Thermosetting resin substrate for computer-use optical memory disk

Shoji Ohsawa; Morio Tsuge; Akimitsu Takatsu; Toyoji Okunishi; Junji Tanaka; Shin-ichi Mikami

doi:10.1364/AO.25.004027

Applied Optics
Vol. 25,
Issue 22,
pp. 4027-4030
(1986)
•https://doi.org/10.1364/AO.25.004027

Thermosetting resin substrate for computer-use optical memory disk

Shoji Ohsawa, Morio Tsuge, Akimitsu Takatsu, Toyoji Okunishi, Junji Tanaka, and Shin-ichi Mikami

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Shoji Ohsawa, Morio Tsuge, Akimitsu Takatsu, Toyoji Okunishi, Junji Tanaka, and Shin-ichi Mikami, "Thermosetting resin substrate for computer-use optical memory disk," Appl. Opt. 25, 4027-4030 (1986)

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Abstract

A thermosetting resin, epoxy resin, substrate for computer-use-write-once, phase-change, and magnetooptical memory disks has been developed, and its optical, physical, thermal, and mechanical properties are described compared with other plastic substrates. The epoxy resin substrate has advantages of high heat deflection temperature and very low birefringence due to the casting mold. The resistance of the epoxy resin substrate against chemical reagents exhibits excellent chemical resistance except methylene chloride; it is also suitable as a substrate for organic dye write-once media.

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Corrections

S. Ohsawa, M. Tsuge, A. Takatsu, T. Okunishi, J. Tanaka, and S. I. Mikami, "Thermosetting resin substrate for computer-use optical memory disk: erratum," Appl. Opt. 26, 2298-2298 (1987)
https://opg.optica.org/ao/abstract.cfm?uri=ao-26-12-2298

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	Material

Observed valuea	PC (injection mold)	PMMA (injection mold)	EPOXY (casting mold)
Maximum value	46	24	14
Average value	22	12	8

Typical properties		Unit	Epoxy A	Epoxy B	PC	PMMA	Test method

Luminous transmittance		%	92	92	90	92	ASTM D–1003

Refractive index			1.51	1.54	1.58	1.49	ASTM D–542

Optical birefringence (Double)		nm at 830nm	Max. 5	Max. 7	20~30	Max. 20	Ellipsometer (ϕ300 size)

Surface roughness	Ra	μm	0.006	0.006	0.006	0.006	Talysurf–5M
Surface roughness	Ramax	μm	0.06	0.06	0.055	0.060

Glass transition temperature		°C	125	115	150	100	Deflection point of linear thermal expansion coefficient

Heat deflection temperature		°C	135	125	132	95	ASTM D–648

Specific gravity		—	1.10	1.20	1.20	1.19	ASTM D–792

Rockwell hardness		M scale	90	85	75	90	ASTM D–785

Izod impact strength		kg–cm/cm	1.6	1.0	1 2	1.6	ASTM D–256 (with notch)

Water absorption		%	0.30	0.25	0.25	0.54	ASTM D–570 (in 24hrs)

Water vapour transmission		g/m · 24hr	2.5	1.3	3.6	2.8	JIS Z0208

Photo–elastic modulua		(x 10⁻¹² · cm/dyne)	0.71	0.32	6.8	2.8

Reagent	Epoxy	PC	PMMA
10 % H₂SO₄	None	None	None
10 % HCI	”	”	”
10 % NaOH	”	”	”
Methanol	”	”	”
Isopropyl alcohol	”	”	”
Furon S-3	”	”	”
Dimethyl formamide	”	Change	Change
Methyl cellosolve acetate	”	”	”
Methyl cellosolve	”	”	”
Trichloro ethylene	”	”	”
1, 1, 1-Trichloro ethane	”	”	”
Toluene	”	”	”
Acetone	”	”	”
Methyl ethyl ketone	”	”	”
Carbon tetrachloride	”	”	”
Methylene dichloride	Change	”	”

	Material

Observed valuea	PC (injection mold)	PMMA (injection mold)	EPOXY (casting mold)
Maximum value	46	24	14
Average value	22	12	8

Typical properties		Unit	Epoxy A	Epoxy B	PC	PMMA	Test method

Luminous transmittance		%	92	92	90	92	ASTM D–1003

Refractive index			1.51	1.54	1.58	1.49	ASTM D–542

Optical birefringence (Double)		nm at 830nm	Max. 5	Max. 7	20~30	Max. 20	Ellipsometer (ϕ300 size)

Surface roughness	Ra	μm	0.006	0.006	0.006	0.006	Talysurf–5M
Surface roughness	Ramax	μm	0.06	0.06	0.055	0.060

Glass transition temperature		°C	125	115	150	100	Deflection point of linear thermal expansion coefficient

Heat deflection temperature		°C	135	125	132	95	ASTM D–648

Specific gravity		—	1.10	1.20	1.20	1.19	ASTM D–792

Rockwell hardness		M scale	90	85	75	90	ASTM D–785

Izod impact strength		kg–cm/cm	1.6	1.0	1 2	1.6	ASTM D–256 (with notch)

Water absorption		%	0.30	0.25	0.25	0.54	ASTM D–570 (in 24hrs)

Water vapour transmission		g/m · 24hr	2.5	1.3	3.6	2.8	JIS Z0208

Photo–elastic modulua		(x 10⁻¹² · cm/dyne)	0.71	0.32	6.8	2.8

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Applied Optics