Abstract

A novel etch process on silicon has been developed that consists of a conventional anisotropic etch process followed by stripping the protective oxide layer and etching the substrate once again in the anisotropic etch solution. As a result micron size patterns have been generated from a starting pattern size of 7 μm. These micron size patterns appear to have (111) sidewalls that can be used as templates for the graphoepitaxial process. We are currently exploring the possibility of generating submicron patterns using 2-μm size starting patterns.

© 1985 Optical Society of America

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  1. C. L. Hung, T. Van Duzer, “Schottky Diodes and Other Devices on Thin Silicon Membranes,” IEEE Trans. Electron Devices ED-23, 579 (1976).
    [CrossRef]
  2. T. J. Rodgers, J. D. Meindl, “Epitaxial V-Groove Bipolar Integrated Circuit Process,” IEEE Trans. Electron Devices ED-20, 226 (1963).
  3. M. J. Delcercq, “A New C-MOS Technology Using Anisotropic Etching of Silicon,” IEEE J. Solid-State Circuits SC-10, 191 (1975).
  4. C. J. Schmidt, P. V. Lenzo, E. G. Spencer, “Preparation of Thin Windows in Silicon Masks for X-Ray Lithography,” J. Appl. Phys. 46, 4080 (1975).
    [CrossRef]
  5. J. S. Harper, P. F. Heidrich, “High Density Multichannel Optical Waveguides with Integrated Couplers,” Wave Electron. 2, 369 (1976).
  6. D. L. Kendall, “On Etching Very Narrow Grooves in Silicon,” Appl. Phys. Lett. 26, 1500 (1974).
  7. E. Bassous, L. Kuhn, A. Reisman, H. H. Taub, “Ink Jet Nozzle,” U. S. Patent4 007 464 (Feb.1977).
  8. D. A. Keiwit, “Microtool Fabrication by Etch Pit Replication,” Rev. Sci. Instrum. 44, 1741 (1973).
    [CrossRef]
  9. H. Guckel, S. Larson, M. G. Lagally, G. Moore, J. B. Miller, J. D. Wiley, “Electrochemical Devices Utilizing Thin Silicon Diaphragms,” Appl. Phys. Lett. 31, 618 (1977).
    [CrossRef]
  10. K. E. Peterson, “Micromechanical Light Modulator Array Fabricated on Silicon,” Appl. Phys. Lett. 31, 521 (1977).
    [CrossRef]
  11. L. P. Boivin, “Thin-Film Laser-to-Fiber Coupler,” Appl. Opt. 13, 391 (1974).
    [CrossRef] [PubMed]
  12. J. T. Boyd, S. Sriram, “Optical Coupling from Fibers to Channel Waveguides Formed on Silicon,” Appl. Opt. 17, 895 (1978).
    [CrossRef] [PubMed]
  13. W. T. Tsang, S. Wang, “Preferentially Etched Diffraction Gratings in Silicon,” J. Appl. Phys. 46, 2163 (1975).
    [CrossRef]
  14. S. Sriram, H. E. Jackson, J. T. Boyd, “Distributed Feedback Dye Laser Integrated with a Channel Waveguide formed on Silicon,” Appl. Phys. Lett. 36, 721 (1980).
    [CrossRef]
  15. W. T. Tsang, S Wang, “Thin-Film Beamsplitter and Reflector for Optical Guided Waves,” Appl. Phys. Lett. 27, 589 (1975).
    [CrossRef]
  16. S. Sriram, G. B. Brandt, E. P. Supertzi, “Heterodyne Receiver on Silicon: An Exercise in Integration,” Proc. Soc. Photo-Opt. Instrum. Eng. 321, 15 (1982).
  17. R. M. Finne, D. L. Klein, “A Water-Amine Complexing Agent for Etching Silicon,” J. Electrochem. Soc. Solid State Sci. 114, 965 (1967).
  18. D. B. Lee, “Anisotropic Etching of Silicon,” J. Appl. Phys. 40, 4569 (1969).
    [CrossRef]
  19. M. J. Delcercq, L. Gerzberg, J. D. Meindl, “Optimization of Hydrazine-Water Solution for Anisotropic Etching of Silicon in Integrated Circuit Technology,” J. Electrochem. Soc. Solid State Sci. 122, 545 (1975).
  20. K. E. Bean, “Anisotropic Etching of Silicon,” IEEE Trans. Electron Devices ED-25, 1185 (1978).
    [CrossRef]
  21. W. A. Challener, P. L. Richards, S. C. Zilio, H. L. Garvin, “Grid Polarizers for Infrared Fourier Spectrometers,” Infrared Phys. 20, 215 (1980).
    [CrossRef]
  22. M. Gottlieb, J. D. Feichtner, J. J. Conroy, “Recent Developments in Infrared Acousto-Optic Tunable Filters,” Proc. Soc. Photo-Opt. Instrum. Eng. 317, 52 (1982).
  23. A. Yariv, M. Nakamura, “Period Structures for Integrated Optics,” IEEE J. Quantum Electron. QE-13, 233 (1977).
    [CrossRef]

