Priest, C. J. Sherman, S. R. Peck, D. J. Muehlner, C. C. Faudskar, J. S. Nyquist, J. S. Helton, C. A Lepthian, G. L. Sonnier, J. V. Gates, W. K. Honea, J. R. Bortolini, “Photonic packaging using laser/receiver arrays and flexible optical circuits,” IEEE Trans. Components Packag. Manuf. Technol. Part B, 20, 409–415 (1997).
[CrossRef]

Shieh, C. L.

D. B. Schwartz, C. K. Y. Chun, B. M. Foley, D. H. Hartman, M. Lebby, H. C. Lee, C. L. Shieh, S. M. Kuo, S. G. Shook, B. Webb, “A low-cost high-performance optical interconnect,” IEEE Trans. Components, Packag. Manuf. Technol. Part B 19, 532–538 (1996).
[CrossRef]

Shook, S. G.

D. B. Schwartz, C. K. Y. Chun, B. M. Foley, D. H. Hartman, M. Lebby, H. C. Lee, C. L. Shieh, S. M. Kuo, S. G. Shook, B. Webb, “A low-cost high-performance optical interconnect,” IEEE Trans. Components, Packag. Manuf. Technol. Part B 19, 532–538 (1996).
[CrossRef]

Smith, D. F.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
[CrossRef]

Sonnier, G. L.

G. J. Grimes, J. P. C. Markush, Y. M. Wong, P. J. Anthony, B. Holland, E. G. Priest, C. J. Sherman, S. R. Peck, D. J. Muehlner, C. C. Faudskar, J. S. Nyquist, J. S. Helton, C. A Lepthian, G. L. Sonnier, J. V. Gates, W. K. Honea, J. R. Bortolini, “Photonic packaging using laser/receiver arrays and flexible optical circuits,” IEEE Trans. Components Packag. Manuf. Technol. Part B, 20, 409–415 (1997).
[CrossRef]

Spaanenburg, H.

C. Berger, J. Ekman, X. Wang, P. Marchand, H. Spaanenburg, F. Kiamilev, S. Esener, “Parallel distributed free-space optoelectronic compute engine using flat “plug-on-top”, optics package,” in Optics in Computing 2000, R.A. Lessard, T. V. Galsrian, eds., Proc. SPIE4089, 1037–1045 (2000).
[CrossRef]

Sugimoto, Y.

H. Kosaka, M. Kajita, Y. Li, Y. Sugimoto, “A two-dimensional optical parallel transmission using a vertical-cavity surface-emitting laser array module and an image fiber,” IEEE Photon. Technol. Lett. 9, 253–255 (1997).
[CrossRef]

Tagizadeh, M. R.

Tatah, K.

Thienpont, H.

H. Thienpont, V. Baukens, H. Ottevaere, P. Vynck, P. Tuteleers, G. Verschaffelt, B. Volckaerts, A. Hermanne, M. Hanney, “Plastic microoptical interconnect modules for parallel free-space inter- and intra-MCM data communication,” Proc. IEEE 88, 769–779 (2000).
[CrossRef]

Thomas-Dupuis, F.

D. V. Plant, J. A. Trezza, M. Venditti, E. Laprise, J. Faucher, K. Razavi, M. Châteauneuf, T. Maj, A. Ghanem, F. Thomas-Dupuis, P. Seghal, A. G. Kirk, W. Luo, “A 256 Channel bidirectional optical interconnect using VCSELs and Photodiode on CMOS,” in Optics in Computing 2000, R. A Lessard, T. V. Galsrian, eds., Proc. SPIE4089, 1046–1054 (2000).
[CrossRef]

Tooley, F. A. P.

