Abstract

We propose an optical coupling module, the micro-optical bench, designed for the purpose of completely passive alignment of optical components. The principle is for one to position a planar microlens array, semiconductor device submounts, and optical fibers by using reference planes and V grooves made on a Si substrate. A prototype was fabricated, and we achieved an optical coupling loss of less than 3 dB; small deviations among channels as low as 1 dB were achieved without any precise alignment. For multimode fibers, a coupling loss of approximately 0.5 dB was obtained.

© 1999 Optical Society of America

Full Article  |  PDF Article

References

  • View by:
  • |
  • |
  • |

  1. Y. Yamada, S. Suzuki, K. Moriwaki, Y. Hibino, Y. Tohmori, Y. Akutsu, Y. Nakasugi, T. Hashimoto, H. Terui, M. Yanagisawa, Y. Inoue, Y. Akahori, R. Nagase, “Application of planar lightwave circuit platform to integrated optical WDM transmitter/receiver module,” Electron. Lett. 31, 1366–1367 (1995).
    [CrossRef]
  2. C. A. Armiento, M. Tabasky, C. Jagannath, T. W. Fitzgerald, C. L. Shieh, V. Barry, M. Rothman, A. Negri, P. O. Haugsjaa, H. F. Lockwood, “Passive coupling of InGaAsP/InP laser array and singlemode fibers using silicon waferboard,” Electron. Lett. 27, 1109–1110 (1991).
    [CrossRef]
  3. M. S. Cohen, M. F. Cina, E. Bassous, M. M. Oprysko, J. L. Speidell, “Passive laser-fiber alignment by index method,” IEEE Photon. Technol. Lett. 3, 985–987 (1991).
    [CrossRef]
  4. W. Hunziker, W. Vogt, H. Melchior, P. Buchmann, P. Vettiger, “Passive self-aligned low-cost packaging of semiconductor laser arrays on Si substrate,” IEEE Photon. Technol. Lett. 7, 1324–1326 (1995).
    [CrossRef]
  5. A. Sasaki, T. Baba, K. Iga, “Put-in microconnectors for alignment-free coupling of optical fiber arrays,” IEEE Photon. Technol. Lett. 4, 908–911 (1992).
    [CrossRef]
  6. T. Kato, R. J. Mizuno, K. Iga, “Self-aligning optical interconnect scheme using put-in microconnector,” IEICE Trans. Electron. E80-C, 139–143 (1997).
  7. K. E. Bean, “Anisotropic etching of silicon,” IEEE Trans. Electron Devices ED-25, 1185–1192 (1978).
    [CrossRef]

1997 (1)

T. Kato, R. J. Mizuno, K. Iga, “Self-aligning optical interconnect scheme using put-in microconnector,” IEICE Trans. Electron. E80-C, 139–143 (1997).

1995 (2)

Y. Yamada, S. Suzuki, K. Moriwaki, Y. Hibino, Y. Tohmori, Y. Akutsu, Y. Nakasugi, T. Hashimoto, H. Terui, M. Yanagisawa, Y. Inoue, Y. Akahori, R. Nagase, “Application of planar lightwave circuit platform to integrated optical WDM transmitter/receiver module,” Electron. Lett. 31, 1366–1367 (1995).
[CrossRef]

W. Hunziker, W. Vogt, H. Melchior, P. Buchmann, P. Vettiger, “Passive self-aligned low-cost packaging of semiconductor laser arrays on Si substrate,” IEEE Photon. Technol. Lett. 7, 1324–1326 (1995).
[CrossRef]

1992 (1)

A. Sasaki, T. Baba, K. Iga, “Put-in microconnectors for alignment-free coupling of optical fiber arrays,” IEEE Photon. Technol. Lett. 4, 908–911 (1992).
[CrossRef]

1991 (2)

C. A. Armiento, M. Tabasky, C. Jagannath, T. W. Fitzgerald, C. L. Shieh, V. Barry, M. Rothman, A. Negri, P. O. Haugsjaa, H. F. Lockwood, “Passive coupling of InGaAsP/InP laser array and singlemode fibers using silicon waferboard,” Electron. Lett. 27, 1109–1110 (1991).
[CrossRef]

M. S. Cohen, M. F. Cina, E. Bassous, M. M. Oprysko, J. L. Speidell, “Passive laser-fiber alignment by index method,” IEEE Photon. Technol. Lett. 3, 985–987 (1991).
[CrossRef]

1978 (1)

K. E. Bean, “Anisotropic etching of silicon,” IEEE Trans. Electron Devices ED-25, 1185–1192 (1978).
[CrossRef]

Akahori, Y.

