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Conferences > OFT > 2008 > OThC > OThC5
  • Frontiers in Optics 2008/Laser Science XXIV/Plasmonics and Metamaterials/Optical Fabrication and Testing
  • OSA Technical Digest (CD) (Optica Publishing Group, 2008),
  • paper OThC5
  • •https://doi.org/10.1364/OFT.2008.OThC5

Stress and Subsurface Damage in Polycrystalline SiC

J. A. Randi, W. J. Everson, A. Shorey, S. Shafrir, C. Miao, and S. Jacobs

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Abstract

Stress from material removal processes are compared by observation of the Twyman Effect. Stress scales with the abrasive size used during mechanical removal processes, and is reduced or eliminated by subsequent chemical removal processes. Subsurface damage for each surface has also been measured.

© 2008 Optical Society of America

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