Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group
Conferences > OFC > 2017 > Th5D > Th5D.7

High Density Optical Packaging of High Radix Silicon Photonic Switches

Tae Joon Seok, Victor Kopp, Dan Neugroschl, Johannes Henriksson, Jianheng Luo, and Ming C. Wu

Not Accessible

Your library or personal account may give you access

Abstract

We report on high density optical packaging of high radix (64x64) silicon photonic MEMS switches using pitch-reducing optical fiber array. The footprint of 61-channel optical I/O is as small as 330µm x 280µm.

© 2017 Optical Society of America

PDF Article
More Like This
High-Radix Silicon Photonic Switches

Ming C. Wu and Tae Joon Seok
SW1N.1 CLEO: Science and Innovations (CLEO:S&I) 2017

Fast, High-radix Silicon Photonic Switches

Tao CHU, Lei QIAO, Weijie TANG, Defeng GUO, and Weike WU
Th1J.4 Optical Fiber Communication Conference (OFC) 2018

Silicon Photonic Switch Subsystem with 900 Monolithically Integrated Calibration Photodiodes and 64-Fiber Package

Patrick Dumais, Dominic J. Goodwill, Mohammad Kiaei, Dritan Celo, Jia Jiang, Chunshu Zhang, Fei Zhao, Xin Tu, Chunhui Zhang, Shengyong Yan, Jifang He, Ming Li, Wanyuan Liu, Yuming Wei, Dongyu Geng, Hamid Mehrvar, and Eric Bernier
W4E.4 Optical Fiber Communication Conference (OFC) 2017

View More...
Select as filters
Select Topics Cancel
Top
       
© Copyright 2024 | Optica Publishing Group. All rights reserved, including rights for text and data mining and training of artificial technologies or similar technologies.
Privacy | Terms of Use