1982 (2)

S. Sriram, G. B. Brandt, E. P. Supertzi, “Heterodyne Receiver on Silicon: An Exercise in Integration,” Proc. Soc. Photo-Opt. Instrum. Eng. 321, 15 (1982).

M. Gottlieb, J. D. Feichtner, J. J. Conroy, “Recent Developments in Infrared Acousto-Optic Tunable Filters,” Proc. Soc. Photo-Opt. Instrum. Eng. 317, 52 (1982).

1980 (2)

S. Sriram, H. E. Jackson, J. T. Boyd, “Distributed Feedback Dye Laser Integrated with a Channel Waveguide formed on Silicon,” Appl. Phys. Lett. 36, 721 (1980).
[CrossRef]

W. A. Challener, P. L. Richards, S. C. Zilio, H. L. Garvin, “Grid Polarizers for Infrared Fourier Spectrometers,” Infrared Phys. 20, 215 (1980).
[CrossRef]

1978 (2)

1977 (3)

A. Yariv, M. Nakamura, “Period Structures for Integrated Optics,” IEEE J. Quantum Electron. QE-13, 233 (1977).
[CrossRef]

H. Guckel, S. Larson, M. G. Lagally, G. Moore, J. B. Miller, J. D. Wiley, “Electrochemical Devices Utilizing Thin Silicon Diaphragms,” Appl. Phys. Lett. 31, 618 (1977).
[CrossRef]

K. E. Peterson, “Micromechanical Light Modulator Array Fabricated on Silicon,” Appl. Phys. Lett. 31, 521 (1977).
[CrossRef]

1976 (2)

J. S. Harper, P. F. Heidrich, “High Density Multichannel Optical Waveguides with Integrated Couplers,” Wave Electron. 2, 369 (1976).

C. L. Hung, T. Van Duzer, “Schottky Diodes and Other Devices on Thin Silicon Membranes,” IEEE Trans. Electron Devices ED-23, 579 (1976).
[CrossRef]

1975 (5)

M. J. Delcercq, “A New C-MOS Technology Using Anisotropic Etching of Silicon,” IEEE J. Solid-State Circuits SC-10, 191 (1975).

C. J. Schmidt, P. V. Lenzo, E. G. Spencer, “Preparation of Thin Windows in Silicon Masks for X-Ray Lithography,” J. Appl. Phys. 46, 4080 (1975).
[CrossRef]

W. T. Tsang, S. Wang, “Preferentially Etched Diffraction Gratings in Silicon,” J. Appl. Phys. 46, 2163 (1975).
[CrossRef]

M. J. Delcercq, L. Gerzberg, J. D. Meindl, “Optimization of Hydrazine-Water Solution for Anisotropic Etching of Silicon in Integrated Circuit Technology,” J. Electrochem. Soc. Solid State Sci. 122, 545 (1975).

W. T. Tsang, S Wang, “Thin-Film Beamsplitter and Reflector for Optical Guided Waves,” Appl. Phys. Lett. 27, 589 (1975).
[CrossRef]

1974 (2)

D. L. Kendall, “On Etching Very Narrow Grooves in Silicon,” Appl. Phys. Lett. 26, 1500 (1974).

L. P. Boivin, “Thin-Film Laser-to-Fiber Coupler,” Appl. Opt. 13, 391 (1974).
[CrossRef] [PubMed]

1973 (1)

D. A. Keiwit, “Microtool Fabrication by Etch Pit Replication,” Rev. Sci. Instrum. 44, 1741 (1973).
[CrossRef]

1969 (1)

D. B. Lee, “Anisotropic Etching of Silicon,” J. Appl. Phys. 40, 4569 (1969).
[CrossRef]

1967 (1)

R. M. Finne, D. L. Klein, “A Water-Amine Complexing Agent for Etching Silicon,” J. Electrochem. Soc. Solid State Sci. 114, 965 (1967).

