We propose the output power measurement of bare-wafer/chip light-emitting diodes (LEDs) using a large-area silicon (Si) photodiode with a simple structure and high accuracy relative to the conventional partial flux measurement using an integrating sphere. To obtain the optical characteristics of the LED chips measured using the two methods, three-dimensional ray-trace simulations are used to perform the measurement deviations owing to the chip position offset or tilt angle. The ray-tracing simulation results demonstrate that the deviation of light remaining in the integrating sphere is approximately 65% for the vertical LED chip and 53% for the flip-chip LED chip if the measurement distance in partial flux method is set to be 5–40 mm. By contrast, the deviation of light hitting the photodiode is only 15% for the vertical LED chip and 23% for the flip-chip LED chip if the large-area Si photodiode is used to measure the output power with the same measurement distance. As a result, the large-area Si photodiode method practically reduces the output power measurement deviations of the bare-wafer/chip LED, so that a high-accuracy measurement can be achieved in the mass production of the bare-wafer/chip LED without the complicated integrating sphere structure.
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