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An edge-coupling chip-to-chip optical interconnects system

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Abstract

We present an optical chip-to-chip coupling scheme with large misalignment tolerances. The coupling system is based on a multi-material platform with a polymer waveguide for the interconnection between chips. Simulation shows a position tolerance (3 dB coupling efficiency) of up to 1.0 µm when the polymer waveguide diameter equals 6.0 µm. The polymer waveguide can be easily fabricated by using a 3D laser lithography technique. Article not available.

© 2014 Optical Society of America

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