1963 (1)

T. J. Rodgers, J. D. Meindl, “Epitaxial V-Groove Bipolar Integrated Circuit Process,” IEEE Trans. Electron Devices ED-20, 226 (1963).

Bassous, E.

E. Bassous, L. Kuhn, A. Reisman, H. H. Taub, “Ink Jet Nozzle,” U. S. Patent4 007 464 (Feb.1977).

Bean, K. E.

K. E. Bean, “Anisotropic Etching of Silicon,” IEEE Trans. Electron Devices ED-25, 1185 (1978).
[CrossRef]

Boivin, L. P.

Boyd, J. T.

S. Sriram, H. E. Jackson, J. T. Boyd, “Distributed Feedback Dye Laser Integrated with a Channel Waveguide formed on Silicon,” Appl. Phys. Lett. 36, 721 (1980).
[CrossRef]

J. T. Boyd, S. Sriram, “Optical Coupling from Fibers to Channel Waveguides Formed on Silicon,” Appl. Opt. 17, 895 (1978).
[CrossRef] [PubMed]

Brandt, G. B.

S. Sriram, G. B. Brandt, E. P. Supertzi, “Heterodyne Receiver on Silicon: An Exercise in Integration,” Proc. Soc. Photo-Opt. Instrum. Eng. 321, 15 (1982).

Challener, W. A.

W. A. Challener, P. L. Richards, S. C. Zilio, H. L. Garvin, “Grid Polarizers for Infrared Fourier Spectrometers,” Infrared Phys. 20, 215 (1980).
[CrossRef]

Conroy, J. J.

M. Gottlieb, J. D. Feichtner, J. J. Conroy, “Recent Developments in Infrared Acousto-Optic Tunable Filters,” Proc. Soc. Photo-Opt. Instrum. Eng. 317, 52 (1982).

Delcercq, M. J.

M. J. Delcercq, “A New C-MOS Technology Using Anisotropic Etching of Silicon,” IEEE J. Solid-State Circuits SC-10, 191 (1975).

M. J. Delcercq, L. Gerzberg, J. D. Meindl, “Optimization of Hydrazine-Water Solution for Anisotropic Etching of Silicon in Integrated Circuit Technology,” J. Electrochem. Soc. Solid State Sci. 122, 545 (1975).

Feichtner, J. D.

M. Gottlieb, J. D. Feichtner, J. J. Conroy, “Recent Developments in Infrared Acousto-Optic Tunable Filters,” Proc. Soc. Photo-Opt. Instrum. Eng. 317, 52 (1982).

Finne, R. M.

R. M. Finne, D. L. Klein, “A Water-Amine Complexing Agent for Etching Silicon,” J. Electrochem. Soc. Solid State Sci. 114, 965 (1967).

Garvin, H. L.

W. A. Challener, P. L. Richards, S. C. Zilio, H. L. Garvin, “Grid Polarizers for Infrared Fourier Spectrometers,” Infrared Phys. 20, 215 (1980).
[CrossRef]

Gerzberg, L.

M. J. Delcercq, L. Gerzberg, J. D. Meindl, “Optimization of Hydrazine-Water Solution for Anisotropic Etching of Silicon in Integrated Circuit Technology,” J. Electrochem. Soc. Solid State Sci. 122, 545 (1975).

Gottlieb, M.

M. Gottlieb, J. D. Feichtner, J. J. Conroy, “Recent Developments in Infrared Acousto-Optic Tunable Filters,” Proc. Soc. Photo-Opt. Instrum. Eng. 317, 52 (1982).

Guckel, H.

H. Guckel, S. Larson, M. G. Lagally, G. Moore, J. B. Miller, J. D. Wiley, “Electrochemical Devices Utilizing Thin Silicon Diaphragms,” Appl. Phys. Lett. 31, 618 (1977).
[CrossRef]

Harper, J. S.

