Chemically assisted thermally enhanced laser direct write etch technology produces vertically walled 20 µm via structures in semi-insulating substrates at 20 µm/sec drilling speed highly surpassing drilling speed of ICP or DRIE at 0.5-2 µm/min. Diffractive optic focusing excimer-based ablation technology produces 25 µm diameter vias in 50 µm-thick polyimide film at the highest rate known up-to-date of 1500 vias/sec.

© 2004 Optical Society of America

PDF Article