Abstract

A method is described for producing transmitting screens that diffuse light into small angles. With these screens, the amount of small-angle diffusion can be controlled while light loss from large-angle scattering is kept to a minimum. The diffusers are fabricated from two glass substrates that are ground, etched, and cemented together. There is a controlled mismatch between the optical index of the cement and that of the substrates. The screens were primarily designed for photolithographic camera illumination systems that involve a tradeoff between luminance and uniformity.

© 1972 Optical Society of America

Full Article  |  PDF Article

References

  • View by:
  • |
  • |
  • |

  1. K. Sayanagi, U.S. Pat.2,959,105 (1960).
  2. J. Dyson, J. Opt. Soc. Am. 50, 519 (1960).
    [CrossRef]

1960 (1)

Dyson, J.

Sayanagi, K.

K. Sayanagi, U.S. Pat.2,959,105 (1960).

J. Opt. Soc. Am. (1)

Other (1)

K. Sayanagi, U.S. Pat.2,959,105 (1960).

Cited By

OSA participates in CrossRef's Cited-By Linking service. Citing articles from OSA journals and other participating publishers are listed here.

Alert me when this article is cited.


Figures (5)

Fig. 1
Fig. 1

Schematic of a ground, etched, index-matched diffusing screen.

Fig. 2
Fig. 2

Relative intensity vs scattering angle for a plain diffusing screen ground with 5-μm grit and a ground, etched, index-matched combination plate. The scale is such as to emphasize the difference in tail distributions. (The arrow designates 1% of the peak for the combination diffuser.) Both sets of data were taken under identical experimental conditions.

Fig. 3
Fig. 3

Relative intensity vs scattering angle for unetched combination diffusing screen with optical index of second layer varied.

Fig. 4
Fig. 4

Relative intensity vs scattering angle for etched combination diffusing screens. The optical index of the second layer is varied as in Fig. 3.

Fig. 5
Fig. 5

Relative intensity vs scattering angle for etched combination diffusing screens with optical index of second layer fixed. The etch time is varied.

Metrics