Y. Yamada, S. Suzuki, K. Moriwaki, Y. Hibino, Y. Tohmori, Y. Akutsu, Y. Nakasugi, T. Hashimoto, H. Terui, M. Yanagisawa, Y. Inoue, Y. Akahori, R. Nagase, “Application of planar lightwave circuit platform to integrated optical WDM transmitter/receiver module,” Electron. Lett. 31, 1366–1367 (1995).
[CrossRef]

Akutsu, Y.

Y. Yamada, S. Suzuki, K. Moriwaki, Y. Hibino, Y. Tohmori, Y. Akutsu, Y. Nakasugi, T. Hashimoto, H. Terui, M. Yanagisawa, Y. Inoue, Y. Akahori, R. Nagase, “Application of planar lightwave circuit platform to integrated optical WDM transmitter/receiver module,” Electron. Lett. 31, 1366–1367 (1995).
[CrossRef]

Armiento, C. A.

C. A. Armiento, M. Tabasky, C. Jagannath, T. W. Fitzgerald, C. L. Shieh, V. Barry, M. Rothman, A. Negri, P. O. Haugsjaa, H. F. Lockwood, “Passive coupling of InGaAsP/InP laser array and singlemode fibers using silicon waferboard,” Electron. Lett. 27, 1109–1110 (1991).
[CrossRef]

Baba, T.

A. Sasaki, T. Baba, K. Iga, “Put-in microconnectors for alignment-free coupling of optical fiber arrays,” IEEE Photon. Technol. Lett. 4, 908–911 (1992).
[CrossRef]

Barry, V.

C. A. Armiento, M. Tabasky, C. Jagannath, T. W. Fitzgerald, C. L. Shieh, V. Barry, M. Rothman, A. Negri, P. O. Haugsjaa, H. F. Lockwood, “Passive coupling of InGaAsP/InP laser array and singlemode fibers using silicon waferboard,” Electron. Lett. 27, 1109–1110 (1991).
[CrossRef]

Bassous, E.

M. S. Cohen, M. F. Cina, E. Bassous, M. M. Oprysko, J. L. Speidell, “Passive laser-fiber alignment by index method,” IEEE Photon. Technol. Lett. 3, 985–987 (1991).
[CrossRef]

Bean, K. E.

K. E. Bean, “Anisotropic etching of silicon,” IEEE Trans. Electron Devices ED-25, 1185–1192 (1978).
[CrossRef]

Buchmann, P.

W. Hunziker, W. Vogt, H. Melchior, P. Buchmann, P. Vettiger, “Passive self-aligned low-cost packaging of semiconductor laser arrays on Si substrate,” IEEE Photon. Technol. Lett. 7, 1324–1326 (1995).
[CrossRef]

Cina, M. F.

M. S. Cohen, M. F. Cina, E. Bassous, M. M. Oprysko, J. L. Speidell, “Passive laser-fiber alignment by index method,” IEEE Photon. Technol. Lett. 3, 985–987 (1991).
[CrossRef]

Cohen, M. S.

M. S. Cohen, M. F. Cina, E. Bassous, M. M. Oprysko, J. L. Speidell, “Passive laser-fiber alignment by index method,” IEEE Photon. Technol. Lett. 3, 985–987 (1991).
[CrossRef]

Fitzgerald, T. W.

C. A. Armiento, M. Tabasky, C. Jagannath, T. W. Fitzgerald, C. L. Shieh, V. Barry, M. Rothman, A. Negri, P. O. Haugsjaa, H. F. Lockwood, “Passive coupling of InGaAsP/InP laser array and singlemode fibers using silicon waferboard,” Electron. Lett. 27, 1109–1110 (1991).
[CrossRef]

Hashimoto, T.

Y. Yamada, S. Suzuki, K. Moriwaki, Y. Hibino, Y. Tohmori, Y. Akutsu, Y. Nakasugi, T. Hashimoto, H. Terui, M. Yanagisawa, Y. Inoue, Y. Akahori, R. Nagase, “Application of planar lightwave circuit platform to integrated optical WDM transmitter/receiver module,” Electron. Lett. 31, 1366–1367 (1995).
[CrossRef]

Haugsjaa, P. O.