J. S. Harper, P. F. Heidrich, “High Density Multichannel Optical Waveguides with Integrated Couplers,” Wave Electron. 2, 369 (1976).

Heidrich, P. F.

J. S. Harper, P. F. Heidrich, “High Density Multichannel Optical Waveguides with Integrated Couplers,” Wave Electron. 2, 369 (1976).

Hung, C. L.

C. L. Hung, T. Van Duzer, “Schottky Diodes and Other Devices on Thin Silicon Membranes,” IEEE Trans. Electron Devices ED-23, 579 (1976).
[CrossRef]

Jackson, H. E.

S. Sriram, H. E. Jackson, J. T. Boyd, “Distributed Feedback Dye Laser Integrated with a Channel Waveguide formed on Silicon,” Appl. Phys. Lett. 36, 721 (1980).
[CrossRef]

Keiwit, D. A.

D. A. Keiwit, “Microtool Fabrication by Etch Pit Replication,” Rev. Sci. Instrum. 44, 1741 (1973).
[CrossRef]

Kendall, D. L.

D. L. Kendall, “On Etching Very Narrow Grooves in Silicon,” Appl. Phys. Lett. 26, 1500 (1974).

Klein, D. L.

R. M. Finne, D. L. Klein, “A Water-Amine Complexing Agent for Etching Silicon,” J. Electrochem. Soc. Solid State Sci. 114, 965 (1967).

Kuhn, L.

E. Bassous, L. Kuhn, A. Reisman, H. H. Taub, “Ink Jet Nozzle,” U. S. Patent4 007 464 (Feb.1977).

Lagally, M. G.

H. Guckel, S. Larson, M. G. Lagally, G. Moore, J. B. Miller, J. D. Wiley, “Electrochemical Devices Utilizing Thin Silicon Diaphragms,” Appl. Phys. Lett. 31, 618 (1977).
[CrossRef]

Larson, S.

H. Guckel, S. Larson, M. G. Lagally, G. Moore, J. B. Miller, J. D. Wiley, “Electrochemical Devices Utilizing Thin Silicon Diaphragms,” Appl. Phys. Lett. 31, 618 (1977).
[CrossRef]

Lee, D. B.

D. B. Lee, “Anisotropic Etching of Silicon,” J. Appl. Phys. 40, 4569 (1969).
[CrossRef]

Lenzo, P. V.

C. J. Schmidt, P. V. Lenzo, E. G. Spencer, “Preparation of Thin Windows in Silicon Masks for X-Ray Lithography,” J. Appl. Phys. 46, 4080 (1975).
[CrossRef]

Meindl, J. D.

M. J. Delcercq, L. Gerzberg, J. D. Meindl, “Optimization of Hydrazine-Water Solution for Anisotropic Etching of Silicon in Integrated Circuit Technology,” J. Electrochem. Soc. Solid State Sci. 122, 545 (1975).

T. J. Rodgers, J. D. Meindl, “Epitaxial V-Groove Bipolar Integrated Circuit Process,” IEEE Trans. Electron Devices ED-20, 226 (1963).

Miller, J. B.

H. Guckel, S. Larson, M. G. Lagally, G. Moore, J. B. Miller, J. D. Wiley, “Electrochemical Devices Utilizing Thin Silicon Diaphragms,” Appl. Phys. Lett. 31, 618 (1977).
[CrossRef]

Moore, G.

H. Guckel, S. Larson, M. G. Lagally, G. Moore, J. B. Miller, J. D. Wiley, “Electrochemical Devices Utilizing Thin Silicon Diaphragms,” Appl. Phys. Lett. 31, 618 (1977).
[CrossRef]

Nakamura, M.

A. Yariv, M. Nakamura, “Period Structures for Integrated Optics,” IEEE J. Quantum Electron. QE-13, 233 (1977).
[CrossRef]

Peterson, K. E.

K. E. Peterson, “Micromechanical Light Modulator Array Fabricated on Silicon,” Appl. Phys. Lett. 31, 521 (1977).
[CrossRef]

Reisman, A.

E. Bassous, L. Kuhn, A. Reisman, H. H. Taub, “Ink Jet Nozzle,” U. S. Patent4 007 464 (Feb.1977).

Richards, P. L.

