Reduction of hybrid silicon laser thermal impedance using Poly Si thermal shunts

Optical Fiber Communication Conference/National Fiber Optic Engineers Conference 2011
OSA Technical Digest (CD) (Optica Publishing Group, 2011),
paper OWZ6
•https://doi.org/10.1364/OFC.2011.OWZ6

Matthew N. Sysak, H. Park, A. W. Fang, Omri Raday, John E. Bowers, and Richard Jones

Optical Fiber Communication Conference 2011

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Abstract

We present a hybrid silicon evanescent laser that uses poly-silicon thermal shunts to reduce the device thermal impedance from 41.5 to 33.5 deg. C/W.

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