Thermal analysis for a UV light-curable epoxy adhesive material recently commercialized by Daikin for assembly of optical fiber devices with a low optical reflection was performed. This epoxy was used in the assembly of LiNbO3 waveguide devices; previous reliability tests measuring mechanical and optical characteristics confirm the stability of this epoxy for the fiber connection. However, due to an intrinsic characteristic of the material, polymerization by a curing process on the device assembly line was incomplete, and additional polymerization was expected to occur after assembly. Here, the duration necessary for complete polymerization of this adhesive material is estimated experimentally to be 1.8 years at 80°C. Further, the activation energy for such additional polymerization is derived to be 0.38 eV (~0.4 eV, considering measurement errors).
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