M. H. Ayliffe, D. Kabal, F. Lacroix, E. Bernier, P. Khurana, A. G. Kirk, F. A. P. Tooley, D. V. Plant, “Electrical, thermal, and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects,” J. Opt. Soc. A: Pure Appl. Opt. 1, 267–271 (1999).
[CrossRef]

F. A. P. Tooley, “Challenges in optically interconnecting electronics,” IEEE J. Sel. Top. Quantum Electron. 2, 3–13 (1996).
[CrossRef]

F. Lacroix, B. Robertson, M. H. Ayliffe, E. Bernier, F. A. P. Tooley, M. Châteauneuf, D. V. Plant, A. G. Kirk, “Design and implementation of a four-stage clustered free-space opticalinterconnect,” in Optics in Computing 1998, R. H. Chavel, D. A. Miller, H. Thienpont, eds., Proc. SPIE3490, 107–110 (1998).

Trezza, J. A.

T. Maj, A. G. Kirk, D. V. Plant, J. F. Ahadian, C. G. Fonstad, K. L. Lear, K. Tatah, M. S. Robinson, J. A. Trezza, “Interconnection of a two-dimensional array of vertical-cavity surface-emitting lasers to a receiver array by means of a fiber image guide,” Appl. Opt. 39, 683–689 (2000).
[CrossRef]

D. V. Plant, J. A. Trezza, M. Venditti, E. Laprise, J. Faucher, K. Razavi, M. Châteauneuf, T. Maj, A. Ghanem, F. Thomas-Dupuis, P. Seghal, A. G. Kirk, W. Luo, “A 256 Channel bidirectional optical interconnect using VCSELs and Photodiode on CMOS,” in Optics in Computing 2000, R. A Lessard, T. V. Galsrian, eds., Proc. SPIE4089, 1046–1054 (2000).
[CrossRef]

Tuteleers, P.

H. Thienpont, V. Baukens, H. Ottevaere, P. Vynck, P. Tuteleers, G. Verschaffelt, B. Volckaerts, A. Hermanne, M. Hanney, “Plastic microoptical interconnect modules for parallel free-space inter- and intra-MCM data communication,” Proc. IEEE 88, 769–779 (2000).
[CrossRef]

Tyrone, B. H.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
[CrossRef]

Venditti, M.

D. V. Plant, J. A. Trezza, M. Venditti, E. Laprise, J. Faucher, K. Razavi, M. Châteauneuf, T. Maj, A. Ghanem, F. Thomas-Dupuis, P. Seghal, A. G. Kirk, W. Luo, “A 256 Channel bidirectional optical interconnect using VCSELs and Photodiode on CMOS,” in Optics in Computing 2000, R. A Lessard, T. V. Galsrian, eds., Proc. SPIE4089, 1046–1054 (2000).
[CrossRef]

Venditti, M. B.

Verschaffelt, G.

H. Thienpont, V. Baukens, H. Ottevaere, P. Vynck, P. Tuteleers, G. Verschaffelt, B. Volckaerts, A. Hermanne, M. Hanney, “Plastic microoptical interconnect modules for parallel free-space inter- and intra-MCM data communication,” Proc. IEEE 88, 769–779 (2000).
[CrossRef]

Vickberg, M.

M. W. Haney, M. P. Christianson, F. Milojkovic, G. J. Fokken, M. Vickberg, B. K. Gilbert, J. Rieve, J. Erkman, P. Chandramani, F. Kiamilev, “Description and evaluation of the fast-net smart pixel-based optical interconnection prototype,” Proc. IEEE 88, 819–828 (2000).
[CrossRef]

Volckaerts, B.

H. Thienpont, V. Baukens, H. Ottevaere, P. Vynck, P. Tuteleers, G. Verschaffelt, B. Volckaerts, A. Hermanne, M. Hanney, “Plastic microoptical interconnect modules for parallel free-space inter- and intra-MCM data communication,” Proc. IEEE 88, 769–779 (2000).
[CrossRef]

Vynck, P.

H. Thienpont, V. Baukens, H. Ottevaere, P. Vynck, P. Tuteleers, G. Verschaffelt, B. Volckaerts, A. Hermanne, M. Hanney, “Plastic microoptical interconnect modules for parallel free-space inter- and intra-MCM data communication,” Proc. IEEE 88, 769–779 (2000).
[CrossRef]

Walker, J. A.

