Abstract

We address the effects of packaging on performance, reliability and cost of photonic devices. For silicon photonics we address some specific packaging aspects. Finally we propose an approach for integration of photonics and ASICs.

© 2014 Optical Society of America

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More Like This
8 Tbps Co-Packaged FPGA and Silicon Photonics Optical IO

Kaveh Hosseini, Edwin Kok, Sergey Y. Shumarayev, Chia-Pin Chiu, Arnab Sarkar, Asako Toda, Yanjing Ke, Allen Chan, Daniel Jeong, Mason Zhang, Sangeeta Raman, Thungoc Tran, Kumar Abhishek Singh, Pavan Bhargava, Chong Zhang, Haiwei Lu, Ravi Mahajan, Xiaoqian Li, Nitin Deshpande, Conor O’Keeffe, Uma Krishnamoorthy, Chen Sun, Roy Meade, Vladimir Stojanovic, and Mark Wade
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Th4A.1 Optical Fiber Communication Conference (OFC) 2021

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