Abstract

Oxygen ion-assisted deposition of SiO2 and TiO2 has been investigated as a function of ion energy (30–500 eV) and current density (0–300 μA/cm2) at the optic. It is shown that both low and high energy ion bombardment improve SiO2 film stoichiometry, although slightly greater improvement is realized for the low energy case. For TiO2 films, low energy bombardment improves stoichiometry, while high energy bombardment is clearly detrimental. A reduction in H content by a factor of 10 is observed in SiO2 films deposited with high energy ion bombardment. Durable films are produced at low substrate temperatures (50–100°C). Film stress characteristics are discussed.

© 1984 Optical Society of America

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