A. V. Krishnamoorthy, K. W. Goossen, L. M. F. Chirovsky, R. G. Rozier, P. Chandramani, W. S. Hobson, S. P. Hui, J. Lopata, J. A. Walker, L. S. D’Asaro, “16 × 16 VCSEL array flip-chip bonded to CMOS VLSI circuit,” IEEE Photon. Technol. Lett. 12, 1073–1075 (2000).
[CrossRef]

Walker, S. G.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
[CrossRef]

Wang, X.

C. Berger, J. Ekman, X. Wang, P. Marchand, H. Spaanenburg, F. Kiamilev, S. Esener, “Parallel distributed free-space optoelectronic compute engine using flat “plug-on-top”, optics package,” in Optics in Computing 2000, R.A. Lessard, T. V. Galsrian, eds., Proc. SPIE4089, 1037–1045 (2000).
[CrossRef]

Webb, B.

D. B. Schwartz, C. K. Y. Chun, B. M. Foley, D. H. Hartman, M. Lebby, H. C. Lee, C. L. Shieh, S. M. Kuo, S. G. Shook, B. Webb, “A low-cost high-performance optical interconnect,” IEEE Trans. Components, Packag. Manuf. Technol. Part B 19, 532–538 (1996).
[CrossRef]

Wong, Y. M.

G. J. Grimes, J. P. C. Markush, Y. M. Wong, P. J. Anthony, B. Holland, E. G. Priest, C. J. Sherman, S. R. Peck, D. J. Muehlner, C. C. Faudskar, J. S. Nyquist, J. S. Helton, C. A Lepthian, G. L. Sonnier, J. V. Gates, W. K. Honea, J. R. Bortolini, “Photonic packaging using laser/receiver arrays and flexible optical circuits,” IEEE Trans. Components Packag. Manuf. Technol. Part B, 20, 409–415 (1997).
[CrossRef]

Wong, Y.-M.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
[CrossRef]

Xue, X.

Zilko, J. L.

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
[CrossRef]

Appl. Opt. (9)

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[CrossRef]

D. T. Neilson, E. Schenfeld, “Plastic modules for free-space optical interconnects,” Appl. Opt. 37, 2944–2952 (1998).
[CrossRef]

B. Robertson, “Design of an optical interconnect for photonic backplane applications,” Appl. Opt. 37, 2974–2984 (1998).
[CrossRef]

D. T. Neilson, “Tolerance of optical interconnections to misalignment,” Appl. Opt. 38, 2282–2290 (1999).
[CrossRef]

D. M. Chiarulli, S. P. Levitan, P. Derr, R. Hofmann, B. Greiner, M. Robinson, “Demonstration of a multichannel optical interconnection by use of imaging fiber bundles butt coupled to optoelectronic circuits,” Appl. Opt. 39, 698–703 (2000).
[CrossRef]

F. Lacroix, M. Châteauneuf, X. Xue, A. G. Kirk, “Experimental and numerical analyses of misalignment tolerances in free-space interconnects,” Appl. Opt. 39, 704–713 (2000).
[CrossRef]

D. R. Rolston, B. Robertson, H. S. Hinton, D. V. Plant, “Analysis of a microchannel interconnect based on the clustering of smart-pixel-device windows,” Appl. Opt. 35, 1220–1233 (1996).
[CrossRef] [PubMed]

D. T. Neilson, E. Schenfeld, “Free-space optical relay for the interconnection of multimode fibers,” Appl. Opt. 38, 2291–2296 (1999).
[CrossRef]

T. Maj, A. G. Kirk, D. V. Plant, J. F. Ahadian, C. G. Fonstad, K. L. Lear, K. Tatah, M. S. Robinson, J. A. Trezza, “Interconnection of a two-dimensional array of vertical-cavity surface-emitting lasers to a receiver array by means of a fiber image guide,” Appl. Opt. 39, 683–689 (2000).
[CrossRef]

IEEE J. Sel. Top. Quantum Electron. (1)

F. A. P. Tooley, “Challenges in optically interconnecting electronics,” IEEE J. Sel. Top. Quantum Electron. 2, 3–13 (1996).
[CrossRef]

IEEE Photon. Technol. Lett. (2)

