Effects of Reflow Soldering Process Conditions on the Reliability of Specialty Optical Fibers

Mei Wen; Ralph J. Lago; Jie Li

doi:10.1364/OFC.2020.W4F.2

Optical Fiber Communication Conference (OFC) 2020
OSA Technical Digest (Optica Publishing Group, 2020),
paper W4F.2
•https://doi.org/10.1364/OFC.2020.W4F.2

Effects of Reflow Soldering Process Conditions on the Reliability of Specialty Optical Fibers

Mei Wen, Ralph J. Lago, and Jie Li

Optical Fiber Communication Conference 2020

San Diego, California United States
8–12 March 2020
ISBN: 978-1-943580-71-2

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Reliability and Test (W4F)

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M. Wen, R. J. Lago, and J. Li, "Effects of Reflow Soldering Process Conditions on the Reliability of Specialty Optical Fibers," in Optical Fiber Communication Conference (OFC) 2020, OSA Technical Digest (Optica Publishing Group, 2020), paper W4F.2.

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Abstract

We will review the reliability of specialty optical fibers for high temperature uses with an emphasis on fibers through reflow soldering process conditions. Coating thermal stability, fiber mechanical properties, and induced optical loss will be discussed.

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