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  • Conference on Lasers and Electro-Optics/Quantum Electronics and Laser Science Conference and Photonic Applications Systems Technologies
  • Technical Digest (CD) (Optica Publishing Group, 2006),
  • paper PTuB4
  • https://doi.org/10.1364/PHAST.2006.PTuB4

Laser Cleaving Method using Thermal Induced Stress for FPD’s and Wafer Materials

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Abstract

Cleaving of brittle materials is a non-ablating high potential process based on thermal-induced-stress. Amorphous materials such as glass can be separated as well as crystalline structures using near-infrared laser radiation and multiple absorption technology.

© 2006 Optical Society of America

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