Abstract

Thermal analysis for a UV light-curable epoxy adhesive material recently commercialized by Daikin for assembly of optical fiber devices with a low optical reflection was performed. This epoxy was used in the assembly of LiNbO3 waveguide devices; previous reliability tests measuring mechanical and optical characteristics confirm the stability of this epoxy for the fiber connection. However, due to an intrinsic characteristic of the material, polymerization by a curing process on the device assembly line was incomplete, and additional polymerization was expected to occur after assembly. Here, the duration necessary for complete polymerization of this adhesive material is estimated experimentally to be 1.8 years at 80°C. Further, the activation energy for such additional polymerization is derived to be 0.38 eV (~0.4 eV, considering measurement errors).

© 1998 Optical Society of America

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  1. H. Nagata, N. Mitsugi, “Mechanical reliability of LiNbO3optical modulators hermetically sealed in stainless steel packages,” Opt. Fiber Technol. 2,216–224 (1996).
    [CrossRef]
  2. H. Nagata et al., “Lifetime estimation for hermetically packaged 10 Gb/s LiNbO3optical modulators.” Eng. Lab. Notes in Opt. Phot. News 7(11), (1996).
  3. H. Nagata et al., “Evaluation of new UV-curable adhesive material for stable bonding between optical fibers and waveguide devices,” Opt. Fiber Technol. 1,283–288 (1995).
    [CrossRef]
  4. Concerning a detail of the DSC analysis, please refer to a general textbook such as D.S. Thompson, Thermal Analysis (Academic Press, San Diego, Calif., 1969).
  5. H. Nagata, “Thermal analysis of jacketing materials for commercial optical fibers,” Opt. Fiber Technol. 3,87–89 (1997).
    [CrossRef]

1997 (1)

H. Nagata, “Thermal analysis of jacketing materials for commercial optical fibers,” Opt. Fiber Technol. 3,87–89 (1997).
[CrossRef]

1996 (2)

H. Nagata, N. Mitsugi, “Mechanical reliability of LiNbO3optical modulators hermetically sealed in stainless steel packages,” Opt. Fiber Technol. 2,216–224 (1996).
[CrossRef]

H. Nagata et al., “Lifetime estimation for hermetically packaged 10 Gb/s LiNbO3optical modulators.” Eng. Lab. Notes in Opt. Phot. News 7(11), (1996).

1995 (1)

H. Nagata et al., “Evaluation of new UV-curable adhesive material for stable bonding between optical fibers and waveguide devices,” Opt. Fiber Technol. 1,283–288 (1995).
[CrossRef]

Mitsugi, N.

H. Nagata, N. Mitsugi, “Mechanical reliability of LiNbO3optical modulators hermetically sealed in stainless steel packages,” Opt. Fiber Technol. 2,216–224 (1996).
[CrossRef]

Nagata, H.

H. Nagata, “Thermal analysis of jacketing materials for commercial optical fibers,” Opt. Fiber Technol. 3,87–89 (1997).
[CrossRef]

H. Nagata et al., “Lifetime estimation for hermetically packaged 10 Gb/s LiNbO3optical modulators.” Eng. Lab. Notes in Opt. Phot. News 7(11), (1996).

H. Nagata, N. Mitsugi, “Mechanical reliability of LiNbO3optical modulators hermetically sealed in stainless steel packages,” Opt. Fiber Technol. 2,216–224 (1996).
[CrossRef]

H. Nagata et al., “Evaluation of new UV-curable adhesive material for stable bonding between optical fibers and waveguide devices,” Opt. Fiber Technol. 1,283–288 (1995).
[CrossRef]

Thompson, D.S.

Concerning a detail of the DSC analysis, please refer to a general textbook such as D.S. Thompson, Thermal Analysis (Academic Press, San Diego, Calif., 1969).

Eng. Lab. Notes in Opt. Phot. News (1)

H. Nagata et al., “Lifetime estimation for hermetically packaged 10 Gb/s LiNbO3optical modulators.” Eng. Lab. Notes in Opt. Phot. News 7(11), (1996).

Opt. Fiber Technol. (3)

H. Nagata et al., “Evaluation of new UV-curable adhesive material for stable bonding between optical fibers and waveguide devices,” Opt. Fiber Technol. 1,283–288 (1995).
[CrossRef]

H. Nagata, N. Mitsugi, “Mechanical reliability of LiNbO3optical modulators hermetically sealed in stainless steel packages,” Opt. Fiber Technol. 2,216–224 (1996).
[CrossRef]

H. Nagata, “Thermal analysis of jacketing materials for commercial optical fibers,” Opt. Fiber Technol. 3,87–89 (1997).
[CrossRef]

Other (1)

Concerning a detail of the DSC analysis, please refer to a general textbook such as D.S. Thompson, Thermal Analysis (Academic Press, San Diego, Calif., 1969).

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