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Ion-beam polishing of fused silica substrates for imaging soft x-ray and extreme ultraviolet optics

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Abstract

We have studied the surface treatment of polished fused silica by neutralized Ar ions with energy of 500–1500 eV and incidence angles of 0–90°. We found the following regularities: for samples that passed the standard procedure of deep polishing (initial effective roughness σeff0.5nm), the effective roughness decreases to the ultrasmooth level (i.e., σeff0.25nm in the range of spatial frequencies q[4.9×10263]μm1). The effect begins to be noticeable at the material removal of 150 nm and reaches saturation at depths of removal greater than 1 μm. For supersmooth samples (σeff<0.3nm), the effective roughness keeps the initial level at material removal down to tens of micrometers. The optimal ion energy range is 800–1300 eV (maximum smoothing effect); at higher energy some surface roughness degradation is observed. All the smoothing effects are observed at the incidence angle range θin=035°. Increasing the ion energy above 1300 eV increases the etching rate by up to 4 μm per hour (Jion=0.8mA/cm2), which allows for deep aspherization of sized substrates. The technique allows for manufacturing the optical elements for extreme ultraviolet and soft x-ray wavelength ranges with a numerical aperture of up to 0.6.

© 2016 Optical Society of America

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