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  • Quantum Electronics and Laser Science Conference
  • OSA Technical Digest (Optica Publishing Group, 2001),
  • paper QThF3

Sum Frequency Spectroscopy Studies of Adsorption of Additives on Metal/Electrolyte Interfaces

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Abstract

Copper is rapidly being introduced into chip interconnection technology as a replacement for aluminum.

© 2001 Optical Society of America

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