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Conferences > OFC > 2015 > Tu3I > Tu3I.1

400-Gb/s Operation of Flip-chip Interconnection EADFB Laser Array Module

Shigeru Kanazawa, Takeshi Fujisawa, Kiyoto Takahata, Hiroaki Sanjoh, Ryuzo Iga, Yuta Ueda, Wataru Kobayashi, and Hiroyuki Ishii

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Abstract

The flip-chip interconnection 8-channel EADFB laser array module is developed. The flip-chip interconnection technique provides low crosstalk. After 10-km transmission, clear eye opening is obtained for all eight lanes under 8 x 50-Gb/s simultaneous operation.

© 2015 Optical Society of America

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