C. A. Armiento, M. Tabasky, C. Jagannath, T. W. Fitzgerald, C. L. Shieh, V. Barry, M. Rothman, A. Negri, P. O. Haugsjaa, H. F. Lockwood, “Passive coupling of InGaAsP/InP laser array and singlemode fibers using silicon waferboard,” Electron. Lett. 27, 1109–1110 (1991).
[CrossRef]

Hibino, Y.

Y. Yamada, S. Suzuki, K. Moriwaki, Y. Hibino, Y. Tohmori, Y. Akutsu, Y. Nakasugi, T. Hashimoto, H. Terui, M. Yanagisawa, Y. Inoue, Y. Akahori, R. Nagase, “Application of planar lightwave circuit platform to integrated optical WDM transmitter/receiver module,” Electron. Lett. 31, 1366–1367 (1995).
[CrossRef]

Hunziker, W.

W. Hunziker, W. Vogt, H. Melchior, P. Buchmann, P. Vettiger, “Passive self-aligned low-cost packaging of semiconductor laser arrays on Si substrate,” IEEE Photon. Technol. Lett. 7, 1324–1326 (1995).
[CrossRef]

Iga, K.

T. Kato, R. J. Mizuno, K. Iga, “Self-aligning optical interconnect scheme using put-in microconnector,” IEICE Trans. Electron. E80-C, 139–143 (1997).

A. Sasaki, T. Baba, K. Iga, “Put-in microconnectors for alignment-free coupling of optical fiber arrays,” IEEE Photon. Technol. Lett. 4, 908–911 (1992).
[CrossRef]

Inoue, Y.

Y. Yamada, S. Suzuki, K. Moriwaki, Y. Hibino, Y. Tohmori, Y. Akutsu, Y. Nakasugi, T. Hashimoto, H. Terui, M. Yanagisawa, Y. Inoue, Y. Akahori, R. Nagase, “Application of planar lightwave circuit platform to integrated optical WDM transmitter/receiver module,” Electron. Lett. 31, 1366–1367 (1995).
[CrossRef]

Jagannath, C.

C. A. Armiento, M. Tabasky, C. Jagannath, T. W. Fitzgerald, C. L. Shieh, V. Barry, M. Rothman, A. Negri, P. O. Haugsjaa, H. F. Lockwood, “Passive coupling of InGaAsP/InP laser array and singlemode fibers using silicon waferboard,” Electron. Lett. 27, 1109–1110 (1991).
[CrossRef]

Kato, T.

T. Kato, R. J. Mizuno, K. Iga, “Self-aligning optical interconnect scheme using put-in microconnector,” IEICE Trans. Electron. E80-C, 139–143 (1997).

Lockwood, H. F.

C. A. Armiento, M. Tabasky, C. Jagannath, T. W. Fitzgerald, C. L. Shieh, V. Barry, M. Rothman, A. Negri, P. O. Haugsjaa, H. F. Lockwood, “Passive coupling of InGaAsP/InP laser array and singlemode fibers using silicon waferboard,” Electron. Lett. 27, 1109–1110 (1991).
[CrossRef]

Melchior, H.

W. Hunziker, W. Vogt, H. Melchior, P. Buchmann, P. Vettiger, “Passive self-aligned low-cost packaging of semiconductor laser arrays on Si substrate,” IEEE Photon. Technol. Lett. 7, 1324–1326 (1995).
[CrossRef]

Mizuno, R. J.

T. Kato, R. J. Mizuno, K. Iga, “Self-aligning optical interconnect scheme using put-in microconnector,” IEICE Trans. Electron. E80-C, 139–143 (1997).

Moriwaki, K.

Y. Yamada, S. Suzuki, K. Moriwaki, Y. Hibino, Y. Tohmori, Y. Akutsu, Y. Nakasugi, T. Hashimoto, H. Terui, M. Yanagisawa, Y. Inoue, Y. Akahori, R. Nagase, “Application of planar lightwave circuit platform to integrated optical WDM transmitter/receiver module,” Electron. Lett. 31, 1366–1367 (1995).
[CrossRef]

Nagase, R.

Y. Yamada, S. Suzuki, K. Moriwaki, Y. Hibino, Y. Tohmori, Y. Akutsu, Y. Nakasugi, T. Hashimoto, H. Terui, M. Yanagisawa, Y. Inoue, Y. Akahori, R. Nagase, “Application of planar lightwave circuit platform to integrated optical WDM transmitter/receiver module,” Electron. Lett. 31, 1366–1367 (1995).
[CrossRef]

Nakasugi, Y.

