Intel®’s Silicon Photonics on an Advanced Manufacturing Platform

Matthew N Sysak

doi:10.1364/OFC.2015.Th1G.3

Optical Fiber Communication Conference
OSA Technical Digest (online) (Optica Publishing Group, 2015),
paper Th1G.3
•https://doi.org/10.1364/OFC.2015.Th1G.3

Intel®’s Silicon Photonics on an Advanced Manufacturing Platform

Matthew N Sysak

Optical Fiber Communication Conference 2015

Los Angeles, California United States
22–26 March 2015
ISBN: 978-1-55752-937-4

From the session
Optical Transceiver Technologies for Data Com (Th1G)

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M. N. Sysak, "Intel®’s Silicon Photonics on an Advanced Manufacturing Platform," in Optical Fiber Communication Conference, OSA Technical Digest (online) (Optica Publishing Group, 2015), paper Th1G.3.

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Abstract

We discuss Intel®’s Silicon Photonics advanced fabrication advantages, highlighting the transition from 200mm to 300mm manufacturing. We use specific examples of the optical technologies to illustrate the advantages.

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