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Conferences > OFC > 2015 > W1B > W1B.2

High-Throughput Multiple Dies-to-Wafer (D2W) Bonding for III/V-on-Si Hybrid Lasers

Xianshu Luo, Yulian Cao, Junfeng Song, Xiaonan Hu, Tsung-Yang Liow, Mingbin Yu, Qijie Wang, and Guo-Qiang Lo

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Abstract

We propose and demonstrate high-throughput multiple dies-to-wafer bonding method with up to 104 dies through temporary-bonding dies to handle wafer for batch processing. Various hybrid III/V-on-silicon lasers are demonstrated with CW operation at room temperature.

© 2015 Optical Society of America

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