W. A. Challener, P. L. Richards, S. C. Zilio, H. L. Garvin, “Grid Polarizers for Infrared Fourier Spectrometers,” Infrared Phys. 20, 215 (1980).
[CrossRef]

Rodgers, T. J.

T. J. Rodgers, J. D. Meindl, “Epitaxial V-Groove Bipolar Integrated Circuit Process,” IEEE Trans. Electron Devices ED-20, 226 (1963).

Schmidt, C. J.

C. J. Schmidt, P. V. Lenzo, E. G. Spencer, “Preparation of Thin Windows in Silicon Masks for X-Ray Lithography,” J. Appl. Phys. 46, 4080 (1975).
[CrossRef]

Spencer, E. G.

C. J. Schmidt, P. V. Lenzo, E. G. Spencer, “Preparation of Thin Windows in Silicon Masks for X-Ray Lithography,” J. Appl. Phys. 46, 4080 (1975).
[CrossRef]

Sriram, S.

S. Sriram, G. B. Brandt, E. P. Supertzi, “Heterodyne Receiver on Silicon: An Exercise in Integration,” Proc. Soc. Photo-Opt. Instrum. Eng. 321, 15 (1982).

S. Sriram, H. E. Jackson, J. T. Boyd, “Distributed Feedback Dye Laser Integrated with a Channel Waveguide formed on Silicon,” Appl. Phys. Lett. 36, 721 (1980).
[CrossRef]

J. T. Boyd, S. Sriram, “Optical Coupling from Fibers to Channel Waveguides Formed on Silicon,” Appl. Opt. 17, 895 (1978).
[CrossRef] [PubMed]

Supertzi, E. P.

S. Sriram, G. B. Brandt, E. P. Supertzi, “Heterodyne Receiver on Silicon: An Exercise in Integration,” Proc. Soc. Photo-Opt. Instrum. Eng. 321, 15 (1982).

Taub, H. H.

E. Bassous, L. Kuhn, A. Reisman, H. H. Taub, “Ink Jet Nozzle,” U. S. Patent4 007 464 (Feb.1977).

Tsang, W. T.

W. T. Tsang, S Wang, “Thin-Film Beamsplitter and Reflector for Optical Guided Waves,” Appl. Phys. Lett. 27, 589 (1975).
[CrossRef]

W. T. Tsang, S. Wang, “Preferentially Etched Diffraction Gratings in Silicon,” J. Appl. Phys. 46, 2163 (1975).
[CrossRef]

Van Duzer, T.

C. L. Hung, T. Van Duzer, “Schottky Diodes and Other Devices on Thin Silicon Membranes,” IEEE Trans. Electron Devices ED-23, 579 (1976).
[CrossRef]

Wang, S

W. T. Tsang, S Wang, “Thin-Film Beamsplitter and Reflector for Optical Guided Waves,” Appl. Phys. Lett. 27, 589 (1975).
[CrossRef]

Wang, S.

W. T. Tsang, S. Wang, “Preferentially Etched Diffraction Gratings in Silicon,” J. Appl. Phys. 46, 2163 (1975).
[CrossRef]

Wiley, J. D.

H. Guckel, S. Larson, M. G. Lagally, G. Moore, J. B. Miller, J. D. Wiley, “Electrochemical Devices Utilizing Thin Silicon Diaphragms,” Appl. Phys. Lett. 31, 618 (1977).
[CrossRef]

Yariv, A.

A. Yariv, M. Nakamura, “Period Structures for Integrated Optics,” IEEE J. Quantum Electron. QE-13, 233 (1977).
[CrossRef]

Zilio, S. C.

W. A. Challener, P. L. Richards, S. C. Zilio, H. L. Garvin, “Grid Polarizers for Infrared Fourier Spectrometers,” Infrared Phys. 20, 215 (1980).
[CrossRef]

Appl. Opt. (2)

Appl. Phys. Lett. (5)

D. L. Kendall, “On Etching Very Narrow Grooves in Silicon,” Appl. Phys. Lett. 26, 1500 (1974).

H. Guckel, S. Larson, M. G. Lagally, G. Moore, J. B. Miller, J. D. Wiley, “Electrochemical Devices Utilizing Thin Silicon Diaphragms,” Appl. Phys. Lett. 31, 618 (1977).
[CrossRef]

K. E. Peterson, “Micromechanical Light Modulator Array Fabricated on Silicon,” Appl. Phys. Lett. 31, 521 (1977).
[CrossRef]