Y. Yamada, S. Suzuki, K. Moriwaki, Y. Hibino, Y. Tohmori, Y. Akutsu, Y. Nakasugi, T. Hashimoto, H. Terui, M. Yanagisawa, Y. Inoue, Y. Akahori, R. Nagase, “Application of planar lightwave circuit platform to integrated optical WDM transmitter/receiver module,” Electron. Lett. 31, 1366–1367 (1995).
[CrossRef]

Negri, A.

C. A. Armiento, M. Tabasky, C. Jagannath, T. W. Fitzgerald, C. L. Shieh, V. Barry, M. Rothman, A. Negri, P. O. Haugsjaa, H. F. Lockwood, “Passive coupling of InGaAsP/InP laser array and singlemode fibers using silicon waferboard,” Electron. Lett. 27, 1109–1110 (1991).
[CrossRef]

Oprysko, M. M.

M. S. Cohen, M. F. Cina, E. Bassous, M. M. Oprysko, J. L. Speidell, “Passive laser-fiber alignment by index method,” IEEE Photon. Technol. Lett. 3, 985–987 (1991).
[CrossRef]

Rothman, M.

C. A. Armiento, M. Tabasky, C. Jagannath, T. W. Fitzgerald, C. L. Shieh, V. Barry, M. Rothman, A. Negri, P. O. Haugsjaa, H. F. Lockwood, “Passive coupling of InGaAsP/InP laser array and singlemode fibers using silicon waferboard,” Electron. Lett. 27, 1109–1110 (1991).
[CrossRef]

Sasaki, A.

A. Sasaki, T. Baba, K. Iga, “Put-in microconnectors for alignment-free coupling of optical fiber arrays,” IEEE Photon. Technol. Lett. 4, 908–911 (1992).
[CrossRef]

Shieh, C. L.

C. A. Armiento, M. Tabasky, C. Jagannath, T. W. Fitzgerald, C. L. Shieh, V. Barry, M. Rothman, A. Negri, P. O. Haugsjaa, H. F. Lockwood, “Passive coupling of InGaAsP/InP laser array and singlemode fibers using silicon waferboard,” Electron. Lett. 27, 1109–1110 (1991).
[CrossRef]

Speidell, J. L.

M. S. Cohen, M. F. Cina, E. Bassous, M. M. Oprysko, J. L. Speidell, “Passive laser-fiber alignment by index method,” IEEE Photon. Technol. Lett. 3, 985–987 (1991).
[CrossRef]

Suzuki, S.

Y. Yamada, S. Suzuki, K. Moriwaki, Y. Hibino, Y. Tohmori, Y. Akutsu, Y. Nakasugi, T. Hashimoto, H. Terui, M. Yanagisawa, Y. Inoue, Y. Akahori, R. Nagase, “Application of planar lightwave circuit platform to integrated optical WDM transmitter/receiver module,” Electron. Lett. 31, 1366–1367 (1995).
[CrossRef]

Tabasky, M.

C. A. Armiento, M. Tabasky, C. Jagannath, T. W. Fitzgerald, C. L. Shieh, V. Barry, M. Rothman, A. Negri, P. O. Haugsjaa, H. F. Lockwood, “Passive coupling of InGaAsP/InP laser array and singlemode fibers using silicon waferboard,” Electron. Lett. 27, 1109–1110 (1991).
[CrossRef]

Terui, H.

Y. Yamada, S. Suzuki, K. Moriwaki, Y. Hibino, Y. Tohmori, Y. Akutsu, Y. Nakasugi, T. Hashimoto, H. Terui, M. Yanagisawa, Y. Inoue, Y. Akahori, R. Nagase, “Application of planar lightwave circuit platform to integrated optical WDM transmitter/receiver module,” Electron. Lett. 31, 1366–1367 (1995).
[CrossRef]

Tohmori, Y.

Y. Yamada, S. Suzuki, K. Moriwaki, Y. Hibino, Y. Tohmori, Y. Akutsu, Y. Nakasugi, T. Hashimoto, H. Terui, M. Yanagisawa, Y. Inoue, Y. Akahori, R. Nagase, “Application of planar lightwave circuit platform to integrated optical WDM transmitter/receiver module,” Electron. Lett. 31, 1366–1367 (1995).
[CrossRef]

Vettiger, P.