A. V. Krishnamoorthy, K. W. Goossen, L. M. F. Chirovsky, R. G. Rozier, P. Chandramani, W. S. Hobson, S. P. Hui, J. Lopata, J. A. Walker, L. S. D’Asaro, “16 × 16 VCSEL array flip-chip bonded to CMOS VLSI circuit,” IEEE Photon. Technol. Lett. 12, 1073–1075 (2000).
[CrossRef]

H. Kosaka, M. Kajita, Y. Li, Y. Sugimoto, “A two-dimensional optical parallel transmission using a vertical-cavity surface-emitting laser array module and an image fiber,” IEEE Photon. Technol. Lett. 9, 253–255 (1997).
[CrossRef]

IEEE Trans. Advanced Packag. (1)

B. Bostica, M. Burzio, F. Delpiano, P. Pellegrino, L. Pesando, “Ten-channel optical transmitter module for sub-system interconnection operating at λ = 1.3 µm up to 12.5 Gbit/s,” IEEE Trans. Advanced Packag. 22, 442–450 (1999).
[CrossRef]

IEEE Trans. Components Packag. Manuf. Technol. Part B (1)

G. J. Grimes, J. P. C. Markush, Y. M. Wong, P. J. Anthony, B. Holland, E. G. Priest, C. J. Sherman, S. R. Peck, D. J. Muehlner, C. C. Faudskar, J. S. Nyquist, J. S. Helton, C. A Lepthian, G. L. Sonnier, J. V. Gates, W. K. Honea, J. R. Bortolini, “Photonic packaging using laser/receiver arrays and flexible optical circuits,” IEEE Trans. Components Packag. Manuf. Technol. Part B, 20, 409–415 (1997).
[CrossRef]

IEEE Trans. Components, Packag. Manuf. Technol. Part B (1)

D. B. Schwartz, C. K. Y. Chun, B. M. Foley, D. H. Hartman, M. Lebby, H. C. Lee, C. L. Shieh, S. M. Kuo, S. G. Shook, B. Webb, “A low-cost high-performance optical interconnect,” IEEE Trans. Components, Packag. Manuf. Technol. Part B 19, 532–538 (1996).
[CrossRef]

IEEE Transaction on Components Packag. Technol. Part A (1)

M. Datta, M. Dagenais, “Electroless remetallization of aluminum bond pads on CMOS driver chip for flip-chip attachment to vertical cavity surface emitting lasers (VCSEL’s),” IEEE Transaction on Components Packag. Technol. Part A 22, 299–306 (1999).
[CrossRef]

J. Lightwave Technol. (3)

Y.-M. Wong, D. J. Muehlner, C. C. Faudskar, D. B. Buchholz, M. Fishteyn, J. L. Brandner, W. J. Parzygnat, R. A. Morgan, T. Mullally, R. E. Leibenguth, G. D. Guth, M. W. Focht, K. G. Glogovski, J. L. Zilko, J. V. Gates, P. J. Anthony, B. H. Tyrone, T. J. Ireland, D. H. Lewis, D. F. Smith, S. F. Nati, D. K. Lewis, D. L. Rogers, H. A. Aispain, S. M. Gowda, S. G. Walker, Y. H. Kwark, R. J. S. Bates, D. M. Kuchta, J. D. Crow, “Technology development of a high-density 32-channel 16-Gb/s optical data link for optical interconnection application for the Optoelectronis Technology Consortium,” J. Lightwave Technol. 13, 995–1016 (1995).
[CrossRef]

R. Nagarajan, W. Sha, B. Li, R. Craig, “Gigabyte/s parallel fiber-optic links based on edge emitting laser diode arrays,” J. Lightwave Technol. 16, 778–787 (1998).
[CrossRef]

D. V. Plant, M. B. Venditti, E. Laprise, J. Faucher, K. Razavi, M. Châteauneuf, A. G. Kirk, “A 256 channel bi-directional optical interconnect using VCSELs and photodiodes on CMOS,” J. Lightwave Technol., 19, 1093–1103 (2001).
[CrossRef]

