Abstract

This paper discusses a process for grinding plates with a nonuniformly distributed load over the surface being processed. Calculations are carried out on the basis of which a specified load distribution is ensured. The process is suitable for fabricating plates with rigid allowances on the taper, as well as for high-accuracy correction of the angle at which plates are cut from crystalline materials. Results are presented of the correction of the cutting angle of crystalline elements for precision quartz resonators.

© 2011 OSA

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