Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group

High-Performance Si Photonics Interposer Featuring RF Travelling-wave Electrode (TWE) via Cu-BEOL

Not Accessible

Your library or personal account may give you access

Abstract

A silicon Cu-photonics interposer, consisting of monolithically integrated Si modulators and Ge photodetectors, has been explored for integrated optical communication. Up to 33.7 GHz-bandwidth of this integrated circuit are enabled by travelling-wave electrode via Cu-BEOL.

© 2015 Optical Society of America

PDF Article
More Like This
3D Electro-Optical Integration Based on High-Performance Si Photonics TSV Interposer

Mingbin Yu, Yan Yang, Qing Fang, Xiaoguang Tu, Junfeng Song, King-Jien Chui, Rusli, and Guo-Qiang Lo
Th3J.3 Optical Fiber Communication Conference (OFC) 2016

64 Gb/s silicon QPSK modulator with single-drive push-pull traveling wave electrodes

Haike Zhu, Linjie Zhou, Tao Wang, Lei Liu, Chi Yan Wong, Yanyang Zhou, Jinting Wang, Qianqian Wu, Anbang Xie, Rui Yang, Zuxiang Li, Xinwan Li, and Jianping Chen
SW3N.7 CLEO: Science and Innovations (CLEO:S&I) 2015

Low Switching Voltage InP-Based Travelling Wave Electrode Mach-Zehnder Modulator Monolithically Integrated with DFB-Laser for 60 Gb/s NRZ

S. Lange, R. Kaiser, M. Gruner, M. Hamacher, K.-O. Velthaus, and M. Schell
Th4E.1 Optical Fiber Communication Conference (OFC) 2015

Select as filters


Select Topics Cancel
© Copyright 2024 | Optica Publishing Group. All Rights Reserved