Writing process in ablative optical recording

S. Y. Suh; D. A. Snyder; D. L. Anderson

doi:10.1364/AO.24.000868

Applied Optics
Vol. 24,
Issue 6,
pp. 868-874
(1985)
•https://doi.org/10.1364/AO.24.000868

Writing process in ablative optical recording

S. Y. Suh, D. A. Snyder, and D. L. Anderson

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S. Y. Suh, D. A. Snyder, and D. L. Anderson, "Writing process in ablative optical recording," Appl. Opt. 24, 868-874 (1985)

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Abstract

The hole formation mechanism in thin films for optical recording is studied based on the energy balance between the surface tension gradient driven force and various opposing forces. A more rigorous energy calculation using the exact temperature profiles obtained by the numerical solution to the heat equation has shown that the inertial dissipation energy is more important than the viscous energy. This improved calculation correctly predicts the threshold energy dependence on film thickness. This is an important result, since the surface tension gradient driven optical writing model has not been widely accepted due to the controversy in the thickness dependency of the threshold energy. Specifically, the previous model predicted that the thinner the film was, the lower the sensitivity would be, which is an opposite result to the experimental observation. The present work clearly demonstrates that this apparent contradiction is not due to the fundamental shortcomings of the model but to the unacceptable simplification in the previous calculations. The theory for the ablative optical writing mechanism developed in this work is illustrated in detail by using an example of 300-Å Te film on PMMA followed by the application to various materials. The experimental data agree reasonably well within the measurement errors.

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MATERIAL (300 A° FILM ON GLASS)	MELTING ENERGY	EFFICIENCY				MINIMUM REQUIRED ENERGY (nJ)	EXPERIMENTAL VALUE (nJ)	PREDICTED WRITING ENERGY (nJ)

		BEAM PROFILE	REFLECTION LOSS	TRANSMISSION LOSS	THERMAL LOSS

T_c	0.0114	.37	.38	.92	.24	.37	.70	.75
B_i	0.0077	.37	.40	.93	.14	.40	1.1	1.5
G_c	0.0420	.37	.44	.82	.15	2.10	1.4	1.6
I_n	0.0038	.37	.73	.40	.095	.37	2.0	2.2

MATERIALS	HEAT CAPACITY (J/g)		DENSITY (g/cm²)	HEAT CONDUCTIVITY (W/cm K)		LATENT HEAT OF FUSION (J/g)	MELTING POINT (C)
MATERIALS	BEFORE MELTING	AFTER MELTING	DENSITY (g/cm²)	BEFORE MELTING	AFTER MELTING	LATENT HEAT OF FUSION (J/g)	MELTING POINT (C)

T_c	1.5×10⁻¹	2.96×10⁻¹	6.0	1.6×10⁻²		1.4×10⁻²	4.5×10⁻²
G_c	3.4×10⁻¹	4.2×10⁻¹	5.52	1.25×10⁻¹		4.79×10⁻²	9.37×10⁻²
B_i	1.08×10⁻¹	1.52×10⁻¹	10	2.62×10⁻²	4.0×10⁻²	5.28×10⁻¹	2.71×10⁻²
I_n	2.12×10⁻¹	2.74×10⁻¹	7.0	1.0×10⁻¹		2.85×10⁻¹	1.57×10⁻²
PMMA	1.5		1.19	1.5×10⁻²
GLASS	1.41		1.42	1.5×10⁻²

	SURFACE TENSION (dyne/cm)	TEMP. COEFFICIENT OF SURFACE TENSION (dyne/cm°C)	VISCOSITY

			μ_o (10⁻² POISE)	T_c (K)

T^c	1.80×10²	6.0×10⁻²	1.5×10⁻³	4.8×10²
G_c	6.21×10²	2.6×10⁻¹	1.09×10⁻¹	2.31×10²
Bⁱ	3.78×10²	7.0×10⁻²	4.38×10⁻¹	7.3×10²
Iⁿ	5.56×10²	9.0×10⁻²	7.36×10⁻¹	8.0×10²

MATERIAL (300 A° FILM ON GLASS)	MELTING ENERGY	EFFICIENCY				MINIMUM REQUIRED ENERGY (nJ)	EXPERIMENTAL VALUE (nJ)	PREDICTED WRITING ENERGY (nJ)

		BEAM PROFILE	REFLECTION LOSS	TRANSMISSION LOSS	THERMAL LOSS

T_c	0.0114	.37	.38	.92	.24	.37	.70	.75
B_i	0.0077	.37	.40	.93	.14	.40	1.1	1.5
G_c	0.0420	.37	.44	.82	.15	2.10	1.4	1.6
I_n	0.0038	.37	.73	.40	.095	.37	2.0	2.2

MATERIALS	HEAT CAPACITY (J/g)		DENSITY (g/cm²)	HEAT CONDUCTIVITY (W/cm K)		LATENT HEAT OF FUSION (J/g)	MELTING POINT (C)
MATERIALS	BEFORE MELTING	AFTER MELTING	DENSITY (g/cm²)	BEFORE MELTING	AFTER MELTING	LATENT HEAT OF FUSION (J/g)	MELTING POINT (C)

T_c	1.5×10⁻¹	2.96×10⁻¹	6.0	1.6×10⁻²		1.4×10⁻²	4.5×10⁻²
G_c	3.4×10⁻¹	4.2×10⁻¹	5.52	1.25×10⁻¹		4.79×10⁻²	9.37×10⁻²
B_i	1.08×10⁻¹	1.52×10⁻¹	10	2.62×10⁻²	4.0×10⁻²	5.28×10⁻¹	2.71×10⁻²
I_n	2.12×10⁻¹	2.74×10⁻¹	7.0	1.0×10⁻¹		2.85×10⁻¹	1.57×10⁻²
PMMA	1.5		1.19	1.5×10⁻²
GLASS	1.41		1.42	1.5×10⁻²

Abstract

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Applied Optics