Through five experiments, we demonstrate and characterize the basic functionality of imaging fiber bundles for optoelectronic chip-level interconnections. We demonstrate the transmission of spot arrays with spot sizes and a spot pitch roughly equal to 2 and 4 times the core pitch, respectively. We show that optoelectronic integrated circuits, including sources and detectors, can be butt coupled directly to fiber bundles without any additional optical elements. We demonstrate a 16-channel interconnect with -23 dB of cross talk, and we characterize the most significant optical loss mechanism. Finally, we show how imaging fiber bundles can be used to implement more complex interconnection structures by an example of a hybrid-bonded structure that implements a low-cost, high-connectivity solution for more advanced system architectures.
© 2000 Optical Society of AmericaFull Article | PDF Article
Xuezhe Zheng, Philippe J. Marchand, Dawei Huang, Osman Kibar, Nur S. E. Ozkan, and Sadik C. Esener
Appl. Opt. 38(26) 5631-5640 (1999)
Yao Li, Ting Wang, Hideo Kosaka, Shigeru Kawai, and Kenichi Kasahara
Appl. Opt. 35(35) 6920-6933 (1996)
Michael W. Haney, Marc P. Christensen, Predrag Milojkovic, Jeremy Ekman, Premanand Chandramani, Richard Rozier, Fouad Kiamilev, Yue Liu, and Mary Hibbs-Brenner
Appl. Opt. 38(29) 6190-6200 (1999)