Abstract

Thermal analysis for a UV light-curable epoxy adhesive material recently commercialized by Daikin for assembly of optical fiber devices with a low optical reflection was performed. This epoxy was used in the assembly of LiNbO3 waveguide devices; previous reliability tests measuring mechanical and optical characteristics confirm the stability of this epoxy for the fiber connection. However, due to an intrinsic characteristic of the material, polymerization by a curing process on the device assembly line was incomplete, and additional polymerization was expected to occur after assembly. Here, the duration necessary for complete polymerization of this adhesive material is estimated experimentally to be 1.8 years at 80°C. Further, the activation energy for such additional polymerization is derived to be 0.38 eV (~0.4 eV, considering measurement errors).

© 1998 Optical Society of America

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References

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  1. H. Nagata, N. Mitsugi, “Mechanical reliability of LiNbO3optical modulators hermetically sealed in stainless steel packages,” Opt. Fiber Technol. 2,216–224 (1996).
    [CrossRef]
  2. H. Nagata et al., “Lifetime estimation for hermetically packaged 10 Gb/s LiNbO3optical modulators.” Eng. Lab. Notes in Opt. Phot. News 7(11), (1996).
  3. H. Nagata et al., “Evaluation of new UV-curable adhesive material for stable bonding between optical fibers and waveguide devices,” Opt. Fiber Technol. 1,283–288 (1995).
    [CrossRef]
  4. Concerning a detail of the DSC analysis, please refer to a general textbook such as D.S. Thompson, Thermal Analysis (Academic Press, San Diego, Calif., 1969).
  5. H. Nagata, “Thermal analysis of jacketing materials for commercial optical fibers,” Opt. Fiber Technol. 3,87–89 (1997).
    [CrossRef]

1997 (1)

H. Nagata, “Thermal analysis of jacketing materials for commercial optical fibers,” Opt. Fiber Technol. 3,87–89 (1997).
[CrossRef]

1996 (2)

H. Nagata, N. Mitsugi, “Mechanical reliability of LiNbO3optical modulators hermetically sealed in stainless steel packages,” Opt. Fiber Technol. 2,216–224 (1996).
[CrossRef]

H. Nagata et al., “Lifetime estimation for hermetically packaged 10 Gb/s LiNbO3optical modulators.” Eng. Lab. Notes in Opt. Phot. News 7(11), (1996).

1995 (1)

H. Nagata et al., “Evaluation of new UV-curable adhesive material for stable bonding between optical fibers and waveguide devices,” Opt. Fiber Technol. 1,283–288 (1995).
[CrossRef]

Mitsugi, N.

H. Nagata, N. Mitsugi, “Mechanical reliability of LiNbO3optical modulators hermetically sealed in stainless steel packages,” Opt. Fiber Technol. 2,216–224 (1996).
[CrossRef]

Nagata, H.

H. Nagata, “Thermal analysis of jacketing materials for commercial optical fibers,” Opt. Fiber Technol. 3,87–89 (1997).
[CrossRef]

H. Nagata, N. Mitsugi, “Mechanical reliability of LiNbO3optical modulators hermetically sealed in stainless steel packages,” Opt. Fiber Technol. 2,216–224 (1996).
[CrossRef]

H. Nagata et al., “Lifetime estimation for hermetically packaged 10 Gb/s LiNbO3optical modulators.” Eng. Lab. Notes in Opt. Phot. News 7(11), (1996).

H. Nagata et al., “Evaluation of new UV-curable adhesive material for stable bonding between optical fibers and waveguide devices,” Opt. Fiber Technol. 1,283–288 (1995).
[CrossRef]

Thompson, D.S.

Concerning a detail of the DSC analysis, please refer to a general textbook such as D.S. Thompson, Thermal Analysis (Academic Press, San Diego, Calif., 1969).

Eng. Lab. Notes in Opt. Phot. News (1)

H. Nagata et al., “Lifetime estimation for hermetically packaged 10 Gb/s LiNbO3optical modulators.” Eng. Lab. Notes in Opt. Phot. News 7(11), (1996).

Opt. Fiber Technol. (3)

H. Nagata et al., “Evaluation of new UV-curable adhesive material for stable bonding between optical fibers and waveguide devices,” Opt. Fiber Technol. 1,283–288 (1995).
[CrossRef]

H. Nagata, N. Mitsugi, “Mechanical reliability of LiNbO3optical modulators hermetically sealed in stainless steel packages,” Opt. Fiber Technol. 2,216–224 (1996).
[CrossRef]

H. Nagata, “Thermal analysis of jacketing materials for commercial optical fibers,” Opt. Fiber Technol. 3,87–89 (1997).
[CrossRef]

Other (1)

Concerning a detail of the DSC analysis, please refer to a general textbook such as D.S. Thompson, Thermal Analysis (Academic Press, San Diego, Calif., 1969).

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Figures (3)

Figure 1
Figure 1

DSC results for epoxy samples measured after postcuring treatment and following 80°C aging for 1. 10, and 100 hrs.

Figure 2
Figure 2

(a) Aging time dependency of DSC peak temperature and (b)level of additional polymerization. Aging temperature is 80°C.

Figure 3
Figure 3

(a)Aging temperature dependency of DSC peak temperature and (b)level of additional polymerization. Aging time is one hour. A gradient of the line in (b) gives an activation energy of 0.38 eV.

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