S. Sriram, H. E. Jackson, J. T. Boyd, “Distributed Feedback Dye Laser Integrated with a Channel Waveguide formed on Silicon,” Appl. Phys. Lett. 36, 721 (1980).
[CrossRef]

W. T. Tsang, S Wang, “Thin-Film Beamsplitter and Reflector for Optical Guided Waves,” Appl. Phys. Lett. 27, 589 (1975).
[CrossRef]

IEEE J. Quantum Electron. (1)

A. Yariv, M. Nakamura, “Period Structures for Integrated Optics,” IEEE J. Quantum Electron. QE-13, 233 (1977).
[CrossRef]

IEEE J. Solid-State Circuits (1)

M. J. Delcercq, “A New C-MOS Technology Using Anisotropic Etching of Silicon,” IEEE J. Solid-State Circuits SC-10, 191 (1975).

IEEE Trans. Electron Devices (3)

C. L. Hung, T. Van Duzer, “Schottky Diodes and Other Devices on Thin Silicon Membranes,” IEEE Trans. Electron Devices ED-23, 579 (1976).
[CrossRef]

T. J. Rodgers, J. D. Meindl, “Epitaxial V-Groove Bipolar Integrated Circuit Process,” IEEE Trans. Electron Devices ED-20, 226 (1963).

K. E. Bean, “Anisotropic Etching of Silicon,” IEEE Trans. Electron Devices ED-25, 1185 (1978).
[CrossRef]

Infrared Phys. (1)

W. A. Challener, P. L. Richards, S. C. Zilio, H. L. Garvin, “Grid Polarizers for Infrared Fourier Spectrometers,” Infrared Phys. 20, 215 (1980).
[CrossRef]

J. Appl. Phys. (3)

D. B. Lee, “Anisotropic Etching of Silicon,” J. Appl. Phys. 40, 4569 (1969).
[CrossRef]

C. J. Schmidt, P. V. Lenzo, E. G. Spencer, “Preparation of Thin Windows in Silicon Masks for X-Ray Lithography,” J. Appl. Phys. 46, 4080 (1975).
[CrossRef]

W. T. Tsang, S. Wang, “Preferentially Etched Diffraction Gratings in Silicon,” J. Appl. Phys. 46, 2163 (1975).
[CrossRef]

J. Electrochem. Soc. Solid State Sci. (2)

M. J. Delcercq, L. Gerzberg, J. D. Meindl, “Optimization of Hydrazine-Water Solution for Anisotropic Etching of Silicon in Integrated Circuit Technology,” J. Electrochem. Soc. Solid State Sci. 122, 545 (1975).

R. M. Finne, D. L. Klein, “A Water-Amine Complexing Agent for Etching Silicon,” J. Electrochem. Soc. Solid State Sci. 114, 965 (1967).

Proc. Soc. Photo-Opt. Instrum. Eng. (2)

S. Sriram, G. B. Brandt, E. P. Supertzi, “Heterodyne Receiver on Silicon: An Exercise in Integration,” Proc. Soc. Photo-Opt. Instrum. Eng. 321, 15 (1982).

M. Gottlieb, J. D. Feichtner, J. J. Conroy, “Recent Developments in Infrared Acousto-Optic Tunable Filters,” Proc. Soc. Photo-Opt. Instrum. Eng. 317, 52 (1982).

Rev. Sci. Instrum. (1)

D. A. Keiwit, “Microtool Fabrication by Etch Pit Replication,” Rev. Sci. Instrum. 44, 1741 (1973).
[CrossRef]

Wave Electron. (1)

J. S. Harper, P. F. Heidrich, “High Density Multichannel Optical Waveguides with Integrated Couplers,” Wave Electron. 2, 369 (1976).

Other (1)

E. Bassous, L. Kuhn, A. Reisman, H. H. Taub, “Ink Jet Nozzle,” U. S. Patent4 007 464 (Feb.1977).

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Figures (4)

Fig. 1
Fig. 1

First EDA shallow 2.5 μm etch.

Fig. 2
Fig. 2

Second EDA etch of set 1.

Fig. 3
Fig. 3

First EDA deep V-groove etch.

Fig. 4
Fig. 4

Second EDA etch of set 2.

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