W. Hunziker, W. Vogt, H. Melchior, P. Buchmann, P. Vettiger, “Passive self-aligned low-cost packaging of semiconductor laser arrays on Si substrate,” IEEE Photon. Technol. Lett. 7, 1324–1326 (1995).
[CrossRef]

Vogt, W.

W. Hunziker, W. Vogt, H. Melchior, P. Buchmann, P. Vettiger, “Passive self-aligned low-cost packaging of semiconductor laser arrays on Si substrate,” IEEE Photon. Technol. Lett. 7, 1324–1326 (1995).
[CrossRef]

Yamada, Y.

Y. Yamada, S. Suzuki, K. Moriwaki, Y. Hibino, Y. Tohmori, Y. Akutsu, Y. Nakasugi, T. Hashimoto, H. Terui, M. Yanagisawa, Y. Inoue, Y. Akahori, R. Nagase, “Application of planar lightwave circuit platform to integrated optical WDM transmitter/receiver module,” Electron. Lett. 31, 1366–1367 (1995).
[CrossRef]

Yanagisawa, M.

Y. Yamada, S. Suzuki, K. Moriwaki, Y. Hibino, Y. Tohmori, Y. Akutsu, Y. Nakasugi, T. Hashimoto, H. Terui, M. Yanagisawa, Y. Inoue, Y. Akahori, R. Nagase, “Application of planar lightwave circuit platform to integrated optical WDM transmitter/receiver module,” Electron. Lett. 31, 1366–1367 (1995).
[CrossRef]

Electron. Lett. (2)

Y. Yamada, S. Suzuki, K. Moriwaki, Y. Hibino, Y. Tohmori, Y. Akutsu, Y. Nakasugi, T. Hashimoto, H. Terui, M. Yanagisawa, Y. Inoue, Y. Akahori, R. Nagase, “Application of planar lightwave circuit platform to integrated optical WDM transmitter/receiver module,” Electron. Lett. 31, 1366–1367 (1995).
[CrossRef]

C. A. Armiento, M. Tabasky, C. Jagannath, T. W. Fitzgerald, C. L. Shieh, V. Barry, M. Rothman, A. Negri, P. O. Haugsjaa, H. F. Lockwood, “Passive coupling of InGaAsP/InP laser array and singlemode fibers using silicon waferboard,” Electron. Lett. 27, 1109–1110 (1991).
[CrossRef]

IEEE Photon. Technol. Lett. (3)

M. S. Cohen, M. F. Cina, E. Bassous, M. M. Oprysko, J. L. Speidell, “Passive laser-fiber alignment by index method,” IEEE Photon. Technol. Lett. 3, 985–987 (1991).
[CrossRef]

W. Hunziker, W. Vogt, H. Melchior, P. Buchmann, P. Vettiger, “Passive self-aligned low-cost packaging of semiconductor laser arrays on Si substrate,” IEEE Photon. Technol. Lett. 7, 1324–1326 (1995).
[CrossRef]

A. Sasaki, T. Baba, K. Iga, “Put-in microconnectors for alignment-free coupling of optical fiber arrays,” IEEE Photon. Technol. Lett. 4, 908–911 (1992).
[CrossRef]

IEEE Trans. Electron Devices (1)

K. E. Bean, “Anisotropic etching of silicon,” IEEE Trans. Electron Devices ED-25, 1185–1192 (1978).
[CrossRef]

IEICE Trans. Electron. (1)

T. Kato, R. J. Mizuno, K. Iga, “Self-aligning optical interconnect scheme using put-in microconnector,” IEICE Trans. Electron. E80-C, 139–143 (1997).

Cited By

OSA participates in CrossRef's Cited-By Linking service. Citing articles from OSA journals and other participating publishers are listed here.

Alert me when this article is cited.


Figures (8)

Fig. 1
Fig. 1

Alignment method with a reference plane and a terrace.

Fig. 2
Fig. 2

Scheme of the proposed MOB.

Fig. 3
Fig. 3

Fabrication process of the MOB.

Fig. 4
Fig. 4

Dicing saw processes and fabricated PML array.

Fig. 5
Fig. 5

SEM images of the MOB.

Fig. 6
Fig. 6

SEM image of a fabricated module.

Fig. 7
Fig. 7

Measured optical coupling losses.

Fig. 8
Fig. 8

Excess loss as the result of misalignment.

Metrics