J. Opt. Soc. A: Pure Appl. Opt. (1)

M. H. Ayliffe, D. Kabal, F. Lacroix, E. Bernier, P. Khurana, A. G. Kirk, F. A. P. Tooley, D. V. Plant, “Electrical, thermal, and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects,” J. Opt. Soc. A: Pure Appl. Opt. 1, 267–271 (1999).
[CrossRef]

Opt. Communi. (1)

A. W. Lohmann, “Image formation of dilute arrays for optical information processing,” Opt. Communi. 86, 365–370 (1991).
[CrossRef]

Opt. Lett. (1)

Proc. IEEE (2)

M. W. Haney, M. P. Christianson, F. Milojkovic, G. J. Fokken, M. Vickberg, B. K. Gilbert, J. Rieve, J. Erkman, P. Chandramani, F. Kiamilev, “Description and evaluation of the fast-net smart pixel-based optical interconnection prototype,” Proc. IEEE 88, 819–828 (2000).
[CrossRef]

H. Thienpont, V. Baukens, H. Ottevaere, P. Vynck, P. Tuteleers, G. Verschaffelt, B. Volckaerts, A. Hermanne, M. Hanney, “Plastic microoptical interconnect modules for parallel free-space inter- and intra-MCM data communication,” Proc. IEEE 88, 769–779 (2000).
[CrossRef]

Other (4)

C. Berger, J. Ekman, X. Wang, P. Marchand, H. Spaanenburg, F. Kiamilev, S. Esener, “Parallel distributed free-space optoelectronic compute engine using flat “plug-on-top”, optics package,” in Optics in Computing 2000, R.A. Lessard, T. V. Galsrian, eds., Proc. SPIE4089, 1037–1045 (2000).
[CrossRef]

V. Baukens, “Scalable micro-optical modules for short-distance photonic-VLSI interconnections; Ph.D. dissertation (Vrije Universiteit Brussel, Brussels, Belgium, 2001).

F. Lacroix, B. Robertson, M. H. Ayliffe, E. Bernier, F. A. P. Tooley, M. Châteauneuf, D. V. Plant, A. G. Kirk, “Design and implementation of a four-stage clustered free-space opticalinterconnect,” in Optics in Computing 1998, R. H. Chavel, D. A. Miller, H. Thienpont, eds., Proc. SPIE3490, 107–110 (1998).

D. V. Plant, J. A. Trezza, M. Venditti, E. Laprise, J. Faucher, K. Razavi, M. Châteauneuf, T. Maj, A. Ghanem, F. Thomas-Dupuis, P. Seghal, A. G. Kirk, W. Luo, “A 256 Channel bidirectional optical interconnect using VCSELs and Photodiode on CMOS,” in Optics in Computing 2000, R. A Lessard, T. V. Galsrian, eds., Proc. SPIE4089, 1046–1054 (2000).
[CrossRef]

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Figures (10)

Fig. 1
Fig. 1

(a) Illustration of a free-space optical link in a rack configuration, (b) implemented configuration.

Fig. 2
Fig. 2

Schematic drawings of the free-space optical link.

Fig. 3
Fig. 3

Photograph of the chip showing the clustered layout.

Fig. 4
Fig. 4

Maximum throughput as a function of the minilens focal length for a 750-µm cluster pitch.

Fig. 5
Fig. 5

Schematic of the microlens holder with the removable assemblers. The dotted line represents the contour of the optical link.

Fig. 6
Fig. 6

Illustration of the steps onto which the microlens substrate is glued.

Fig. 7
Fig. 7

Beams being focused by the last microlenses (over illuminated). Alternating VCSEL on and off.

Fig. 8
Fig. 8

Results of the power measurements of the beam at the detector plane, (a) 2D map of a cluster, (b) profile of a beam.

Fig. 9
Fig. 9

Light leaking from the prisms (a) obtained from the setup illustrated in (b).

Fig. 10
Fig. 10

Photograph of the assembled system.

Tables (3)

Tables Icon

Table 1 Lens Array Specifications

Tables Icon

Table 2 Misalignment Tolerances

Tables Icon

Table 3 Results of the Optical Link

Equations (1)

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Δx=fL * tansin-1NλDL

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