Abstract

The program couple combines simulators for optical performance, mechanical reliability, and production cost under a graphical–user interface to design, simulate, and evaluate micro-optomechanical structures. The thermal simulator predicts the package temperature distribution on the basis of the materials and the geometry as well as on heat sources, sinks, and boundary conditions. The thermal distribution is input to the mechanical simulator, which calculates the stresses or strains and displacements caused by differential thermal expansion. The optical simulator predicts the impact on the optical efficiency and the cross talk of mechanical and optical parameter variations such as solder heights, misalignments, and wavelength distributions. The cost simulator represents the manufacturing process flow and calculates the final cost and the cost sensitivity on basis of the cost and the yield of each process step. By means of balancing detector and coupling yield, cosimulation from optical to cost domains determines the optimum detector size to produce the lowest-cost transceiver module.

© 1998 Optical Society of America

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