Abstract

The geometrical design characteristics of multiple-image holograms are evaluated. A figure of merit expressing these characteristics as a function of the hologram diameter and the distance between the hologram and the image plane is developed. This value is then used to compare two designs which are capable of forming several hundred interconnections. The results indicate that these connections can be formed between points on the substrate separated by 2–3 cm provided that the holograms are separated from the substrate plane by 0.5–1 cm. Each hologram design is experimentally demonstrated in bleached photographic emulsions.

© 1987 Optical Society of America

Computer generated holographic optical elements for optical interconnection of very large scale integrated circuits

Michael R. Feldman and Clark C. Guest
Appl. Opt. 26(20) 4377-4384 (1987)

Design and analysis of fixed planar holographic interconnects for optical neural networks

Paul E. Keller and Arthur F. Gmitro
Appl. Opt. 31(26) 5517-5526 (1992)

Transverse holographic optical interconnect design

Su Chiou Tsay and H. Grebel
Appl. Opt. 33(29) 6747-6754 (1994)

Optical imaging applied to microelectronic chip-to-chip interconnections

Raymond K. Kostuk, Joseph W. Goodman, and Lambertus Hesselink
Appl. Opt. 24(17) 2851-2858 (1985)

Reducing alignment and chromatic sensitivity of holographic optical interconnects with substrate-mode holograms

Raymond K. Kostuk, Yang-Tung Huang, Dale Hetherington, and Masayuki Kato
Appl. Opt. 28(22) 4939-4944 (1989)